USB 2.0 Hi-Speed 3-Port Hub Controller Optimized for Portable Applications
Datasheet
DS00001715A-page 52
2014 Microchip Technology Inc.
9.6 Clock Specifications
The device can accept a 24 MHz single-ended clock oscillator input. REFCLK should be driven with a
clock that adheres to the specifications outlined in Section 9.6.1, "External Reference Clock
(REFCLK)".
9.6.1 External Reference Clock (REFCLK)
The following input clock specifications are suggested:
± 350 PPM
The input frequency of REFCLK is user configurable. Refer to Section 8.4, "Reference Clock" for
additional information on configuring a reference clock input.
Note: The external clock is recommended to conform to the signalling levels designated in the
JEDEC specification on 1.2V CMOS Logic.
Table 9.8 SPI Timing Values (60 MHz Operation)
SYMBOL DESCRIPTION MIN TYP MAX UNITS
t
fc
Clock frequency 60 MHz
t
ceh
Chip enable (SPI_CE_EN) high time 50 ns
t
clq
Clock to input data 9 ns
t
dh
Input data hold time 0 ns
t
os
Output setup time 5 ns
t
oh
Output hold time 5 ns
t
ov
Clock to output valid 4 ns
t
cel
Chip enable (SPI_CE_EN) low to first clock 12 ns
t
ceh
Last clock to chip enable (SPI_CE_EN) high 12 ns
USB 2.0 Hi-Speed 3-Port Hub Controller Optimized for Portable Applications
Datasheet
2014 Microchip Technology Inc. DS00001715A-page 53
Chapter 10 Package Outline
Note: For the most current package drawings, see the Microchip Packaging Specification at
http://www.microchip.com/packaging.
Notes:
Figure 10.1 30-WLCSP Package
Table 10.1 30-WLCSP Dimensions
MIN NOMINAL MAX REMARKS
A - 0.56 0.62 Overall Package Height
A1 0.16 0.20 0.24 Standoff
A2 - - 0.38 Package Thickness
D 2.87 2.90 2.93 X Die Size
E 2.47 2.50 2.53 Y Die Size
D1 2.00 BSC X End Balls Distance
E1 1.60 BSC Y End Balls Distance
b 0.20 0.25 0.30 Ball Diameter
e 0.40 BSC Ball Pitch
ccc 0 - 0.05 Coplanarity
USB 2.0 Hi-Speed 3-Port Hub Controller Optimized for Portable Applications
Datasheet
DS00001715A-page 54
2014 Microchip Technology Inc.
Notes:
1. All dimensions are in millimeters unless otherwise noted.
2. Dimension “b” is measured at the maximum ball diameter parallel to primary datum “C”.
3. The ball A1 identifier may vary, but is always located within the zone indicated.
4. Primary datum “C” and the seating plane are defined by the spherical crowns of the contact solder balls.
5. Dimension “A” does not include attached external features, such as a heat sink or chip capacitors. Dimension
“A(max)” is given for the extremely thin variation of the package profile height.
6. Dimension “A2” includes a die coating thickness.
Figure 10.2 30-WLCSP Recommended Land Pattern

USB3813I-1080XY-TR

Mfr. #:
Manufacturer:
Microchip Technology
Description:
USB Interface IC USB 2.0 Hi-Spd 3-pt Hub Cntlr
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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