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PCA9654EDTR2G

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
PCA9654E, PCA9654EA
www.onsemi.com
19
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
PCA9654E, PCA9654EA
www.onsemi.com
20
PACKAGE DIMENSIONS
WQFN16, 1.8x2.6, 0.4P
CASE 488AP
ISSUE B
A
b
A3
A1
0.08
C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
DIM MIN MAX
MILLIMETERS
A
1.80 BSC
A1
0.40 BSC
A3
0.70 0.80
b
D
0.30 0.50
E
e
L
L1
0.20 REF
0.00 0.050
PIN 1 REFERENCE
D A
E
B
0.15 C
2X
0.15 C
2X
0.10 C
C
L2
1
4
5
0.05 C
0.10
CAB
16 X
e
L
15 X
0.00 0.15
2.60 BSC
0.15 0.25
MOUNTING FOOTPRINT
8
12
9
16
ǒ
mm
inches
Ǔ
SCALE 20:1
1
0.400
0.0157
0.225
0.0089
0.463
0.0182
0.562
0.0221
2.900
0.1142
1.200
0.0472
2.100
0.0827
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
L2
0.40 0.60
PCA9654E, PCA9654EA
www.onsemi.com
21
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G
ISSUE F
16X
SEATING
PLANE
L
D
E
0.10 C
A
A1
e
D2
E2
b
1
4
8
9
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
B
A
0.10
C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.05 C
0.05 C
(A3)
C
NOTE 4
16X
0.10 C
0.05
C
A B
NOTE 3
K
16X
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL A
DETAIL B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
2X
0.50
PITCH
1.84
3.30
1
DIMENSIONS: MILLIMETERS
0.58
16X
2X
0.30
16X
OUTLINE
PACKAGE
2X
2X
0.10 C A B
e/2
SOLDERING FOOTPRINT*
DIM MIN NOM MAX
MILLIMETERS
A 0.80 0.90 1.00
A1 0.00 0.03 0.05
A3 0.20 REF
b 0.18 0.24 0.30
D 3.00 BSC
D2 1.65 1.75 1.85
E 3.00 BSC
E2 1.65 1.75 1.85
e 0.50 BSC
K 0.18 TYP
L 0.30 0.40 0.50
L1 0.00 0.08 0.15
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22

PCA9654EDTR2G

Mfr. #:
Buy PCA9654EDTR2G
Manufacturer:
ON Semiconductor
Description:
Interface - I/O Expanders 8-BIT I/O EXPANDER FOR I2
Lifecycle:
New from this manufacturer.
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