1. General description
The SC18IS602B is designed to serve as an interface between a standard I
2
C-bus of a
microcontroller and an SPI bus. This allows the microcontroller to communicate directly
with SPI devices through its I
2
C-bus. The SC18IS602B operates as an I
2
C-bus
slave-transmitter or slave-receiver and an SPI master. The SC18IS602B controls all the
SPI bus-specific sequences, protocol, and timing. The SC18IS602B has its own internal
oscillator, and it supports four SPI chip select outputs that may be configured as GPIO
when not used.
2. Features and benefits
I
2
C-bus slave interface operating up to 400 kHz
SPI master operating up to 1.8 Mbit/s
200-byte data buffer
Up to four slave select outputs
Up to four programmable I/O pins
Operating supply voltage: 2.4 V to 3.6 V
Low power mode
Internal oscillator option
Active LOW interrupt output
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 that exceeds 100 mA
Very small 16-pin TSSOP
3. Applications
Converting I
2
C-bus to SPI
Adding additional SPI bus controllers to an existing system
SC18IS602B
I
2
C-bus to SPI bridge
Rev. 6 — 13 October 2017 Product data sheet
SC18IS602B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 6 — 13 October 2017 2 of 26
NXP Semiconductors
SC18IS602B
I
2
C-bus to SPI bridge
4. Ordering information
4.1 Ordering options
[1] Discontinued 201706009DN with Last Time Buy 12/7/2018 and Last Time Ship 6/6/2019.
[2] NXP plans to supply the /S8 device which is identical to the discontinued device for a minimum of 7 years with an expected
discontinuation in the 2024-2025 timeframe, but in the meantime, Failure Analysis for /S8 devices will consist of Automated Test
Equipment (ATE) and electrical overstress verification along with package and wire bond validation only. Detailed device failure analysis
will not be available; refer to CIN 201708035I
.
[3] The ",128" packing code for tape and reel with pin 1 in Q2 is now "HP".
Table 1. Ordering information
Type number Topside
marking
Package
Name Description Version
SC18IS602BIPW IS602B TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
SC18IS602BIPW/S8 IS602B TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
Table 2. Ordering options
Type number Orderable part number Package Packing method Minimum
order
quantity
Temperature
SC18IS602BIPW SC18IS602BIPW,112
[1]
TSSOP16 STANDARD
MARKING * IC'S
TUBE - DSC BULK
PACK
2400 T
amb
= 40 C to
+85 C
SC18IS602BIPW,128
[1]
TSSOP16 REEL 13" Q4/T2
*STANDARD
MARK SMD
2500 T
amb
= 40 C to
+85 C
SC18IS602BIPW/S8 SC18IS602BIPW/S8HP
[2][3]
TSSOP16 REEL 13" Q4/T2
*STANDARD
MARK SMD
2500 T
amb
= 40 C to
+85 C
SC18IS602B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 6 — 13 October 2017 3 of 26
NXP Semiconductors
SC18IS602B
I
2
C-bus to SPI bridge
5. Block diagram
(1) Unused slave select outputs may be used for GPIO.
Fig 1. Block diagram of SC18IS602B
MOSI
SC18IS602B
002aac443
I
2
C-BUS
INTERRUPT
CONTROL
LOGIC
INT
CONTROL
REGISTER
SCL
RESET
SDA
BUFFER
SPI
MISO
SPICLK
SS0
SS1
SS2
SS3
(1)
INTERNAL
OSCILLATOR

SC18IS602BIPW/S8HP

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
I/O Controller Interface IC I2C-bus to SPI Bridge SC18IS602B
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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