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DS1017_02.5
LA-ispMACH 4000V/Z
Automotive Family
3.3V/1.8V In-System Programmable
SuperFAST
High Density PLDs
May 2009 Data Sheet DS1017
TM
© 2009 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
Features
High Performance
•f
MAX
= 168MHz maximum operating frequency
•t
PD
= 7.5ns propagation delay
Up to four global clock pins with programmable
clock polarity control
Up to 80 PTs per output
Ease of Design
Enhanced macrocells with individual clock,
reset, preset and clock enable controls
Up to four global OE controls
Individual local OE control per I/O pin
Excellent First-Time-Fit
TM
and refit
Fast path, SpeedLocking
TM
Path, and wide-PT
path
Wide input gating (36 input logic blocks) for fast
counters, state machines and address decoders
Zero Power (LA-ispMACH 4000Z)
Typical static current 10µA (4032Z)
1.8V core low dynamic power
LA-ispMACH 4000Z operational down to 1.6V
AEC-Q100 Tested and Qualified
Automotive: -40 to 125°C ambient (T
A
)
Easy System Integration
Superior solution for power sensitive consumer
applications
Operation with 3.3V, 2.5V or 1.8V LVCMOS I/O
Operation with 3.3V (4000V) or 1.8V (4000Z)
supplies
5V tolerant I/O for LVCMOS 3.3, LVTTL, and PCI
interfaces
Hot-socketing
Open-drain capability
Input pull-up, pull-down or bus-keeper
Programmable output slew rate
3.3V PCI compatible
IEEE 1149.1 boundary scan testable
3.3V/2.5V/1.8V In-System Programmable
(ISP™) using IEEE 1532 compliant interface
I/O pins with fast setup path
Lead-free (RoHS) package
Introduction
The high performance LA-ispMACH 4000V/Z automo-
tive family from Lattice offers a SuperFAST CPLD solu-
tion that is tested and qualified to the AEC-Q100
standard. The family is a blend of Lattice’s two most
popular architectures: the ispLSI
®
2000 and ispMACH
4A. Retaining the best of both families, the LA-ispMACH
4000V/Z architecture focuses on significant innovations
to combine the highest performance with low power in a
flexible CPLD family.
The LA-ispMACH 4000V/Z automotive family combines
high speed and low power with the flexibility needed for
ease of design. With its robust Global Routing Pool and
Output Routing Pool, this family delivers excellent First-
Time-Fit, timing predictability, routing, pin-out retention
and density migration.
Table 1. LA-ispMACH 4000V Automotive Family Selection Guide
LA-ispMACH 4032V LA-ispMACH 4064V LA-ispMACH 4128V
Macrocells 32 64 128
I/O + Dedicated Inputs 30+2/32+4 30+2/32+4/64+10 64+10/92+4/96+4
t
PD
(ns) 7.5 7.5 7.5
t
S
(ns) 4.5 4.5 4.5
t
CO
(ns) 4.5 4.5 4.5
f
MAX
(MHz) 168 168 168
Supply Voltage (V) 3.3V 3.3V 3.3V
Pins/Package 44-pin Lead-Free TQFP
48-pin Lead-Free TQFP
44-pin Lead-Free TQFP
48-pin Lead-Free TQFP
100-pin Lead-Free TQFP 100-pin Lead-Free TQFP
128-pin Lead-Free TQFP
144-pin Lead-Free TQFP
Lattice Semiconductor LA-ispMACH 4000V/Z Automotive Family Data Sheet
2
Table 2. LA-ispMACH 4000Z Automotive Family Selection Guide
The LA-ispMACH 4000V/Z automotive family offers densities ranging from 32 to 128 macrocells. There are multiple
density-I/O combinations in Thin Quad Flat Pack (TQFP) packages ranging from 44 to 144 pins. Tables 1 and 2
show the macrocell, package and I/O options, along with other key parameters.
The LA-ispMACH 4000V/Z automotive family has enhanced system integration capabilities. It supports 3.3V (4000V
and 1.8V (4000Z) supply voltages and 3.3V, 2.5V and 1.8V interface voltages. Additionally, inputs can be safely
driven up to 5.5V when an I/O bank is configured for 3.3V operation, making this family 5V tolerant. The LA-
ispMACH 4000V/Z also offers enhanced I/O features such as slew rate control, PCI compatibility, bus-keeper
latches, pull-up resistors, pull-down resistors, open drain outputs and hot socketing. The LA-ispMACH 4000V/Z
automotive family is in-system programmable through the IEEE Standard 1532 interface. IEEE Standard 1149.1
boundary scan testing capability also allows product testing on automated test equipment. The 1532 interface sig-
nals TCK, TMS, TDI and TDO are referenced to VCC (logic core).
Overview
The LA-ispMACH 4000V/Z automotive devices consist of multiple 36-input, 16-macrocell Generic Logic Blocks
(GLBs) interconnected by a Global Routing Pool (GRP). Output Routing Pools (ORPs) connect the GLBs to the I/O
Blocks (IOBs), which contain multiple I/O cells. This architecture is shown in Figure 1.
Figure 1. Functional Block Diagram
LA-ispMACH 4032Z LA-ispMACH 4064Z LA-ispMACH 4128Z
Macrocells 32 64 128
I/O + Dedicated Inputs 32+4 32+4/64+10 64+10
t
PD
(ns) 7.5 7.5 7.5
t
S
(ns) 4.5 4.5 4.5
t
CO
(ns) 4.5 4.5 4.5
f
MAX
(MHz) 168 168 168
Supply Voltage (V) 1.8V 1.8V 1.8V
Pins/Package 48-pin Lead-Free TQFP 48-pin Lead-Free TQFP
100-pin Lead-Free TQFP 100-pin Lead-Free TQFP
I/O
Block
ORP ORP
16
16
GOE0
GOE1
V
CC
GND
TCK
TMS
TDI
TDO
36
Generic
Logic
Block
Generic
Logic
Block
I/O
Block
ORP ORP
16
36
Generic
Logic
Block
Generic
Logic
Block
I/O
Block
I/O Bank 0
I/O Bank 1
I/O
Block
36
36
CLK0/I
CLK1/I
CLK2/I
CLK3/I
16
16
Global Routing Pool
V
CCO0
GND
V
CCO1
GND
16 16
16
Lattice Semiconductor LA-ispMACH 4000V/Z Automotive Family Data Sheet
3
The I/Os in the LA-ispMACH 4000V/Z automotive devices are split into two banks. Each bank has a separate I/O
power supply. Inputs can support a variety of standards independent of the chip or bank power supply. Outputs
support the standards compatible with the power supply provided to the bank. Support for a variety of standards
helps designers implement designs in mixed voltage environments. In addition, 5V tolerant inputs are specified
within an I/O bank that is connected to V
CCO
of 3.0V to 3.6V for LVCMOS 3.3, LVTTL and PCI interfaces.
LA-ispMACH 4000V/Z Automotive Architecture
There are a total of two GLBs in the LA-ispMACH 4032V/Z, increasing to 8 GLBs in the LA-ispMACH 4128V/Z.
Each GLB has 36 inputs. All GLB inputs come from the GRP and all outputs from the GLB are brought back into
the GRP to be connected to the inputs of any other GLB on the device. Even if feedback signals return to the same
GLB, they still must go through the GRP. This mechanism ensures that GLBs communicate with each other with
consistent and predictable delays. The outputs from the GLB are also sent to the ORP. The ORP then sends them
to the associated I/O cells in the I/O block.
Generic Logic Block
The LA-ispMACH 4000V/Z Automotive GLB consists of a programmable AND array, logic allocator, 16 macrocells
and a GLB clock generator. Macrocells are decoupled from the product terms through the logic allocator and the I/O
pins are decoupled from macrocells through the ORP. Figure 2 illustrates the GLB.
Figure 2. Generic Logic Block
AND Array
The programmable AND Array consists of 36 inputs and 83 output product terms. The 36 inputs from the GRP are
used to form 72 lines in the AND Array (true and complement of the inputs). Each line in the array can be con-
nected to any of the 83 output product terms via a wired-AND. Each of the 80 logic product terms feed the logic
allocator with the remaining three control product terms feeding the Shared PT Clock, Shared PT Initialization and
Shared PT OE. The Shared PT Clock and Shared PT Initialization signals can optionally be inverted before being
fed to the macrocells.
Every set of five product terms from the 80 logic product terms forms a product term cluster starting with PT0.
There is one product term cluster for every macrocell in the GLB. Figure 3 is a graphical representation of the AND
Array.
Logic Allocator
36 Inputs
from GRP
16 Macrocells
To ORP
To GRP
To
Product Term
Output Enable
Sharing
1+OE
16 MC Feedback Signals
Clock
Generator
1+OE
1+OE
1+OE
1+OE
1+OE
1+OE
CLK0
CLK1
CLK2
CLK3
1+OE
AND Array
36 Inputs,
83 Product Terms

LA4032ZC-75TN48E

Mfr. #:
Manufacturer:
Lattice
Description:
CPLD - Complex Programmable Logic Devices Auto Grade (AEC-Q100 ) ispMACH4032Z
Lifecycle:
New from this manufacturer.
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