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Rev. 00A
07/11/05
ISSI
®
IS43R16800A
EXTENDED MODE REGISTER DEFINITION
Drive Strength
E6 E5 E4 E3 E2 E1 Type
000000 Full Strength
000001 Weak
————— All Other States Reserved
Operating Mode
E13 E12 E11 E10 E9 E8 E7 Mode
0100000Standard Operation
———————All Other States Reserved
DLL
E0 Status
0 Enable
1 Disable
BA1 BA0 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
Address Bus (Ax)
Mode Register (Ex)
EXTENDED MODE REGISTER DEFINITION
The Extended Mode Register is a second register to
enable additional functions of the DDR SDRAM. This
register is loaded as a step in the normal initialization
of the device. The Load Extended Mode Register
command samples the values on inputs A0-A11, BA0
(High) and BA1 (Low) and stores them as register
values E0-E13. The additional functions are DLL
enable/disable and output drive strength. Similarly to
the Load Mode Register, the Load Extended Mode
Register has reserved bit values, a bank idle pre-
requisite, and a tMRD time requirement. The data in
the mode register is retained until it is reloaded or the
device loses its power.
DLL Enable/Disable
When the Load Extended Mode Register command is
issued, DLL should be enabled (E0 = 0). Normal
operation of the device requires this, but DLL can be
disabled for debugging or evaluation, if necessary.
Output Drive Strength
Normal drive strength for the outputs is specified as
SSTL 2. However, there is an option for reduced drive
strength included.
14
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00A
07/11/05
ISSI
®
IS43R16800A
COMMANDS
All commands described in this section should be
issued only when the initialization sequence is
obeyed.
Deselect (DESL)
This feature blocks unwanted commands from being
executed. Chip select (CS) must be taken High to
cause Deselect. Operations that are underway are
not affected.
No Operation (NOP)
NOP is a command that prevents new commands from
being executed. CS must be Low, while RAS, CAS,
and WE must be High to issue NOP. NOP or Deselect
commands must be issued during wait states to allow
operations that are underway to continue uninter-
rupted.
Load Mode Register (MRS)
The Base Mode Register is loaded during a step of
initialization to configure the DDR SDRAM. Load
Mode Register is issued when BA0 and BA1 are Low,
and A0-A11 are selected according to the Mode Register
Definition.
Load Extended Mode Register (EMRS)
The Extended Mode Register is loaded during a step
of initialization to enable the DLL of the device. Load
Extended Mode Register is issued when BA0 is High,
BA1 is Low, and A0-A11 are selected according to the
Extended Mode Register Definition.
Read (READ/READA)
The Read command is used to begin a burst read
access. When the command is given to the device,
the BA0 and BA1 inputs select the bank, and address
bits A0-A8 (x16) select the block of columns and the
starting column for the subsequent burst. The cross-
ing of the CLK and CLK signals will cause the output
values on the I/O pins to be valid. The Auto Pre-
charge function is one option in the Read command. If
the Auto Pre-charge is enabled, the currently selected
row will be pre-charged following the Read burst. If
the function is not enabled, the selected row will
remain open for further accesses at the end of the
Read burst.
Write (WRIT/WRITA)
The Write command is used to begin a burst write
access. When the command is given to the device,
the BA0 and BA1 inputs select the bank, and address
bits A0-A8 (x16) select the block of columns and the
starting column for the subsequent burst. The rising
edge on the Data Strobe input(s) will cause the input
values on the Data Mask pin(s) and I/O pins to be
sampled for the write operation. The Auto Pre-charge
function is one option in the Write command. If the
Auto Pre-charge is enabled, the currently selected row
will be Pre-charged following the Write burst. If the
function is not enabled, the selected row will remain
open for further accesses at the end of the Write
burst.
Pre-charge (PRE/PALL)
A Pre-charge command will de-activate an open row in
a bank. The input A10 (x16) is sampled at this time to
determine whether Pre-charge is applied to a single
bank or all banks. After tRP, the bank has been pre-
charged. It is de-activated, and goes into the idle
state and must be activated before any Read or Write
command can be issued to it. A Pre-charge command
is treated as a NOP if either (a) the specified bank is
already undergoing Pre-charge, or (b) the specified
bank has no open row.
Auto Pre-charge
Auto Pre-charge is a feature that can be enabled as
an option in a Read or Write command. If the input
value on A10 (x16) is High during a Read or Write
command, an automatic Pre-charge will occur just after
the memory burst is completed. If the input value on
A10 (x16) is Low, no Pre-charge will occur. With Auto
Pre-charge, a minimum time of tRP must pass before the
next command is issued to the same bank.
Active (ACT)
The Active command opens a row in preparation for a
Read or Write burst. The row stays open for accesses
until the bank receives a Pre-charge command. Other
rows in the bank cannot be opened until the bank is
de-activated with a Pre-charge command and another
Active command is issued.
Burst Terminate (BST)
The Burst Terminate command truncates the burst of
the most recently issued Read command (with Auto
Pre-charge disabled). The open row being accessed
in the Read burst remains open.
Integrated Silicon Solution, Inc. — 1-800-379-4774
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Rev. 00A
07/11/05
ISSI
®
IS43R16800A
Auto Refresh (REF)
The DDR SDRAM is issued the Auto Refresh com-
mand during normal operation to maintain data in the
memory array. All the banks must be idle for the
command to be executed. The device has 4096
refresh cycles every 64ms.
Self Refresh (SELF)
To issue the Self Refresh command, CKE must be
Low. When the DDR SDRAM is in Self Refresh mode,
it retains the data contents without external clocking,
and ignores other input signals. The DLL is disabled
upon entering the Self Refresh mode, and is enabled
again upon leaving the mode. To exit Self Refresh, all
inputs must be stable prior to CKE going High. Next,
a NOP command command must be issued on each
clock cycle for at least tSNR to ensure that internal refresh
operations are completed. To prepare for a memory
access, the DDR SDRAM must receive a DLL reset
followed by a NOP command for 200 clock cycles.
DEVICE OPERATION
Bank and Row Activation
An Active command must be issued to the DDR
SDRAM to open a bank and row prior to an access.
The row will be available for a Read or Write com-
mand once a time tRCD has occurred. The Active
command is depicted in the figure. As CLK goes
High, CS and RAS are Low, while CKE, WE, and CAS
are High. Upon issuing the Active command, the
values on the address inputs specify the row, and BA0
and BA1 specify the bank. When an Active command
is issued for a bank and row, another row in that same
bank may be activated after a time tRC. When an
Active command is issued for a bank and row, a row in
a different bank may be activated after a time tRRD.
(Note: to ensure that time requirement tRCD, tRC, or
tRRD is met, NOP commands should be issued for a
whole number of clock cycles that is greater than the
time requirement (ie. tRCD) divided by the clock
period.)
Read Operation
A Read command starts a burst from an activated row.
The Read command is depicted in the figure. As CLK
goes High, CS and CAS are Low, while RAS, CKE,
and WE are High. The values on the inputs BA0 and
BA1 specify the bank to access, and the address
inputs specify the starting column in the open row. If
Auto Pre-charge is enabled in the Read command, the
open row will be pre-charged after completion of the Read
burst. Unless stated otherwise, all timing diagrams for
Read operations have disabled Auto Pre-charge.
The Read command causes data to be retrieved and
placed in the pipeline. The subsequent command can
be NOP, Read, or Terminate Burst. The data from the
starting column specified in the Read command
appears on I/O pins following a CAS latency of after
the Read command. On each CLK and CLK crossing,
the data from the next column in the burst sequence is
output from the pipeline until the burst is completed
(see Read Burst, Non-consecutive Read Burst, and
Consecutive Read Burst). There are two cases in
which a full Read burst length is not completed. The
first is when the data retrieved from a subsequent
Read burst interrupts the previous burst (see Random
Read Accesses). The second is when a subsequent
Burst Terminate command truncates the burst (see
Terminating a Read Burst and Read to Write). The
Burst Terminate and Read commands obey the same
CAS latency timing such that they should be issued x
cycles after a previous Read command, where x is the
number of pairs of columns to output. By following a
desired command sequence, continuous data can be
output with either whole Read bursts or truncated
Read bursts. Whenever a Read burst finishes and no
other commands have been initiated, the I/O returns to
High-Z.
If Auto Pre-charge is not enabled in the Read burst,
the Pre-charge command can be issued separately
following the Read command. The Pre-charge com-
mand should be received by the device x cycles after
the Read command, where x is the desired number of
pairs of columns to output during the Read burst.
After the Pre-charge command, it is necessary to wait
until both tRAS and tRP have been met before issuing
a new command to the same bank.
Data Strobe output is driven synchronously with the
output data on the I/O pins. The Low portion of the
Data Strobe just prior to the first output data is the
Read Pre-amble; and the Low portion coinciding with
the last output data is the Read Post-amble. Before
any Write command can be executed, any previous
Read burst must have been completed normally or
truncated by a Burst Terminate command. In the
diagram Read to Write, a Burst Terminate command is
issued to truncate a Read Burst early, and begin a
Write operation. After the Write command, a time
tDQSS is required prior to latching the data on the I/O.

IS43R16800A-5TL-TR

Mfr. #:
Manufacturer:
ISSI
Description:
DRAM 128M 2.5v 8Mx16 400MHz
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