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5962F1120202QXA

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P34
CYRS1543AV18
CYRS1545AV18
Document Number: 001-60007 Rev. *L Page 19 of 34
Identification Register Definitions
Instruction Field
Value
Description
CYRS1543AV18 CYRS1545AV18
Revision number (31:29) 000 000 Version number.
Cypress device ID (28:12) 11010010101010100 11010010101100100 Defines the type of SRAM.
Cypress JEDEC ID (11:1) 00000110100 00000110100 Allows unique identification of
SRAM vendor.
ID register presence (0) 1 1 Indicates the presence of an ID
register.
Scan Register Sizes
Register Name Bit Size
Instruction 3
Bypass 1
ID 32
Boundary scan 109
Instruction Codes
Instruction Code Description
EXTEST 000 Captures the input and output ring contents.
IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO.
This operation does not affect SRAM operation.
SAMPLE Z 010 Captures the input and output contents. Places the boundary scan register between TDI and
TDO. Forces all SRAM output drivers to a high Z state.
RESERVED 011 Do Not Use: This instruction is reserved for future use.
SAMPLE/PRELOAD 100 Captures the input and output ring contents. Places the boundary scan register between TDI
and TDO. Does not affect the SRAM operation.
RESERVED 101 Do Not Use: This instruction is reserved for future use.
RESERVED 110 Do Not Use: This instruction is reserved for future use.
BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM
operation.
CYRS1543AV18
CYRS1545AV18
Document Number: 001-60007 Rev. *L Page 20 of 34
Boundary Scan Order
Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bump ID
0 6R 28 10G 56 6A 84 1J
16P299G575B852J
2 6N 30 11F 58 5A 86 3K
3 7P 31 11G 59 4A 87 3J
47N 329F 605C 882K
5 7R 33 10F 61 4B 89 1K
6 8R 34 11E 62 3A 90 2L
7 8P 35 10E 63 2A 91 3L
8 9R 36 10D 64 1A 92 1M
9 11P 37 9E 65 2B 93 1L
10 10P 38 10C 66 3B 94 3N
11 10N 39 11D 67 1C 95 3M
12 9P 40 9C 68 1B 96 1N
13 10M 41 9D 69 3D 97 2M
14 11N 42 11B 70 3C 98 3P
15 9M 43 11C 71 1D 99 2N
16 9N 44 9B 72 2C 100 2P
17 11L 45 10B 73 3E 101 1P
18 11M 46 11A 74 2D 102 3R
19 9L 47 10A 75 2E 103 4R
20 10L 48 9A 76 1E 104 4P
21 11 K 49 8B 77 2F 105 5P
22 10K 50 7C 78 3F 106 5N
23 9J 51 6C 79 1G 107 5R
24 9K 52 8A 80 1F 108 Internal
25 10J 53 7A 81 3G
26 11J 54 7B 82 2G
27 11H 55 6B 83 1H
CYRS1543AV18
CYRS1545AV18
Document Number: 001-60007 Rev. *L Page 21 of 34
Power Up Sequence in QDR II+ SRAM
QDR II+ SRAMs must be powered up and initialized in a
predefined manner to prevent undefined operations.
Power Up Sequence
■ Apply power and drive DOFF either HIGH or LOW (All other
inputs can be HIGH or LOW).
❐ Apply V
DD
before V
DDQ
.
❐ Apply V
DDQ
before V
REF
or at the same time as V
REF
.
❐ Drive DOFF HIGH.
■ Provide stable DOFF (HIGH), power and clock (K, K) for 10240
cycles to lock the DLL.
DLL Constraints
■ DLL uses K clock as its synchronizing input. The input must
have low phase jitter, which is specified as t
KC Var
.
■ The DLL functions at frequencies down to 120 MHz.
■ If the input clock is unstable and the DLL is enabled, then the
DLL may lock onto an incorrect frequency, causing unstable
SRAM behavior. To avoid this, provide 10240 cycles stable
clock to relock to the desired clock frequency.
Figure 4. Power Up Waveforms
K
K
Fix HIGH (tie to V
DDQ
)
V
DD
/V
DDQ
DOFF
Clock Start (Clock Starts after V
DD
/V
DDQ
is Stable)
Unstable Clock > 10240 Stable Clock
Start Normal
Operation
~
~
V
DD
/V
DDQ
Stable (<
+
0.1V DC per 50 ns)
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5962F1120202QXA

Mfr. #:
Buy 5962F1120202QXA
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 72M PARALLEL 165CCGA
Lifecycle:
New from this manufacturer.
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