TJA1083G All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 1 — 18 January 2018 17 of 41
NXP Semiconductors
TJA1083G
FlexRay node transceiver
[1] According to ISO7637, test pulse 1, class C; verified by an external test house.
[2] According to ISO7637, test pulse 2a, class C; verified by an external test house.
[3] According to ISO7637, test pulse 3a, class C; verified by an external test house.
[4] According to ISO7637, test pulse 3b, class C; verified by an external test house.
[5] In accordance with IEC 60747-1. An alternative definition of T
vj
is: T
vj
=T
amb
+P R
th(j-a)
, where R
th(j-a)
is a fixed value used in the
calculation of T
vj
. The rating for T
vj
limits the allowable combinations of power dissipation (P) and ambient temperature (T
amb
).
[6] IEC61000-4-2: C = 150 pF; R = 330 ; verified by an external test house; the test results were equal to or better than 6 kV (unaided).
[7] HBM: C = 100 pF; R = 1.5 k.
[8] MM: C = 200 pF; L = 0.75 H; R = 10 .
[9] CDM: R = 1 .
8. Thermal characteristics
[1] According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.
[2] According to JEDEC JESD51-2 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers (thickness:
35 m).
V
BM
voltage on pin BM no time limit (with respect to pins BP
and GND)
60 +60 V
I
I(ERRN)
input current on pin ERRN no time limit; V
IO
=0V 10 10 mA
I
I(RXD)
input current on pin RXD no time limit; V
IO
=0V 10 10 mA
I
I(SDO)
input current on pin SDO no time limit; V
IO
=0V 10 10 mA
V
trt
transient voltage on pins BM and BP
[1]
100 - V
[2]
-75 V
[3]
150 - V
[4]
-100 V
T
stg
storage temperature 55 +150 C
T
vj
virtual junction temperature
[5]
40 +150 C
T
amb
ambient temperature 40 +125 C
V
ESD
electrostatic discharge voltage IEC61000-4-2 on pins BP and BM to
ground
[6]
6.0 +6.0 kV
HBM on pins BP and BM to ground
[7]
8.0 +8.0 kV
HBM on any other pin
[7]
4.0 +4.0 kV
MM on all pins
[8]
200 +200 V
CDM on all pins
[9]
1000 +1000 V
Table 9. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter Conditions Min Max Unit
Table 10. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to ambient dual-layer board
[1]
109.5 K/W
four-layer board
[2]
83.0 K/W