SiI 1161 PanelLink Receiver
Data Sheet
SiI-DS-0096-D 36
VCCPIN
C1 C2
L1
C3
VCC
Figure 26. Decoupling and Bypass Schematic
The values shown in Table 20 are recommendations for noise suppression in the 1-2MHz range that should be
adjusted according to the noise characteristics of the specific board-level design. Pins in one group (such as
OVCC) may share L1 and C3, each pin having C1 and C2 placed as close to the pin as possible. This filter circuit
should be placed on planes where power supply ripple could exceed the VCC noise specification.
Table 20. Recommended Components for 1-2MHz Noise Suppression
C1 C2 C3 L1
100 – 300 pF 0.1 µF 10 µF
Ferrite, 200+
@ 100MHz
The PLL circuit that is powered from PVCC is more sensitive to noise in the 100-200kHz range. If the power
supply is prone to generation of noise in this range in excess of the PV
CCN
specification, the component values
shown in Table 21 should be used on the PVCC plane.
Table 21. Recommended Components for 100-200kHz Noise Suppression on PVCC
C1 C2 C3 L1
not used 6.8 µF 10 µF 10 µH inductor
Series Damping Resistors on Outputs
Small (~22 ohms) series resistors are effective in lowering the data-related emissions and reducing reflections.
Series resistors should be placed close to the output pins on the receiver chip, as shown in Figure 27.
RX
Figure 27. Receiver Output Series Damping Resistors
SiI 1161 PanelLink Receiver
Data Sheet
37 SiI-DS-0096-D
Receiver Layout
The receiver chip should be placed as close as possible to the input connector that carries the TMDS signals.
For a system using the industry-standard DVI connector (see http://www.ddwg.org
), the differential lines should
be routed as directly as possible from connector to receiver. Differential pair length is not critical but ideally
should be less than 10cm.
PanelLink devices are tolerant of skews between differential pairs, so spiral skew compensation for path length
differences is not required. However, each conductor of the differential pair should be routed together with equal
trace lengths. Vias should be avoided, but if used they should be placed on both signal lines of the differential
pair in a way that gives both lines equivalent reflection characteristics. Figure 28 illustrates acceptable routing
practices for TMDS signals from a DVI connector, while Figure 29 shows an example of actual trace routing.
Figure 28. General Signal Routing Recommendations
RXC-
RXC+
RX0-
RX0+
RX1-
RX1+
RX2-
RX2+
1
9
17
Figure 29. Signal Trace Routing Example
<10cm
SiI 1161 PanelLink Receiver
Data Sheet
SiI-DS-0096-D 38
PCB Ground Planes
All ground pins on the device should be connected to the same, contiguous ground plane in the PCB. This helps
to avoid ground loops and inductances from one ground plane segment to another. Such low-inductance ground
paths are critical for return currents, which affect EMI performance. The entire ground plane surrounding the
PanelLink receiver should be one piece, and include the ground vias for the DVI connector.
As defined in the DVI 1.0 Specification, the impedance of the traces between the connector and the receiver
should be 100 differentially, and close to 50 single-ended. The 100 requirement is to best match the
differential impedance of the cable and connectors, to prevent reflections. The common mode currents are very
small on the TMDS interface, so differential impedance is more important than single-ended.
Staggered Outputs and Two Pixels per Clock
PanelLink receivers offer two features that can minimize the switching effects of the high-speed output data bus:
two pixels per clock mode and staggered outputs.
The receiver can output one or two pixels in each output clock cycle. By widening the bus to two pixels per clock
whenever possible, the clock speed is halved and the switching period of the data signals themselves is twice as
long as in one pixel per clock mode. Typically, SXGA-resolution and above LCD panels expect to be connected
with a 36-bit or 48-bit bus, two pixels per clock. Most XGA-resolution and below LCD panels use an 18- to 24-bit
one pixel per clock interface.
When in two pixel per clock mode, the STAG_OUT# pin on receivers provides an additional means of reducing
simultaneous switching activity. When enabled (STAG_OUT# = Low), only half of the output data pins switch
together. The other half are switched one quarter clock cycle later. Note that both pixel buses use the same
clock. Therefore, the staggered bus will have one quarter clock cycle less setup time to the clock, and one
quarter clock cycle more hold time. Board designers driving into another clocked chip should take this into
account in their timing analysis.
Silicon Image recommends the use of STAG_OUT# and the two pixels per clock mode whenever possible.
Adjusting Output Timings for Loading
If not using the I
2
C drive strength programmability, the SiI 1161 can be made to accommodate different output
loads by adding external capacitance. Refer to Figure 3 for an illustration of the loading requirements on DE and
ODCK.

SII1161CTU

Mfr. #:
Manufacturer:
Lattice
Description:
UXGA PANELLINK RECEIVER
Lifecycle:
New from this manufacturer.
Delivery:
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