SC18IS602B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product data sheet Rev. 6 — 13 October 2017 15 of 26
NXP Semiconductors
SC18IS602B
I
2
C-bus to SPI bridge
6. Read the 8 bytes from the EEPROM. Note that we are writing a command, even
though we are going to perform a read from the SPI port. The Function ID is again
04h, indicating that we are going to use SS2. The EEPROM requires that you send a
03h for a read, followed by the subaddress you would like to read. We are going to
read back the same data previously written, so this means that the subaddress should
be 0030h. We would like to read back 8 bytes so we can send eight bytes of FFh to
tell the SC18IS602B to send eight more bytes on MOSI. While it is sending these
eight data bytes, it is also reading the MISO pin and saving the data in the buffer.
ST,50,04,03,00,30,FF,FF,FF,FF,FF,FF,FF,FF,SP Read 8 bytes using SS2
7. The interrupt can be cleared, if needed.
ST,50,F1,SP Clear interrupt
8. Read back the data buffer. Note that we will actually need to read back 11 data bytes
since the first three bytes sent on the SPI port were the read code (03h) and the two
subaddress bytes.
ST,50,00,00,00,01,02,03,04,05,06,07,08,SP Read the data buffer
You can see that on the I
2
C-bus the first four bytes do not contain the data from the
SPI bus. The first byte is the SC18IS602B address, followed by three dummy data
bytes. These dummy data bytes correspond to the three bytes sent to the EEPROM
before it actually places data on the bus (command 03h, subaddress 0030h).
9. Limiting values
[1] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
[2] Parameters are valid over the operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[3] Based on package heat transfer, not device power consumption.
Table 12. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1][2]
Symbol Parameter Conditions Min Max Unit
T
amb(bias)
bias ambient temperature operating 55 +125 C
T
stg
storage temperature 65 +150 C
V
n
voltage on any other pin referenced to V
SS
0.5 +5.5 V
I
OH(I/O)
HIGH-level output current per input/output pin - 8 mA
I
OL(I/O)
LOW-level output current per input/output pin - 20 mA
I
I/O(tot)(max)
maximum total I/O current - 120 mA
P
tot
/pack total power dissipation per package
[3]
-1.5W
