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0W888-002-XTP

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30
BELASIGNA 250
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25
to an SPI EEPROM for boot, the designer can choose to
connect the SPI_CS pin to the EEPROM or use a GPIO
(high at boot) for a design with several daisy−chained
SPI devices.
• PCM interface for high−bandwidth digital audio I/O.
This interface comes with configurable input and output
buffers for reduced interrupt handling overhead when
BELASIGNA 250 is used in an audio streaming
application.
• Configurable high−speed RS−232 universal
asynchronous receiver/transmitter (UART).
• RS−232−based communications port for debugging and
in−circuit emulation. This interface can also be used to
send analog audio data to the input stage.
• Two−wire synchronous serial (TWSS) interface
compatible with the I
2
C protocol and with speeds up to
100 kbps at 1.28 MHz MCLK and up to 400 kbps at
MCLKs higher than 1.92 MHz. Supports master and
slave operation.
Assembly Information
Carrier Details
7 x 7 mm LFBGA
ON Semiconductor offers tape and reel packing for
BELASIGNA 250 LFBGA packages. The packing consists
of a pocketed carrier tape, a cover tape, and a molded
anti−static polystyrene reel. The carrier and cover tape
create an ESD safe environment, protecting the components
from physical and electrostatic damage during shipping and
handling.
BELASIGNA 250
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26
Figure 11. Package Orientation on Tape
Quantity per Reel: 1500 units A = 13 inches
Pin 1 Orientation: Upper Left B = 16 mm
Each complete reel contains 1500 parts. C = 4 inches
Brand: PEAK D = 14 mm
P/N: CP3−BG0707−16−12.0B4
1. Measured from the centerline of sprocket hole to centerline of the pocket hole and from the centerline of sprocket hole to centerline
of the pocket.
2. Cumulative tolerance of 10 sprocket holes is ±0.20.
3. This thickness is applicable as measured at the edge of the tape.
4. Material: conductive polystyrene.
5. Dimensions in mm.
6. Allowable camber to be 1 mm per 100 mm in length, non−cumulative over 250 mm.
7. Unless otherwise specified, tolerance ±0.10.
8. Measurement point to be 0.3 from bottom pocket.
9. Surface resistivity less than or equal to 1.0X10E9 W
2
.
Figure 12. Carrier Tape Drawing
BELASIGNA 250
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27
5 x 5 mm CABGA
ON Semiconductor offers tape and reel packing for
BELASIGNA 250 CABGA packages. The packing consists
of a pocketed carrier tape, a cover tape, and a molded
anti−static polystyrene reel. The carrier and cover tape
create an ESD safe environment, protecting the components
from physical and electrostatic damage during shipping and
handling.
Figure 13. Package Orientation on Tape
Quantity per Reel: 5000 units A = 13 inches
Pin 1 Orientation: Upper Left B = 12 mm
Each complete reel contains 5000 parts. C = 4 inches
Brand: ADVANTEK D = 13 mm
P/N: ML0505−AC410.P1 (CW)
Figure 14. CABGA Carrier Tape Drawing
1. 10 sprockets hole pitch cumulative tolerance ±0.2.
2. Camber in compliance with EIA 481.
3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30

0W888-002-XTP

Mfr. #:
Buy 0W888-002-XTP
Manufacturer:
ON Semiconductor
Description:
Digital Signal Processors & Controllers - DSP, DSC BELASIGNA 250 LFBGA 7X7
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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