Rev. 1.6 41
Si8650/51/52/55
DOCUMENT CHANGE LIST
Revision 0.1 to Revision 0.2
Deleted sections 4.3.4 and 4.3.5.
Updated "6. Ordering Guide" on page 28.
Updated Table 14, “Ordering Guide for Valid OPNs
1
,
2
,”
on page 28.
Added "3.4. Fail-Safe Operating Mode" on page 23.
Revision 0.2 to Revision 1.0
Added chip graphics on page 1.
Moved Tables 1 and 11 to page 17.
Updated Table 6, “Insulation and Safety-Related
Specifications,” on page 14.
Updated Table 8, “IEC 60747-5-2 Insulation
Characteristics for Si86xxxx*,” on page 15.
Moved Table 12 to page 20.
Moved Table 13 to page 21.
Moved “Typical Performance Characteristics” to
page 24.
Updated "4. Pin Descriptions (Si8650/51/52)" on
page 26.
Updated "5. Pin Descriptions (Si8655)" on page 27.
Updated "6. Ordering Guide" on page 28.
Revision 1.0 to Revision 1.1
Reordered spec tables to conform to new
convention.
Removed “pending” throughout document.
Revision 1.1 to Revision 1.2
Updated High Level Output Voltage VOH to 3.1 V in
Table 3, “Electrical Characteristics,” on page 8.
Updated High Level Output Voltage VOH to 2.3 V in
Table 4, “Electrical Characteristics,” on page 11.
Revision 1.2 to Revision 1.3
Added Output Current Drive Channel specification
for Si865xxA-x-xx devices.
Added Latchup Immunity specification.
Revision 1.3 to Revision 1.4
Updated Table 14, “Ordering Guide for Valid
OPNs
1
,
2
,” on page 28.
Updated Note 1 with MSL2A.
Revision 1.4 to Revision 1.5
Updated "6. Ordering Guide" on page 28 to include
MSL2A.
Updated Table 14, “Ordering Guide for Valid
OPNs
1
,
2
,” on page 28.
Revision 1.5 to Revision 1.6
Updated Table 11 on page 17.
Added junction temperature spec.
Updated "3.3.1. Supply Bypass" on page 23.
Removed “3.3.2. Pin Connections” on page 23.
Updated "4. Pin Descriptions (Si8650/51/52)" on
page 26.
Updated table notes.
Updated "6. Ordering Guide" on page 28.
Removed Rev A devices.
Updated "7. Package Outline: 16-Pin Wide Body
SOIC" on page 29.
Updated Top Marks.
Added revision description.