SAA7102_SAA7103_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 18 January 2006 76 of 84
Philips Semiconductors
SAA7102; SAA7103
Digital video encoder
Place the analog coupling (clamp) capacitors close to the analog input pins. Place the
analog termination resistors close to the coupling capacitors.
Be careful of hidden layout capacitors around the crystal application.
Use serial resistors in clock, sync and data lines, to avoid clock or data reflection effects
and to soften data energy.
13. Test information
13.1 Boundary scan test
The SAA7102; SAA7103 has built-in logic and 5 dedicated pins to support boundary scan
testing which allows board testing without special hardware (nails). The SAA7102;
SAA7103 follows the “IEEE Std. 1149.1 - Standard Test Access Port and Boundary-Scan
Architecture” set by the Joint Test Action Group (JTAG) chaired by Philips.
The 5 special pins are Test Mode Select (TMS), Test Clock (TCK), Test Reset (TRST),
Test Data Input (TDI) and Test Data Output (TDO).
The Boundary Scan Test (BST) functions BYPASS, EXTEST, SAMPLE, CLAMP and
IDCODE are all supported; see Table 112. Details about the JTAG BST-TEST can be
found in the specification “IEEE Std. 1149.1”. A file containing the detailed Boundary Scan
Description Language (BSDL) of the SAA7102; SAA7103 is available on request.
13.1.1 Initialization of boundary scan circuit
The Test Access Port (TAP) controller of an IC should be in the reset state
(TEST_LOGIC_RESET) when the IC is in functional mode. This reset state also forces
the instruction register into a functional instruction such as IDCODE or BYPASS.
To solve the power-up reset, the standard specifies that the TAP controller will be forced
asynchronously to the TEST_LOGIC_RESET state by setting the TRST pin LOW.
Table 112: BST instructions supported by the SAA7102; SAA7103
Instruction Description
BYPASS This mandatory instruction provides a minimum length serial path (1 bit)
between TDI and TDO when no test operation of the component is required.
EXTEST This mandatory instruction allows testing of off-chip circuitry and board level
interconnections.
SAMPLE This mandatory instruction can be used to take a sample of the inputs during
normal operation of the component. It can also be used to preload data values
into the latched outputs of the boundary scan register.
CLAMP This optional instruction is useful for testing when not all ICs have BST. This
instruction addresses the bypass register while the boundary scan register is
in external test mode.
IDCODE This optional instruction will provide information on the components
manufacturer, part number and version number.
SAA7102_SAA7103_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 18 January 2006 77 of 84
Philips Semiconductors
SAA7102; SAA7103
Digital video encoder
13.1.2 Device identification codes
A device identification register is specified in “IEEE Std. 1149.1b-1994”. It is a 32-bit
register which contains fields for the specification of the IC manufacturer, the IC part
number and the IC version number. Its biggest advantage is the possibility to check for the
correct ICs mounted after production and to determine the version number of the ICs
during field service.
When the IDCODE instruction is loaded into the BST instruction register, the identification
register will be connected between pins TDI and TDO of the IC. The identification register
will load a component specific code during the CAPTURE_DATA_REGISTER state of the
TAP controller, this code can subsequently be shifted out. At board level this code can be
used to verify component manufacturer, type and version number. The device
identification register contains 32 bits, numbered 31 to 0, where bit 31 is the most
significant bit (nearest to TDI) and bit 0 is the least significant bit (nearest to TDO);
see Figure 18.
a. SAA7102.
b. SAA7103.
Fig 18. 32 bits of identification code
000 0001 01010111 0001 0000 0010
0010
4-bit
version
code
16-bit part number 11-bit manufacturer
identification
TDI TDO
mhb909
31
MSB LSB
28 27 12 11 1 0
1
000 0001 01010111 0001 0000 0011
0010
4-bit
version
code
16-bit part number 11-bit manufacturer
identification
TDI TDO
mhb910
31
MSB LSB
28 27 12 11 1 0
1
SAA7102_SAA7103_4 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 04 — 18 January 2006 78 of 84
Philips Semiconductors
SAA7102; SAA7103
Digital video encoder
14. Package outline
Fig 19. Package outline SOT700-1 (LBGA156)
1
A
1
bA
2
UNIT
D
ye
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
01-05-11
01-11-06
IEC JEDEC JEITA
mm
1.65
0.45
0.35
1.20
0.95
15.2
14.8
y
1
15.2
14.8
e
1
13
e
2
13
0.55
0.45
0.12 0.35
DIMENSIONS (mm are the original dimensions)
SOT700-1 MO-192 - - -- - -
E
0.25
v
0.1
w
0
5 10 mm
scale
SOT700-1
LBGA156: plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm
A
max.
A
A
2
A
1
detail X
y
y
1
C
X
D
E
C
B
A
A
B
C
D
E
F
H
K
G
J
L
M
N
P
2468101214
1 3 5 7 9 11 13
ball A1
index area
ball A1
index area
e
e
e
1
b
e
2
1/2 e
1/2 e
AC
C
B
v
M
w
M

SAA7103H/V4,518

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC DIGITAL VIDEO ENCODER 44QFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union