OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

SST39VF3201C-70-4I-B3KE

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37
©2014 Silicon Storage Technology, Inc. DS20005020B 07/14
34
32 Mbit Multi-Purpose Flash Plus
SST39VF3201C / SST39VF3202C
Data Sheet
Product Ordering Information
Valid Combinations for SST39VF3201C
Valid Combinations for SST39VF3202C
Note:Valid combinations are those products in mass production or will be in mass production. Consult your Micro-
chip sales representative to confirm availability of valid combinations and to determine availability of new
combinations.
SST39VF3201C-70-4I-EKE SST39VF3201C-70-4I-B3KE
SST39VF3201C-70-4C-EKE SST39VF3201C-70-4C-B3KE
SST39VF3202C-70-4I-EKE SST39VF3202C-70-4I-B3KE
SST39VF3202C-70-4C-EKE SST39VF3202C-70-4C-B3KE
SST 39 VF 3201C - 70 - 4I - EKE
XX XX
XXXXX
- XX - XX
-
XXX
Environmental Attribute
E
1
= non-Pb
Package Modifier
K = 48 balls or leads
Package Type
E = TSOP (type1, die up, 12mm x
20mm)
B3 = TFBGA (6mm x 8mm, 0.8mm
pitch)
Temperature Range
C = Commercial = 0°C to +70°C
I = Industrial = -40°C to +85°C
Minimum Endurance
4 = 10,000 cycles
Read Access Speed
70 = 70 ns
Hardware Block Protection
1 = Bottom Boot-Block
2 = Top Boot-Block
Device Density
320= 32Mbit
Voltage
V = 2.7-3.6V
Product Series
39 = Multi-Purpose Flash Plus
1. Environmental suffix “E” denotes non-Pb solder.
non-Pb solder devices are “RoHS Compliant”.
©2014 Silicon Storage Technology, Inc. DS20005020B 07/14
35
32 Mbit Multi-Purpose Flash Plus
SST39VF3201C / SST39VF3202C
Data Sheet
Packaging Diagrams
Figure 26: 48-lead Thin Small Outline Package (TSOP) 12mm x 20mm,
Package Code: EK
1.05
0.95
0.70
0.50
18.50
18.30
20.20
19.80
0.70
0.50
12.20
11.80
0.27
0.17
0.15
0.05
48-tsop-EK-8
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
1.20
max.
1mm
0°- 5°
DETAIL
Pin # 1 Identifier
0.50
BSC
©2014 Silicon Storage Technology, Inc. DS20005020B 07/14
36
32 Mbit Multi-Purpose Flash Plus
SST39VF3201C / SST39VF3202C
Data Sheet
Figure 27: 48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm,
Package Code: B3K
A1 CORNER
H G F E D C B A
A B C D E F G H
BOTTOM VIEWTOP VIEW
SIDE VIEW
6
5
4
3
2
1
6
5
4
3
2
1
SEATING PLANE
0.35 ± 0.05
1.10 ± 0.10
0.12
6.00 ± 0.10
0.45 ± 0.05
(48X)
A1 CORNER
8.00 ± 0.10
0.80
4.00
0.80
5.60
48-tfbga-B3K-6x8-450mic-5
Note: 1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
1mm
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37

SST39VF3201C-70-4I-B3KE

Mfr. #:
Buy SST39VF3201C-70-4I-B3KE
Manufacturer:
Microchip Technology
Description:
NOR Flash 2.7V to 3.6V 32Mbit Multi-Prps Fl
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet