LTC2655
27
2655f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UF Package
20-Lead (4mm × 4mm) Plastic QFN
(Reference LTC DWG # 05-08-1710 Rev A)
4.00 ± 0.10
4.00 ± 0.10
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-1)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
2019
1
2
BOTTOM VIEW—EXPOSED PAD
2.00 REF
2.45 ± 0.10
0.75 ± 0.05
R = 0.115
TYP
R = 0.05
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF20) QFN 01-07 REV A
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.00 REF
2.45 ± 0.05
3.10 ± 0.05
4.50 ± 0.05
PACKAGE OUTLINE
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 × 45°
CHAMFER
2.45 ± 0.10
2.45 ± 0.05
