PDF: 09005aef80be1ee8/Source: 09005aef80be1f7f Micron Technology, Inc., reserves the right to change products or specifications without notice.
AsyncCellularRAM_2.fm - Rev. G 10/05 EN
22 ©2003 Micron Technology, Inc. All rights reserved.
64Mb: 4 Meg x 16 Async/Page CellularRAM 1.0 Memory
Electrical Characteristics
Notes: 1. High-Z to Low-Z timings are tested with the circuit shown in Figure 15 on page 21. The
Low-Z timings measure a 100mV transition away from the High-Z (V
CCQ/2) level toward
either VOH or VOL.
2. Low-Z to High-Z timings are tested with the circuit shown in Figure 15 on page 21. The
High-Z timings measure a 100mV transition from either V
OH or VOL toward VCCQ/2.
3. Page-mode enabled only.
Table 11: READ Cycle Timing Requirements
Parameter Symbol
-70 -85
Units NotesMin Max Min Max
Address Access Time
t
AA
70 85 ns
Page Access Time
t
APA
20 25 ns
LB#/UB# Access Time
t
BA
70 85 ns
LB#/UB# Disable to High-Z Output
t
BHZ
88ns2
LB#/UB# Enable to Low-Z Output
t
BLZ
10 10 ns 1
Maximum CE# Pulse Width
t
CEM
88µs3
Chip Select Access Time
t
CO
70 85 ns
Chip Disable to High-Z Output
t
HZ
88ns2
Chip Enable to Low-Z Output
t
LZ
10 10 ns 1
Output Enable to Valid Output
t
OE
20 20 ns
Output Hold from Address Change
t
OH
55ns
Output Disable to High-Z Output
t
OHZ
88ns2
Output Enable to Low-Z Output
t
OLZ
55ns1
Page Cycle Time
t
PC
20 25 ns
Read Cycle Time
t
RC
70 85 ns
PDF: 09005aef80be1ee8/Source: 09005aef80be1f7f Micron Technology, Inc., reserves the right to change products or specifications without notice.
AsyncCellularRAM_2.fm - Rev. G 10/05 EN
23 ©2003 Micron Technology, Inc. All rights reserved.
64Mb: 4 Meg x 16 Async/Page CellularRAM 1.0 Memory
Electrical Characteristics
Notes: 1. High-Z to Low-Z timings are tested with the circuit shown in Figure 15 on page 21. The
Low-Z timings measure a 100mV transition away from the High-Z (V
CCQ/2) level toward
either VOH or VOL.
2. Low-Z to High-Z timings are tested with the circuit shown in Figure 15 on page 21. The
High-Z timings measure a 100mV transition from either V
OH or VOL toward VCCQ/2.
3. WE# LOW time must be limited to
t
CEM (8µs).
Table 12: WRITE Cycle Timing Requirements
Parameter Symbol
-70 -85
Units NotesMin Max Min Max
Address Setup Time
t
AS
00ns
Address Valid to End of Write
t
AW
70 85 ns
Byte Select to End of Write
t
BW
70 85 ns
CE# HIGH Time During Write
t
CPH
55ns
Chip Enable to End of Write
t
CW
70 85 ns
Data Hold from Write Time
t
DH
00ns
Data Write Setup Time
t
DW
23 25 ns
Chip Enable to Low-Z Output
t
LZ
10 10 ns 1
End Write to Low-Z Output
t
OW
55ns1
Write Cycle Time
t
WC
70 85 ns
Write to High-Z Output
t
WHZ
88ns2
Write Pulse Width
t
WP
46 50 ns 3
Write Pulse Width HIGH
t
WPH
10 10 ns
Write Recovery Time
t
WR
00ns
PDF: 09005aef80be1ee8/Source: 09005aef80be1f7f Micron Technology, Inc., reserves the right to change products or specifications without notice.
AsyncCellularRAM_2.fm - Rev. G 10/05 EN
24 ©2003 Micron Technology, Inc. All rights reserved.
64Mb: 4 Meg x 16 Async/Page CellularRAM 1.0 Memory
Electrical Characteristics
Table 13: Load Configuration Register Timing Requirements
Description Symbol
-70 -85
UnitsMin Max Min Max
Address Setup Time
t
AS
00ns
Address Valid to End of Write
t
AW
70 85 ns
Chip Deselect to ZZ# LOW
t
CDZZ
55ns
Chip Enable to End of Write
t
CW
70 85 ns
Write Cycle Time
t
WC
70 85 ns
Write Pulse Width
t
WP
40 40 ns
Write Recovery Time
t
WR
00ns
ZZ# LOW to WE# LOW
t
ZZWE
10 500 10 500 ns
Table 14: Deep Power-Down Timing Requirements
Description Symbol
-70 -85
UnitsMin Max Min Max
Chip Deselect to ZZ# LOW
t
CDZZ
55ns
Deep Power-Down Recovery
t
R
150 150 µs
Minimum ZZ# Pulse Width
t
ZZMIN
10 10 µs

MT45W4MW16PBA-70 IT TR

Mfr. #:
Manufacturer:
Micron
Description:
IC PSRAM 64M PARALLEL 48VFBGA
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