TDA9899HN/V2,518 Datasheet TDA9899HN/V2,518, TDA9899HL/V2,118, TDA9899HL/V2,151 | P94-P96

Product data sheet Rev. 03 — 15 January 2008 94 of 103

NXP Semiconductors

TDA9899

Multistandard hybrid IF processing including car mobile

14. Test information

(1) Connect resistor if external reference signal is not used.

(2) Connect resistor if crystal is not used.

(3) Use of crystal is optional.

(4) Application depends on synthesizer frequency; see Table 59.

(5) See Table 56.

Fig 49. Test circuit

008aaa037

22 pF

22 kΩ

(1)

synthesizer

downconverter

loop filter

(4)

100

nF

470 Ω

synthesizer

trap control

loop filter

C

HC

R

LC

C

LC

1.5 nF

4.7 nF

C

AF

470 nF

SIF/DIF

1

48

45

VIF AGC

input 1

42 38

3.3 kΩ

(2)

82 kΩ

39

diversity

output

37

AGC or diversity

sample-and-hold

control switch

44 4347

C

TAG C

100 nF

tuner

AGC

output

51 Ω

2

5

3

1

1 : 1

2

5

4

3

46

C

FREF

100 pF

4 MHz

reference

input

V

P

= 5 V

41 40

analog

ground

4

TDA9899

6

7

8

MPP2

output to

sound BPF

FM input

from sound BPF

AGC input 2 for DIF

(from channel decoder)

BVS

2 V CVBS

output

AUD

ZIF Q or 1st DIF

(b)

(a)

digital LIF or ZIF I or

analog 2nd sound IF

(b)

(a)

9

10

11

12

13 14

221815 16 17

36

35

32

34

33

31

30

29

28

27

26

25

MPP1

+5 V

VIF

loop filter

external

FM input

digital

ground

21

ADRSEL

SDA

TOP potentiometer for

RSSI and positive modulation

only for port

function

22 kΩ

2.7 kΩ

330 Ω

220 nF

19

100 Ω

20 23

SCL

100 Ω

24

4.7 nF

C

de-em

VIF/SIF/DIF

51 Ω

1

1 : 1

2

5

4

3

VIF/SIF/DIF

51 Ω

1

1 : 1

2

5

4

3

470 nF

C

IFAGC

100 nF

C

CTAGC

22 pF

4 MHz

(3)

R

LFSYN2

C

LFSYN2

n.c.

FM PLL

loop filter

(5)

R

s

C

par

C

s

Product data sheet Rev. 03 — 15 January 2008 95 of 103

NXP Semiconductors

TDA9899

Multistandard hybrid IF processing including car mobile

15. Package outline

Fig 50. Package outline SOT313-2 (LQFP48)

UNIT

A

max.

A

1

A

2

A

3

b

p

cE

(1)

eH

E

LL

p

Zywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

mm

1.6

0.20

0.05

1.45

1.35

0.25

0.27

0.17

0.18

0.12

7.1

6.9

0.5

9.15

8.85

0.95

0.55

7

0

o

0.12 0.10.21

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.75

0.45

SOT313-2 MS-026136E05

00-01-19

03-02-25

D

(1) (1)(1)

7.1

6.9

H

D

9.15

8.85

E

Z

0.95

0.55

D

b

p

e

E

B

12

D

H

b

p

E

H

v M

B

D

Z

D

A

Z

E

e

v M

A

1

48

37

36

25

24

13

θ

A

1

A

L

p

detail X

L

(A )

3

A

2

X

y

c

w M

0 2.5 5 mm

scale

pin 1 index

LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm

SOT313-2

Product data sheet Rev. 03 — 15 January 2008 96 of 103

NXP Semiconductors

TDA9899

Multistandard hybrid IF processing including car mobile

Fig 51. Package outline SOT619-1 (HVQFN48)

0.51

A

1

E

h

b

UNIT

ye

0.2

c

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

mm

7.1

6.9

D

h

5.25

4.95

y

1

7.1

6.9

5.25

4.95

e

1

5.5

e

2

5.5

0.30

0.18

0.05

0.00

0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT619-1 MO-220 - - -- - -

0.5

0.3

L

0.1

v

0.05

w

0 2.5 5 mm

scale

SOT619-1

HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;

48 terminals; body 7 x 7 x 0.85 mm

A

(1)

max.

A

1

c

detail X

y

1

C

e

L

E

h

D

h

e

1

b

13 24

48

37

36

25

12

1

X

D

E

C

B

A

e

2

01-08-08

02-10-18

terminal 1

index area

terminal 1

index area

1/2 e

AC

C

B

v

M

w

M

E

(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

D

(1)

TDA9899HN/V2,518

TDA9899HN/V2,518

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