Document Number: 001-89074 Rev. *L Page 22 of 30
Table 19. Spread-Spectrum Specifications
Symbol Description Conditions Min Typ Max Units
F
MOD
Modulation rate 30 – 60 kHz
SSper Spread spectrum amount Tota l % 0.1 – 5.0 %
SSStep Spread spectrum% step – 0.1 – %
Table 20. Output Selection Specifications
Symbol Description Conditions Min Typ Max Units
t
FS
Frequency switching time Frequency switching time for
OUT13,14, 23, 24. Both PLLs are
active (change MUX selection Bit).
– – 500 µs
t
FS
Frequency switching time Frequency switching time for all
outputs, DIVO value change
– – 500 µs
t
FS
Frequency switching time Frequency switching time for all
outputs. PLL value change.
– – 1000 µs
t
FS
Output turn-on time Output turn-on time from FS. PLL is
active, change OE or MUX.
– – 500 µs
t
FS
Output turn-on time Output turn-on time from FS. Resume
PLL from Power Down.
– – 1000 µs
t
OFF
Output turn-off time Output turn-off time from FS. PLL is
active, change OE or MUX.
– – 500 µs
Table 21. NV Memory Specification
Symbol Description Conditions Min Typ Max Units
DRET NV memory data retention 10 – – Years
PROG
CYCLE
Programming cycle Programming cycle for NV memory 100 K – – Cycle
Table 22. Miscellaneous Specifications
Symbol Description Conditions Min Typ Max Units
t
XRES
XRES Low time 10 – – µs
T
PROG
Flash programming temperature 5 – 55 °C
C
INADC
Input capacitance VIN pin – – 10 pF
Note
4. These parameters are guaranteed by design and are not tested.
Table 23. Thermal Resistance
Parameter
[4]
Description Test Conditions 48-pin QFN Unit
θ
JA
Thermal resistance
(junction to ambient)
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
15.64 °C/W
θ
JC
Thermal resistance
(junction to case)
2.21 °C/W
