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FN6760.0
September 12, 2008
ISL98003
Thin Plastic Quad Flatpack Exposed Pad Packages (EPTQFP)
12° ALL AROUND
1
80
B
B
EXPOSED
PAD AREA
PIN 1
12° ALL AROUND
Y
PIN 1
BOTTOM VIEW
SIDE VIEW
TOP VIEW
E
E1
D
D1
9.500 REF
12.000±0.100
11.950±0.100
REF. 6.000
REF. 6.000
PLANE
SEATING
C
ddd
R0.250 TYP
ccc
c
GAGE PLANE
R0.080~0.200
ALL AROUND
0° MIN.
0.200 MIN.
R
0
.
0
8
0
MI
N
.
0.250
L
C
A1
e
A
A2
b
L1
a
DETAIL "Y"
Q80.12x12
80 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD
PACKAGE
SYMBOL
MILLIMETERS
REMARKSMIN TYP MAX
A - - 1.20 Overall height
A1 0.05 0.10 0.15 Standoff
A2 0.90 1.00 1.10 Package thickness
D 13.8 14.0 14.2 Lead tip to tip
D1 11.9 12.0 12.1 Package length
E 13.8 14.0 14.2 Lead tip to tip
E1 11.9 12.0 12.1 Package width
L 0.45 0.60 0.75 Foot length
L1 1.000 REF. Lead length
T 0.09 0.150 0.20 Lead thickness
T1 0.097 0.127 0.157 Lead base metal thickness
a 0°~7° Foot angle
b 0.17 0.22 0.27 Lead width
b1 0.17 0.20 0.23 Lead base metal width
e 0.500 BASE Lead pitch
ccc - 0.080 - Foot coplanarity
ddd - 0.080 - Foot position
Rev. 0 8/07
NOTES:
1. General tolerance. Distance: ±0.1000, Angle: ±2.5°
2. Matte finish on package body surface except ejection and pin 1
marking: Ra0.8~2.0um
3. All molded body sharp corner radii unless otherwise specified:
MAX. R0.200
4. Package/lead frame misalignment (X, Y): MAX. 0.127
5. Top/bottom package misalignment (X, Y): MAX. 0.127
6. Drawing does not include plastic or metal protrusion or cutting
burr.
7. Compliant to JEDEC standard MS-026.
T
T1
SECTION B-B
b
b1
