PCA9654E, PCA9654EA
www.onsemi.com
4
Table 2. MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DD
DC Supply Voltage −0.5 to +7.0 V
V
I/O
Input / Output Pin Voltage −0.5 to +7.0 V
I
I
Input Current $20 mA
I
O
Output Current $50 mA
I
DD
DC Supply Current $100 mA
I
GND
DC Ground Current $200 mA
P
TOT
Total Power Dissipation 400 mW
P
OUT
Power Dissipation per Output 100 mW
T
STG
Storage Temperature Range −65 to +150 °C
T
L
Lead Temperature, 1 mm from Case for 10 Seconds 260 °C
T
J
Junction Temperature Under Bias 150 °C
q
JA
Thermal Resistance SOIC−16 (Note 1)
TSSOP−16
WQFN16
3 x 3 QFN16
4 x 4 QFN16
82
124
79
80
80
°C/W
P
D
Power Dissipation in Still Air at 85°C 190 mW
MSL Moisture Sensitivity Level 1
F
R
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 4000
> 400
N/A
V
I
LATCHUP
Latchup Performance Above V
CC
and Below GND at 125°C (Note 5) $300 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
Table 3. RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
DD
Positive DC Supply Voltage 1.65 5.5 V
V
I/O
Switch Input / Output Voltage 0 5.5 V
T
A
Operating Free−Air Temperature −55 +125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
