P89LPC9351_1 © NXP B.V. 2008. All rights reserved.
Preliminary data sheet Rev. 01 — 19 November 2008 67 of 74
NXP Semiconductors
P89LPC9351
8-bit microcontroller with 8-bit ADC
12.2 ADC/PGA/temp sensor electrical characteristics
Table 15. ADC/PGA/temp sensor electrical characteristics
V
DD
= 2.4 V to 3.6 V, unless otherwise specified.
T
amb
=
40
°
C to +85
°
C for industrial applications, unless otherwise specified.
All limits valid for an external source impedance of less than 10 k
.
Symbol Parameter Conditions Min Typ Max Unit
V
DDA(ADC)
ADC analog supply voltage
V
SSA
analog ground voltage
V
IA
analog input voltage V
SS
0.2 - V
DD
+ 0.2 V
C
ia
analog input capacitance - - 15 pF
E
D
differential linearity error - - ±1 LSB
E
L(adj)
integral non-linearity - - ±1 LSB
E
O
offset error - - ±2 LSB
E
G
gain error - - ±1 LSB
E
u(tot)
total unadjusted error - - ±2 LSB
M
CTC
channel-to-channel matching - - ±1 LSB
α
ct(port)
crosstalk between port inputs 0 kHz to 100 kHz - - 60 dB
SR
in
input slew rate - - 100 V/ms
T
cy(ADC)
ADC clock cycle time 111 - 2000 ns
t
ADC
ADC conversion time ADC enabled - - 13T
cy(ADC)
µs
PGA
t
s(PGA)
PGA settling time within accuracy
of ADC
--1 µs
G
PGA
PGA gain G = 1 0.95 1.00 1.05 V/V
G = 2 1.87 1.97 2.07 V/V
G = 4 3.70 3.89 4.08 V/V
G = 8 7.22 7.60 7.98 V/V
G = 16 14.38 15.14 15.90 V/V
t
startup
start-up time - - 2 µs
V
offset(O)(nom)
nominal output offset voltage - 100 - mV
temperature sensor
V
sen
sensor voltage T
amb
= +0 °C - 890 - mV
TC temperature coefficient - 11.3 - mV/°C
P89LPC9351_1 © NXP B.V. 2008. All rights reserved.
Preliminary data sheet Rev. 01 — 19 November 2008 68 of 74
NXP Semiconductors
P89LPC9351
8-bit microcontroller with 8-bit ADC
13. Package outline
Fig 28. PLCC28 package outline (SOT261-2)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
SOT261-2 112E08 MS-018 EDR-7319
19
25
28
1
4
511
18
12
26
detail X
(A )
3
b
p
w M
A
1
A
A
4
L
p
b
1
β
k
X
y
e
E
B
D
H
E
H
v M
B
D
Z
D
A
Z
E
e
v M
A
0 5 10 mm
scale
99-12-27
01-11-15
pin 1 index
PLCC28: plastic leaded chip carrier; 28 leads
SOT261-2
UNIT β
mm
4.57
4.19
0.51
3.05
0.53
0.33
0.021
0.013
1.27
2.16
45
o
0.18 0.10.18
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
11.58
11.43
12.57
12.32
2.16
0.81
0.66
1.22
1.07
0.180
0.165
0.02
0.12
0.25
0.01
0.05
0.085
0.007 0.0040.007
1.44
1.02
0.057
0.040
0.456
0.450
11.58
11.43
0.456
0.450
0.495
0.485
12.57
12.32
0.495
0.485
10.92
9.91
0.43
0.39
10.92
9.91
0.43
0.39
0.085
0.032
0.026
0.048
0.042
E
e
inches
D
e
A
A
1
min.
A
4
max.
b
p
eywvD
(1)
E
(1)
H
D
H
E
Z
D
(1)
max.
Z
E
(1)
max.
b
1
kA
3
L
p
e
D
e
E
P89LPC9351_1 © NXP B.V. 2008. All rights reserved.
Preliminary data sheet Rev. 01 — 19 November 2008 69 of 74
NXP Semiconductors
P89LPC9351
8-bit microcontroller with 8-bit ADC
Fig 29. TSSOP package outline (SOT361-1)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.8
0.5
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT361-1 MO-153
99-12-27
03-02-19
0.25
w M
b
p
Z
e
114
28
15
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
A
max.
1.1

P89LPC9351FDH,518

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Microcontrollers - MCU 8-bit Microcontrollers - MCU Enhanced LPC935
Lifecycle:
New from this manufacturer.
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