AD9515 Data Sheet
Rev. A | Page 28 of 28
OUTLINE DIMENSIONS
3.25
3.10 SQ
2.95
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
1
32
8
9
25
24
17
16
COPLANARITY
0.08
3.50 REF
0.50
BSC
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.25
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
EATING
PLANE
0.50
0.40
0.30
5.00
BSC SQ
4.75
BSC SQ
0.60 MAX
0.60 MAX
0.25 MIN
03-28-2012-A
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Figure 43. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad (CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD9515BCPZ −40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD9515BCPZ-REEL7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
AD9515/PCBZ Evaluation Board
1
Z = RoHS Compliant Part.
©2005–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05597-0-4/12(A)
