MC9S08PA4
MC9S08PA4 Data Sheet
Supports: MC9S08PA4(A)
Key features
8-Bit S08 central processor unit (CPU)
Up to 20 MHz bus at 2.7 V to 5.5 V across operating
temperature range
Supporting up to 40 interrupt/reset sources
Supporting up to four-level nested interrupt
On-chip memory
Up to 4 KB flash read/program/erase over full
operating voltage and temperature
Up to 128 byte EEPROM; 2-byte erase sector;
program and erase while executing flash
Up to 512 byte random-access memory (RAM)
Flash and RAM access protection
Power-saving modes
One low-power stop mode; reduced power wait
mode
Peripheral clock enable register can disable clocks to
unused modules, reducing currents; allows clocks to
remain enabled to specific peripherals in stop3 mode
Clocks
Oscillator (XOSC) - loop-controlled Pierce
oscillator; crystal or ceramic resonator range of
31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz
Internal clock source (ICS) - containing a frequency-
locked-loop (FLL) controlled by internal or external
reference; precision trimming of internal reference
allowing 1% deviation across temperature range of 0
°C to 70 °C and 2% deviation across whole
operating temperature range; up to 20 MHz
System protection
Watchdog with independent clock source
Low-voltage detection with reset or interrupt;
selectable trip points
Illegal opcode detection with reset
Illegal address detection with reset
Development support
Single-wire background debug interface
Breakpoint capability to allow three breakpoints
setting during in-circuit debugging
On-chip in-circuit emulator (ICE) debug module
containing two comparators and nine trigger modes
Peripherals
ACMP - one analog comparator with both positive
and negative inputs; separately selectable interrupt
on rising and falling comparator output; filtering
ADC - 8-channel, 12-bit resolution; 2.5 µs
conversion time; data buffers with optional
watermark; automatic compare function; internal
bandgap reference channel; operation in stop mode;
optional hardware trigger
FTM - Three 2-channel flex timer modulators
modules; 16-bit counter; each channel can be
configured for input capture, output compare, edge-
or center-aligned PWM mode
RTC - 16-bit real timer counter (RTC)
SCI - one serial communication interface (SCI/
UART) modules optional 13-bit break; full duplex
non-return to zero (NRZ); LIN extension support
Input/Output
Up to 18 GPIOs including one output-only pin
One 8-bit keyboard interrupt module (KBI)
Two, ultra-high current sink pins supporting 20 mA
source/sink current
Package options
20-pin SOIC
20-pin TSSOP
16-pin TSSOP
8-pin DFN
8-pin SOIC
NXP Semiconductors
Document Number MC9S08PA4
Data Sheet: Technical Data
Rev. 8, 08/2018
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Table of Contents
1 Ordering parts.......................................................................................3
1.1 Determining valid orderable parts............................................... 3
2 Part identification................................................................................. 3
2.1 Description...................................................................................3
2.2 Format..........................................................................................3
2.3 Fields............................................................................................3
2.4 Example....................................................................................... 4
3 Parameter Classification.......................................................................4
4 Ratings..................................................................................................5
4.1 Thermal handling ratings.............................................................5
4.2 Moisture handling ratings............................................................ 5
4.3 ESD handling ratings...................................................................5
4.4 Voltage and current operating ratings..........................................6
5 General................................................................................................. 7
5.1 Nonswitching electrical specifications........................................ 7
5.1.1 DC characteristics.......................................................... 7
5.1.2 Supply current characteristics........................................ 13
5.1.3 EMC performance..........................................................14
5.2 Switching specifications.............................................................. 15
5.2.1 Control timing................................................................15
5.2.2 Debug trace timing specifications..................................16
5.2.3 FTM module timing.......................................................17
5.3 Thermal specifications.................................................................18
5.3.1 Thermal characteristics.................................................. 18
6 Peripheral operating requirements and behaviors................................ 19
6.1 External oscillator (XOSC) and ICS characteristics....................19
6.2 NVM specifications..................................................................... 20
6.3 Analog..........................................................................................22
6.3.1 ADC characteristics....................................................... 22
6.3.2 Analog comparator (ACMP) electricals.........................24
7 Dimensions...........................................................................................25
7.1 Obtaining package dimensions.................................................... 25
8 Pinout................................................................................................... 25
8.1 Signal multiplexing and pin assignments.................................... 25
8.2 Device pin assignment.................................................................26
9 Revision history....................................................................................27
MC9S08PA4 Data Sheet, Rev. 8, 08/2018
2 NXP Semiconductors
Ordering parts
1.1 Determining valid orderable parts
Valid orderable part numbers are provided on the web. To determine the orderable part
numbers for this device, go to nxp.com and perform a part number search for the
following device numbers: PA4.
Part identification
2.1
Description
Part numbers for the chip have fields that identify the specific part. You can use the
values of these fields to determine the specific part you have received.
2.2
Format
Part numbers for this device have the following format:
MC 9 S08 PA AA (V) B CC
2.3
Fields
This table lists the possible values for each field in the part number (not all combinations
are valid):
Field Description Values
MC Qualification status MC = fully qualified, general market flow
9 Memory 9 = flash based
S08 Core S08 = 8-bit CPU
PA Device family PA
AA Approximate flash size in KB 4 = 4 KB
(V) Mask set version (blank) = Any version
1
A = Rev. 2 or later version, this is
recommended for new design
1
Table continues on the next page...
1
2
Ordering parts
MC9S08PA4 Data Sheet, Rev. 8, 08/2018
NXP Semiconductors 3

MC9S08PA4VWJ

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
8-bit Microcontrollers - MCU 8 BIT,low end Core,4k Fl
Lifecycle:
New from this manufacturer.
Delivery:
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