©2014 Silicon Storage Technology, Inc. DS20005020B 07/14
7
32 Mbit Multi-Purpose Flash Plus
SST39VF3201C / SST39VF3202C
Data Sheet
30 32 0F0000H-0F7FFFH 30 32 0B8000H-0BFFFFH
29 32 0E8000H-0EFFFFH 29 32 0B0000H-0B7FFFH
28 32 0E0000H-0E7FFFH 28 32 0A8000H-0AFFFFH
27 32 0D8000H-0DFFFFH 27 32 0A0000H-0A7FFFH
26 32 0D0000H-0D7FFFH 26 32 098000H-09FFFFH
25 32 0C8000H-0CFFFFH 25 32 090000H-097FFFH
24 32 0C0000H-0C7FFFH 24 32 088000H-08FFFFH
23 32 0B8000H-0BFFFFH 23 32 080000H-087FFFH
22 32 0B0000H-0B7FFFH 22 32 078000H-07FFFFH
21 32 0A8000H-0AFFFFH 21 32 070000H-077FFFH
20 32 0A0000H-0A7FFFH 20 32 068000H-06FFFFH
19 32 098000H-09FFFFH 19 32 060000H-067FFFH
18 32 090000H-097FFFH 18 32 058000H-05FFFFH
17 32 088000H-08FFFFH 17 32 050000H-057FFFH
16 32 080000H-087FFFH 16 32 048000H-04FFFFH
15 32 078000H-07FFFFH 15 32 040000H-047FFFH
14 32 070000H-077FFFH 14 32 038000H-03FFFFH
13 32 068000H-06FFFFH 13 32 030000H-037FFFH
12 32 060000H-067FFFH 12 32 028000H-02FFFFH
11 32 058000H-05FFFFH 11 32 020000H-027FFFH
10 32 050000H-057FFFH 10 32 018000H-01FFFFH
9 32 048000H-04FFFFH 9 32 010000H-017FFFH
8 32 040000H-047FFFH 8 32 008000H-00FFFFH
7 32 038000H-03FFFFH 7 4 007000H-007FFFH
6 32 030000H-037FFFH 6 4 006000H-006FFFH
5 32 028000H-02FFFFH 5 4 005000H-005FFFH
4 32 020000H-027FFFH 4 4 004000H-004FFFH
3 32 018000H-01FFFFH 3 4 003000H-003FFFH
2 32 010000H-017FFFH 2 4 002000H-002FFFH
1 32 008000H-00FFFFH 1 4 001000H-001FFFH
0 32 000000H-007FFFH 0 4 000000H-000FFFH
T2.20005020
Table 2: Top / Bottom Boot Block Address (Continued) (2 of 2)
©2014 Silicon Storage Technology, Inc. DS20005020B 07/14
8
32 Mbit Multi-Purpose Flash Plus
SST39VF3201C / SST39VF3202C
Data Sheet
Device Operation
Commands are used to initiate the memory operation functions of the device. Commands are written
to the device using standard microprocessor write sequences. A command is written by asserting WE#
low while keeping CE# low. The address bus is latched on the falling edge of WE# or CE#, whichever
occurs last. The data bus is latched on the rising edge of WE# or CE#, whichever occurs first.
The SST39VF3201C/3202C also have the Auto Low Power mode which puts the device in a near
standby mode after data has been accessed with a valid Read operation. This reduces the I
DD
active
read current from typically 9 mA to typically 4 µA. The Auto Low Power mode reduces the typical I
DD
active read current to the range of 2 mA/MHz of Read cycle time. The device exits the Auto Low Power
mode with any address transition or control signal transition used to initiate another Read cycle, with
no access time penalty. Note that the device does not enter Auto-Low Power mode after power-up with
CE# held steadily low, until the first address transition or CE# is driven high.
Read
The Read operation of the SST39VF3201C/3202C is controlled by CE# and OE#, both have to be low
for the system to obtain data from the outputs. CE# is used for device selection. When CE# is high, the
chip is deselected and only standby power is consumed. OE# is the output control and is used to gate
data from the output pins. The data bus is in high impedance state when either CE# or OE# is high.
Refer to the Read cycle timing diagram for further details (Figure 5).
Word-Program Operation
The SST39VF3201C/3202C are programmed on a word-by-word basis. Before programming, the sector
where the word exists must be fully erased. The Program operation is accomplished in three steps.
The first step is the three-byte load sequence for Software Data Protection. The second step is to load
word address and word data. During the Word-Program operation, the addresses are latched on the
falling edge of either CE# or WE#, whichever occurs last. The data is latched on the rising edge of
either CE# or WE#, whichever occurs first. The third step is the internal Program operation which is ini-
tiated after the rising edge of the fourth WE# or CE#, whichever occurs first. The Program operation,
once initiated, will be completed within 10 µs. See Figure 6 and Figure 7 for WE# and CE# controlled
Program operation timing diagrams and Figure 21 for flowcharts. During the Program operation, the
only valid reads are Data# Polling and Toggle Bit. During the internal Program operation, the host is
free to perform additional tasks. Any commands issued during the internal Program operation are
ignored. During the command sequence, WP# should be statically held high or low.
Sector/Block-Erase Operation
The Sector- (or Block-) Erase operation allows the system to erase the device on a sector-by-sector (or
block-by-block) basis. The SST39VF3201C/3202C offer both Sector-Erase and Block-Erase mode. The
sector architecture is based on uniform sector size of 2 KWord. The Block-Erase mode is based on
block sizes of 4 and 32 KWord. The Sector-Erase operation is initiated by executing a six-byte com-
mand sequence with Sector-Erase command (50H) and sector address (SA) in the last bus cycle. The
Block-Erase operation is initiated by executing a six-byte command sequence with Block-Erase com-
mand (30H) and block address (BA) in the last bus cycle. The sector or block address is latched on the
falling edge of the sixth WE# pulse, while the command (50H or 30H) is latched on the rising edge of
the sixth WE# pulse. The internal Erase operation begins after the sixth WE# pulse. The End-of-Erase
operation can be determined using either Data# Polling or Toggle Bit methods. See Figure 11 and Fig-
ure 12 for timing waveforms and Figure 25 for the flowchart. Any commands issued during the Sector-
©2014 Silicon Storage Technology, Inc. DS20005020B 07/14
9
32 Mbit Multi-Purpose Flash Plus
SST39VF3201C / SST39VF3202C
Data Sheet
or Block-Erase operation are ignored. When WP# is low, any attempt to Sector- (Block-) Erase the pro-
tected block will be ignored. During the command sequence, WP# should be statically held high or low.
Erase-Suspend/Erase-Resume Commands
The Erase-Suspend operation temporarily suspends a Sector- or Block-Erase operation thus allowing
data to be read from any memory location, or program data into any sector/block that is not suspended
for an Erase operation. The operation is executed by issuing one byte command sequence with Erase-
Suspend command (B0H). The device automatically enters read mode typically within 10 µs after the
Erase-Suspend command had been issued. Valid data can be read from any sector or block that is not
suspended from an Erase operation. Reading at address location within erase-suspended sectors/
blocks will output DQ
2
toggling and DQ
6
at ‘1’. While in Erase-Suspend mode, a Word-Program opera-
tion is allowed except for the sector or block selected for Erase-Suspend.
To resume Sector-Erase or Block-Erase operation which has been suspended the system must issue
Erase Resume command. The operation is executed by issuing one byte command sequence with
Erase Resume command (30H) at any address in the last Byte sequence.
Chip-Erase Operation
The SST39VF3201C/3202C provide a Chip-Erase operation, which allows the user to erase the entire
memory array to the “1” state. This is useful when the entire device must be quickly erased.
The Chip-Erase operation is initiated by executing a six-byte command sequence with Chip-Erase
command (10H) at address 555H in the last byte sequence. The Erase operation begins with the rising
edge of the sixth WE# or CE#, whichever occurs first. During the Erase operation, the only valid read is
Toggle Bit or Data# Polling. See Table 7 for the command sequence, Figure 10 for timing diagram, and
Figure 25 for the flowchart. Any commands issued during the Chip-Erase operation are ignored. When
WP# is low, any attempt to Chip-Erase will be ignored. During the command sequence, WP# should
be statically held high or low.
Write Operation Status Detection
The SST39VF3201C/3202C provide two software means to detect the completion of a Write (Program
or Erase) cycle, in order to optimize the system write cycle time. The software detection includes two
status bits: Data# Polling (DQ
7
) and Toggle Bit (DQ
6
). The End-of-Write detection mode is enabled
after the rising edge of WE#, which initiates the internal Program or Erase operation.
The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a
Data# Polling or Toggle Bit read may be simultaneous with the completion of the write cycle. If this
occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with
either DQ
7
or DQ
6
. In order to prevent spurious rejection, if an erroneous result occurs, the software
routine should include a loop to read the accessed location an additional two (2) times. If both reads
are valid, then the device has completed the Write cycle, otherwise the rejection is valid.

SST39VF3201C-70-4I-B3KE

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 2.7V to 3.6V 32Mbit Multi-Prps Fl
Lifecycle:
New from this manufacturer.
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