40
COMMERCIAL TEMPERATURE RANGE
IDT72V7230/7240/7250/7260/7270/7280/7290/72100 3.3V HIGH DENSITY SUPERSYNC II
TM
FIFO
512 x 72, 1K x 72, 2K x 72, 4K x 72, 8K x 36, 16K x 72, 32K x 72, 64K x 72
WRITE CLOCK (WCLK)
m + n m n
MASTER RESET (MRS)
READ CLOCK (RCLK)
DATA OUT
n
m + n
WRITE ENABLE (WEN)
FULL FLAG/INPUT READY (FF/IR)
PROGRAMMABLE (PAF)
PROGRAMMABLE (PAE)
EMPTY FLAG/OUTPUT READY (EF/OR) #2
OUTPUT ENABLE (OE)
READ ENABLE (REN)
m
LOAD (LD)
EMPTY FLAG/OUTPUT READY (EF/OR) #1
PARTIAL RESET (PRS)
4680 drw 33
FULL FLAG/INPUT READY (FF/IR) #2
HALF-FULL FLAG (HF)
FIRST WORD FALL THROUGH/
SERIAL INPUT (FWFT/SI)
RETRANSMIT (RT)
#1
FIFO
#2
GATE
(1)
GATE
(1)
D
0
- Dm
DATA IN
Dm
+1
- Dn
Q
0
-
Q
m
Qm
+1
- Qn
FIFO
#1
IDT
72V7230
72V7240
72V7250
72V7260
72V7270
72V7280
72V7290
72V72100
IDT
72V7230
72V7240
72V7250
72V7260
72V7270
72V7280
72V7290
72V72100
READ SHIP SELECT (RCS)
NOTES:
1. Use an AND gate in IDT Standard mode, an OR gate in FWFT mode.
2. Do not connect any output control signals directly together.
3. FIFO #1 and FIFO #2 must be the same depth, but may be different word widths.
OPTIONAL CONFIGURATIONS
WIDTH EXPANSION CONFIGURATION
Word width may be increased simply by connecting together the control
signals of multiple devices. Status flags can be detected from any one device.
The exceptions are the EF and FF functions in IDT Standard mode and the IR
and OR functions in FWFT mode. Because of variations in skew between RCLK
and WCLK, it is possible for EF/FF deassertion and IR/OR assertion to vary
by one cycle between FIFOs. In IDT Standard mode, such problems can be
Figure 28. Block Diagram of 512 x 144, 1,024 x 144, 2,048 x 144, 4,096 x 144, 8,192 x 144, 16,384 x 144, 32,768 x 144 and 65,536 x 144 Width Expansion
avoided by creating composite flags, that is, ANDing EF of every FIFO, and
separately ANDing FF of every FIFO. In FWFT mode, composite flags can be
created by ORing OR of every FIFO, and separately ORing IR of every FIFO.
Figure 28 demonstrates a width expansion using two IDT72V7230/
72V7240/72V7250/72V7260/72V7270/72V7280/72V7290/72V72100 de-
vices. D
0 - D71 from each device form a 144-bit wide input bus and Q0-Q71
from each device form a 144-bit wide output bus. Any word width can be attained
by adding additional IDT72V7230/72V7240/72V7250/72V7260/72V7270/
72V7280/72V7290/72V72100 devices.
41
COMMERCIAL TEMPERATURE RANGE
IDT72V7230/7240/7250/7260/7270/7280/7290/72100 3.3V HIGH DENSITY SUPERSYNC II
TM
FIFO
512 x 72, 1K x 72, 2K x 72, 4K x 72, 8K x 36, 16K x 72, 32K x 72, 64K x 72
Dn
INPUT READY
WRITE ENABLE
WRITE CLOCK
WEN
WCLK
IR
DATA IN
RCLK
READ CLOCK
RCLK
REN
OE
OUTPUT ENABLE
OUTPUT READY
Qn
Dn
IR
GND
WEN
WCLK
OR
REN
OE
Qn
READ ENABLE
OR
DATA OUT
TRANSFER CLOCK
4680 drw34
n
n n
FWFT/SI FWFT/SI
FWFT/SI
IDT
72V7230
72V7240
72V7250
72V7260
72V7270
72V7280
72V7290
72V72100
IDT
72V7230
72V7240
72V7250
72V7260
72V7270
72V7280
72V7290
72V72100
READ CIP SELECT
RCS
RCS
Figure 29. Block Diagram of 1,024 x 72, 2,048 x 72, 4,096 x 72, 8,192 x 72, 16,384 x 72, 32,768 x 72, 65,572 x 72 and 131,072 x 72 Depth Expansion
DEPTH EXPANSION CONFIGURATION (FWFT MODE ONLY)
The IDT72V7230 can easily be adapted to applications requiring depths
greater than 512, 1,024 for the IDT72V7240, , 2,048 for the IDT72V7250,
4,096 for the IDT72V7260, 8,192 for the IDT72V7270, 16,384 for the
IDT72V7280, 32,768 for the IDT72V7290 and 65,536 for the IDT72V72100
with an 72-bit bus width. In FWFT mode, the FIFOs can be connected in series
(the data outputs of one FIFO connected to the data inputs of the next) with no
external logic necessary. The resulting configuration provides a total depth
equivalent to the sum of the depths associated with each single FIFO. Figure
29 shows a depth expansion using two IDT72V7230/72V7240/72V7250/
72V7260/72V7270/72V7280/72V7290/72V72100 devices.
Care should be taken to select FWFT mode during Master Reset for all FIFOs
in the depth expansion configuration. The first word written to an empty
configuration will pass from one FIFO to the next ("ripple down") until it finally
appears at the outputs of the last FIFO in the chain – no read operation is
necessary but the RCLK of each FIFO must be free-running. Each time the
data word appears at the outputs of one FIFO, that device's OR line goes LOW,
enabling a write to the next FIFO in line.
For an empty expansion configuration, the amount of time it takes for OR of
the last FIFO in the chain to go LOW (i.e. valid data to appear on the last FIFO's
outputs) after a word has been written to the first FIFO is the sum of the delays
for each individual FIFO:
(N – 1)*(4*transfer clock) + 3*T
RCLK
where N is the number of FIFOs in the expansion and TRCLK is the RCLK
period. Note that extra cycles should be added for the possibility that the tSKEW1
specification is not met between WCLK and transfer clock, or RCLK and transfer
clock, for the OR flag.
The "ripple down" delay is only noticeable for the first word written to an empty
depth expansion configuration. There will be no delay evident for subsequent
words written to the configuration.
The first free location created by reading from a full depth expansion
configuration will "bubble up" from the last FIFO to the previous one until it finally
moves into the first FIFO of the chain. Each time a free location is created in one
FIFO of the chain, that FIFO's IR line goes LOW, enabling the preceding FIFO
to write a word to fill it.
For a full expansion configuration, the amount of time it takes for IR of the first
FIFO in the chain to go LOW after a word has been read from the last FIFO is
the sum of the delays for each individual FIFO:
(N – 1)*(3*transfer clock) + 2 TWCLK
where N is the number of FIFOs in the expansion and TWCLK is the WCLK
period. Note that extra cycles should be added for the possibility that the tSKEW1
specification is not met between RCLK and transfer clock, or WCLK and transfer
clock, for the IR flag.
The Transfer Clock line should be tied to either WCLK or RCLK, whichever
is faster. Both these actions result in data moving, as quickly as possible, to the
end of the chain and free locations to the beginning of the chain.
42
CORPORATE HEADQUARTERS for SALES: for Tech Support:
6024 Silver Creek Valley Road 800-345-7015 or 408-284-8200 408-360-1753
San Jose, CA 95138 fax: 408-284-2775 email: FIFOhelp@idt.com
www.idt.com
ORDERING INFORMATION
Fine Pitch Ball Grid Array (PBGA, BB2561)
Commercial (0°C to +70°C)
Low Power
512 x 72 3.3V SuperSync II FIFO
1,024 x 72 3.3V SuperSync II FIFO
2,048 x 72 3.3V SuperSync II FIFO
4,096 x 72 3.3V SuperSync II FIFO
8,192 x 72 3.3V SuperSync II FIFO
16,384 x 72 3.3V SuperSync II FIFO
32,768 x 72 3.3V SuperSync II FIFO
65,536 x 72 3.3V SuperSync II FIFO
4680 drw35
Clock Cycle Time (t
CLK
)
Speed in Nanoseconds
Commercial
IDT XXXXX
Device Type
X
Power
XX
Speed
X
Package
X
Process /
Temperature
Range
BLANK
72V7230
72V7240
72V7250
72V7260
72V7270
72V7280
72V7290
72V72100
L
10
15
BB
NOTE:
1. Industrial temperature range is available by special order.
DATASHEET DOCUMENT HISTORY
06/01/2000 pgs. 1, 2, 3, 7, 33, 34, 34, 35, 38, 41, and 42.
11/01/2000 pgs. 1, 2, and 42.
01/10/2001 pg. 7.
04/12/2001 pgs. 3, 4, 5, 17, 26, and 27.
05/01/2001 pg. 23.
10/04/2001 pg. 36.
12/16/2002 pgs. 1, 4, 6, 22, 24, and 41.
02/11/2003 pgs. 6, and 24.
09/29/2003 pg. 7.
12/17/2003 pg. 35.

IDT72V72100L10BB

Mfr. #:
Manufacturer:
Description:
IC FIFO 131KX36 10NS 256BGA
Lifecycle:
New from this manufacturer.
Delivery:
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