16©2018 Integrated Device Technology, Inc. March 15, 2018
5P49V6965 Datasheet
Internal Crystal Oscillator (XIN/REF)
Choosing Crystals
A crystal manufacturer will calibrate its crystals to the nominal
frequency with a certain load capacitance value. When the
oscillator load capacitance matches the crystal load capacitance,
the oscillation frequency will be accurate. When the oscillator load
capacitance is lower than the crystal load capacitance, the
oscillation frequency will be higher than nominal and vice versa so
for an accurate oscillation frequency you need to make sure to
match the oscillator load capacitance with the crystal load
capacitance.
Tuning the Crystal Load Capacitor
Cs1 and Cs2 are stray capacitances at each crystal pin and
typical values are between 1pF and 3pF.
Ce1 and Ce2 are additional external capacitors, increasing the
load capacitance reduces the oscillator gain so please consult the
factory when adding Ce1 and/or Ce2 to avoid crystal startup
issues. Ci1 and Ci2 are integrated programmable load capacitors,
one at XIN and one at XOUT. Ci1 and Ci2.
The value of each capacitor is composed of a fixed capacitance
amount plus a variable capacitance amount set with the XTAL[5:0]
register.
Ci1 and Ci2 are commonly programmed to be the same value.
Adjustment of the crystal tuning capacitors allows maximum
flexibility to accommodate crystals from various manufacturers.
The range of tuning capacitor values available are in accordance
with the following table.
Ci1/Ci2 starts at 9pF with setting 000000b and can be increased
up to 25pF with setting 111111b. The step per bit is 0.5pF.
You can write the following equation for this capacitance:
Ci = 9pF + 0.5pF × XTAL[5:0]
C
XIN
= Ci1 + Cs1 + Ce1
C
XOUT
= Ci2 + Cs2 + Ce2
The final load capacitance of the crystal:
C
L
= C
XIN
× C
XOUT
/ (C
XIN
+ C
XOUT
)
It is recommended to set the same value for capacitors the same
at each crystal pin, meaning:
C
XIN
= C
XOUT
Example 1: The crystal load capacitance is specified as 8pF and
the stray capacitance at each crystal pin is Cs = 1.5pF. Assuming
equal capacitance value at XIN and XOUT, the equation is as
follows:
8pF = (9pF + 0.5pF × XTAL[5:0] + 1.5pF) / 2
So, XTAL[5:0] = 11 (decimal).
Example 2: The crystal load capacitance is specified as 12pF and
the stray capacitance Cs is unknown. Footprints for external
capacitors Ce are added and a worst case Cs of 5pF is used. For
now we use Cs + Ce = 5pF and the right value for Ce can be
determined later to make 5pF together with Cs.
12pF = (9pF + 0.5pF × XTAL[5:0] + 5pF) / 2
So, XTAL[5:0] = 20 (decimal).
Table 20. XTAL[5:0] Tuning Capacitor
Parameter Bits Step (pF) Minimum (pF) Maximum (pF)
XTAL 6 0.5 9 25
Table 21. Recommended Crystal Characteristics
Parameter Minimum Typical Maximum Units
Mode of Oscillation Fundamental
Frequency 8 25 40 MHz
Equivalent Series Resistance (ESR) 10 100
Shunt Capacitance 7pF
Load Capacitance (C
L
) at < = 25MHz 6 8 12 pF
Load Capacitance (C
L
) > 25MHz to 40MHz 6 8 pF
Maximum Crystal Drive Level 100 μW
17©2018 Integrated Device Technology, Inc. March 15, 2018
5P49V6965 Datasheet
Programmable Loop Filter
Fractional Output Dividers (FOD)
The device has 4 fractional output dividers (FOD). Each of the
FODs are comprised of a 12-bit integer counter, and a 24-bit
fractional counter. The output divider can operate in integer divide
only mode for improved performance, or utilize the fractional
counters to generate a clock frequency accurate to 50ppb.
FOD has the following features:
Individual Spread Spectrum Modulation
The output clock frequencies can be modulated to spread energy
across a broader range of frequencies, lowering system EMI.
Each divider has individual spread ability. Spread modulation
independent of output frequency, a triangle wave modulation
between 30 and 63kHz.
Spread spectrum can be applied to any output clock, any clock
frequency, and any spread amount from ±0.25% to ±2.5%
center-spread and -0.5% to -5% down-spread.
Bypass Mode
Bypass mode (divide by 1) to allow the output to behave as a
buffered copy from the input or another FOD.
Cascaded Mode
As shown in the block diagram, FODs can be cascaded for lower
output frequency.
For example, user currently has OUT1 running at 12.288MHz and
needs another 48kHz output. The user can cascade FOD2 by
taking input from OUT1, with a divide ratio of 256. In this way,
OUT 2 is running at 48kHz while in alignment with 12.288MHz on
OUT1.
Dividers Alignment
Each output divider block has a synchronizing pulse to provide
startup alignment between outputs dividers. This allows alignment
of outputs for low skew performance.
When device is at hardware select mode outputs will be
automatically aligned at POR. The same synchronization reset is
also triggered when switching between configurations with the
SEL0/1 pins. This ensures that the outputs remain aligned in
every configuration.
When using software mode I
2
C to reprogram an output divider
during operation, alignment can be lost. Alignment can be
restored by manually triggering the reset through I
2
C.
The outputs are aligned on the falling edges of each output by
default. Rising edge alignment can also be achieved by utilizing
the programmable skew feature to delay the faster clock by 180
degrees. The programmable skew feature also allows for fine
tuning of the alignment.
Programmable Skew
The device has the ability to skew outputs by quadrature values.
The skew on each output can be adjusted from 0 to 360 degrees.
Skew is adjusted in units equal to 1/32 of the VCO period. So, for
100MHz output and a 2800MHz VCO, you can select how many
11.161ps units you want added to your skew (resulting in units of
0.402 degrees). For example, 0, 0.402, 0.804, 1.206, 1.408, and
so on. The granularity of the skew adjustment is always
dependent on the VCO period and the output period.
Output Drivers
The device output drivers support the following features
individually:
2.5V or 3.3V voltage level for HCSL/LVPECL operation
1.8V, 2.5V or 3.3V voltage levels for CMOS/LVDS operation
CMOS supports 4 operating modes:
CMOSD: OUTx and OUTxB 180 degrees out of phase
CMOSX2: OUTx and OUTxB phase-aligned
CMOS1: only OUTx pin is on
CMOS2: only OUTxB pin is on
When a given output is configured to at CMOSD or CMOSX2, then
all previously described configuration and control apply equally to
both pins.
Independent output enable/disabled by register bits. When
disabled, an output can be either in a logic 1 state or Hi-Z.
The following options are used to disable outputs:
1. Output turned off by I
2
C.
2. Output turned off by SD/OE pin.
3. Output unused, which means is turned off regardless of OE pin
status.
Table 22. Loop Filter
The device PLL loop bandwidth range depends on the input
reference frequency (Fref).
Input Reference
Frequency (MHz)
Loop Bandwidth
Minimum (kHz)
Loop Bandwidth
Maximum (kHz)
140126
350 300 1000
18©2018 Integrated Device Technology, Inc. March 15, 2018
5P49V6965 Datasheet
SD/OE Pin Function
SD/OE pin can be programmed as following functions:
1. OE output enable (low active).
2. OE output enable (high active).
3. Global shutdown (low active).
4. Global shutdown (high active).
Output behavior when disabled is also programmable. User will
have the option to choose output driver behavior when it's off:
1. OUTx pin high, OUTxB pin low. (Controlled by SD/OE pin).
2. OUTx/OUTxB Hi-Z (Controlled by SD/OE pin).
3. OUTx pin high, OUTxB pin low. (Configured through I
2
C).
4. OUTx/OUTxB Hi-Z (Configured by I
2
C).
The user has the option to disable the output with either I
2
C or
SD/OE pin. Refer to VersaClock 6E Family Register Descriptions
and Programming Guide for details.
I
2
C Operation
The device acts as a slave device on the I
2
C bus using one of the
two I
2
C addresses (0xD0 or 0xD4) to allow multiple devices to be
used in the system. The interface accepts byte-oriented block
write and block read operations.
Address bytes(2 bytes) specify the register address of the byte
position of the first register to write or read.
Data bytes (registers) are accessed in sequential order from the
lowest to the highest byte (most significant bit first).
Read and write block transfers can be stopped after any complete
byte transfer. During a write operation, data will not be moved into
the registers until the STOP bit is received, at which point, all data
received in the block write will be written simultaneously.
For full electrical I
2
C compliance, use external pull-up resistors for
SDATA and SCLK.
Figure 8. I
2
C R/W Sequence

5P49V6965A000NLGI

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