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LTC2282IUP#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
LTC2282
22
2282fb
Bottom Side
Inner Layer 2 GND Inner Layer 3 Power
APPLICATIONS INFORMATION
LTC2282
23
2282fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UP Package
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
9 .00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40 ± 0.10
6463
1
2
BOTTOM VIEW—EXPOSED PAD
7.15 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 1003
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 ±0.05
7.15 ±0.05
(4 SIDES)
8.10 ±0.05 9.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
LTC2282
24
2282fb
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2005
LT 0308 REV B • PRINTED IN USA
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P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

LTC2282IUP#PBF

Mfr. #:
Buy LTC2282IUP#PBF
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 2x 12-B, 105Msps L Pwr 3V ADC
Lifecycle:
New from this manufacturer.
Delivery:
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