Table 6. Control timing (continued)
Num C Rating Symbol Min Typical
1
Max Unit
C Port rise and fall time -
high drive strength (load =
50 pF)
5
t
Rise
5.4 ns
C t
Fall
4.6 ns
1. Typical values are based on characterization data at V
DD
= 5.0 V, 25 °C unless otherwise stated.
2. This is the shortest pulse that is guaranteed to be recognized as a reset pin request.
3. To enter BDM mode following a POR, BKGD/MS must be held low during the powerup and for a hold time of t
MSH
after
V
DD
rises above V
LVD
.
4. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized.
5. Timing is shown with respect to 20% V
DD
and 80% V
DD
levels in operating temperature range.
t
extrst
RESET PIN
Figure 9. Reset timing
t
IHIL
KBIPx
t
ILIH
IRQ/KBIPx
Figure 10. IRQ/KBIPx timing
5.2.2
Debug trace timing specifications
Table 7. Debug trace operating behaviors
Symbol Description Min. Max. Unit
t
cyc
Clock period Frequency dependent MHz
t
wl
Low pulse width 2 ns
t
wh
High pulse width 2 ns
t
r
Clock and data rise time 3 ns
t
f
Clock and data fall time 3 ns
t
s
Data setup 3 ns
t
h
Data hold 2 ns
Switching specifications
MC9S08PA4 Data Sheet, Rev. 8, 08/2018
16 NXP Semiconductors
TRACECLK
T
r
T
wh
T
f
T
cyc
T
wl
Figure 11. TRACE_CLKOUT specifications
Th
Ts Ts
Th
TRACE_CLKOUT
TRACE_D[3:0]
Figure 12. Trace data specifications
5.2.3 FTM module timing
Synchronizer circuits determine the shortest input pulses that can be recognized or the
fastest clock that can be used as the optional external source to the timer counter. These
synchronizers operate from the current bus rate clock.
Table 8. FTM input timing
No. C Function Symbol Min Max Unit
1 D External clock
frequency
f
TCLK
0 f
Bus
/4 Hz
2 D External clock
period
t
TCLK
4 t
cyc
3 D External clock
high time
t
clkh
1.5 t
cyc
4 D External clock
low time
t
clkl
1.5 t
cyc
5 D Input capture
pulse width
t
ICPW
1.5 t
cyc
t
TCLK
t
clkh
t
clkl
TCLK
Figure 13. Timer external clock
Switching specifications
MC9S08PA4 Data Sheet, Rev. 8, 08/2018
NXP Semiconductors 17
t
ICPW
FTMCHn
t
ICPW
FTMCHn
Figure 14. Timer input capture pulse
Thermal specifications
5.3.1 Thermal characteristics
This section provides information about operating temperature range, power dissipation,
and package thermal resistance. Power dissipation on I/O pins is usually small compared
to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-
determined rather than being controlled by the MCU design. To take P
I/O
into account in
power calculations, determine the difference between actual pin voltage and V
SS
or V
DD
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin
current (heavy loads), the difference between pin voltage and V
SS
or V
DD
will be very
small.
Table 9. Thermal characteristics
Rating Symbol Value Unit
Operating temperature
range (packaged)
T
A
1
T
L
to T
H
-40 to 125 for MC9S08PA4Mxx parts
-40 to 105 for MC9S08PA4Vxx parts
°C
Junction temperature
range
T
J
-40 to 150 °C
Thermal resistance single-layer board
20-pin SOIC R
θJA
82 °C/W
20-pin TSSOP R
θJA
115 °C/W
16-pin TSSOP R
θJA
130 °C/W
8-pin DFN R
θJA
170 °C/W
8-pin SOIC R
θJA
150 °C/W
Thermal resistance four-layer board
20-pin SOIC R
θJA
54 °C/W
20-pin TSSOP R
θJA
76 °C/W
16-pin TSSOP R
θJA
87 °C/W
8-pin DFN R
θJA
43 °C/W
8-pin SOIC R
θJA
87 °C/W
5.3
Thermal specifications
MC9S08PA4 Data Sheet, Rev. 8, 08/2018
18 NXP Semiconductors

MC9S08PA4VWJ

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
8-bit Microcontrollers - MCU 8 BIT,low end Core,4k Fl
Lifecycle:
New from this manufacturer.
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