MC13202/203 Technical Data, Rev. 1.1
Freescale Semiconductor 7
Figure 5. Reported Power Level Versus Input Power for Energy Detect or Link Quality Indicator
4.3 Transmit Path Description
For the transmit path, the TX data that was previously stored in RAM is retrieved (packet mode) or the TX
data is clocked in via the SPI (stream mode), formed into packets per the 802.15.4 PHY, spread, and then
up-converted to the transmit frequency.
If the MC13202/MC13203 is in packet mode, data is processed as an entire packet. The data are first
loaded into the TX buffer. The MCU then requests that the MC13202/MC13203 transmit the data. The
MCU is notified via an interrupt when the whole packet has successfully been transmitted.
In streaming mode, the data is fed to the MC13202/MC13203 on a word-by-word basis with an interrupt
serving as a notification that the MC13202/MC13203 is ready for more data. This continues until the
whole packet is transmitted.
-85
-75
-65
-55
-45
-35
-25
-15
-85 -75 -65 -55 -45 -35 -25 -15
Input Power Level (dBm)
Reported Power Level (dBm)
802.15.4 Accuracy
and Range Requirements
MC13202/203 Technical Data, Rev. 1.1
8 Freescale Semiconductor
5 Electrical Characteristics
5.1 Maximum Ratings
5.2 Recommended Operating Conditions
Table 1. Maximum Ratings
Rating Symbol Value Unit
Power Supply Voltage V
BATT,
V
DDINT
-0.3 to 3.6 Vdc
Digital Input Voltage Vin -0.3 to (V
DDINT
+ 0.3)
RF Input Power P
max
10 dBm
Junction Temperature T
J
125 °C
Storage Temperature Range T
stg
-55 to 125 °C
Note: Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics
or Recommended Operating Conditions tables.
Note: Meets Human Body Model (HBM) = 2 kV. RF input/output pins have no ESD protection.
Table 2. Recommended Operating Conditions
Characteristic Symbol Min Typ Max Unit
Power Supply Voltage (V
BATT
= V
DDINT
)
1
1
If the supply voltage is produced by a switching DC-DC converter, ripple should be less than 100 mV peak-to-peak.
V
BATT,
V
DDINT
2.0 2.7 3.4 Vdc
Input Frequency f
in
2.405 - 2.480 GHz
Ambient Temperature Range T
A
-40 25 85 °C
Logic Input Voltage Low V
IL
0-30%
V
DDINT
V
Logic Input Voltage High V
IH
70%
V
DDINT
-V
DDINT
V
SPI Clock Rate f
SPI
--8.0MHz
RF Input Power P
max
--10dBm
Crystal Reference Oscillator Frequency (±40 ppm over
operating conditions to meet the 802.15.4 Standard.)
f
ref
16 MHz Only
MC13202/203 Technical Data, Rev. 1.1
Freescale Semiconductor 9
5.3 DC Electrical Characteristics
Table 3. DC Electrical Characteristics
(V
BATT
, V
DDINT
= 2.7 V, T
A
= 25 °C, unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Power Supply Current (V
BATT
+ V
DDINT
)
Off
1
Hibernate
1
Doze (No CLKO)
1 2
Idle
Transmit Mode (0 dBm nominal output power)
Receive Mode
1
To attain specified low power current, all GPIO and other digital IO must be handled properly. See Section 8.3, “Low
Power Considerations”.
2
CLKO frequency at default value of 32.786 kHz.
I
leakage
I
CCH
I
CCD
I
CCI
I
CCT
I
CCR
-
-
-
-
-
-
0.2
1.0
35
500
30
37
1.0
6.0
102
800
35
42
µA
µA
µA
µA
mA
mA
Input Current (V
IN
= 0 V or V
DDINT
) (All digital inputs) I
IN
--±1µA
Input Low Voltage (All digital inputs) V
IL
0-30%
V
DDINT
V
Input High Voltage (all digital inputs) V
IH
70%
V
DDINT
-V
DDINT
V
Output High Voltage (I
OH
= -1 mA) (All digital outputs) V
OH
80%
V
DDINT
-V
DDINT
V
Output Low Voltage (I
OL
= 1 mA) (All digital outputs) V
OL
0-20%
V
DDINT
V

MC13203FCR2

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC RF TXRX 802.15.4 32VFQFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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