MC9S08PA4VWJ Datasheet MC9S08PA4AVDC, MC9S08PA4VTG, MC9S08PA4AVTGR | P4-P6

Field Description Values

B Operating temperature range (°C) • M = –40 to 125

• V = –40 to 105

CC Package designator • WJ = 20-SOIC

• TJ = 20-TSSOP

• TG = 16-TSSOP

• DC = 8-DFN

• SC = 8-SOIC

1. From June 1, 2017, (blank) and A share the same mask set version.

2.4 Example

This is an example part number:

MC9S08PA4AVWJ

Parameter Classification

The electrical parameters shown in this supplement are guaranteed by various methods.

To give the customer a better understanding, the following classification is used and the

parameters are tagged accordingly in the tables where appropriate:

Table 1. Parameter Classifications

P Those parameters are guaranteed during production testing on each individual device.

C Those parameters are achieved by the design characterization by measuring a statistically relevant sample size

across process variations.

T Those parameters are achieved by design characterization on a small sample size from typical devices under

typical conditions unless otherwise noted. All values shown in the typical column are within this category.

D Those parameters are derived mainly from simulations.

NOTE

The classification is shown in the column labeled “C” in the

parameter tables where appropriate.

Parameter Classification

MC9S08PA4 Data Sheet, Rev. 8, 08/2018

4 NXP Semiconductors

Ratings

4.1 Thermal handling ratings

Symbol Description Min. Max. Unit Notes

STG

Storage temperature –55 150 °C 1

SDR

Solder temperature, lead-free — 260 °C 2

1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.

2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

4.2 Moisture handling ratings

Symbol Description Min. Max. Unit Notes

MSL Moisture sensitivity level — 3 — 1

1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices.

4.3 ESD handling ratings

Symbol Description Min. Max. Unit Notes

HBM

Electrostatic discharge voltage, human body model -6000 +6000 V 1

CDM

Electrostatic discharge voltage, charged-device model -500 +500 V 2

LAT

Latch-up current at ambient temperature of 125°C -100 +100 mA 3

1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM).

2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for

Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.

3. Determined according to JEDEC Standard JESD78D, IC Latch-up Test.

• Test was performed at 125 °C case temperature (Class II).

• I/O pins pass +100/-100 mA I-test with I

current limit at 200 mA.

• I/O pins pass +20/-100 mA I-test with I

current limit at 1000mA.

• Supply groups pass 1.5 Vccmax.

• RESET pin was only tested with negative I-test due to product conditioning requirement.

Ratings

MC9S08PA4 Data Sheet, Rev. 8, 08/2018

NXP Semiconductors 5

4.4 Voltage and current operating ratings

Absolute maximum ratings are stress ratings only, and functional operation at the

maxima is not guaranteed. Stress beyond the limits specified in below table may affect

device reliability or cause permanent damage to the device. For functional operating

conditions, refer to the remaining tables in this document.

This device contains circuitry protecting against damage due to high static voltage or

electrical fields; however, it is advised that normal precautions be taken to avoid

application of any voltages higher than maximum-rated voltages to this high-impedance

circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate

logic voltage level (for instance, either V

or V

) or the programmable pullup resistor

associated with the pin is enabled.

Symbol Description Min. Max. Unit

Supply voltage –0.3 6.0 V

Maximum current into V

— 120 mA

DIO

Digital input voltage (except RESET, EXTAL, XTAL, or true

open drain pin PTB0)

–0.3 V

+ 0.3 V

Digital input voltage (true open drain pin PTB0) -0.3 6 V

AIO

Analog

, RESET, EXTAL, and XTAL input voltage –0.3 V

+ 0.3 V

Instantaneous maximum current single pin limit (applies to all

port pins)

–25 25 mA

DDA

Analog supply voltage V

– 0.3 V

+ 0.3 V

1. All digital I/O pins, except open-drain pin PTB0, are internally clamped to V

and V

. PTB0 is only clamped to V

Ratings

MC9S08PA4 Data Sheet, Rev. 8, 08/2018

6 NXP Semiconductors

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P21 P22-P24 P25-P27 P28-P29

MC9S08PA4VWJ

Mfr. #:

Buy MC9S08PA4VWJ

Manufacturer:

NXP / Freescale

Description:

8-bit Microcontrollers - MCU 8 BIT,low end Core,4k Fl

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MC9S08PA4VWJ

MC9S08PA4VWJ

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