Parameter Y Versions Units Conditions/Comments
LOGIC OUTPUTS (Continued))
V
OH
, Output High Voltage DV
DD
– 0.6 V min I
SOURCE
= 100 µA with DV
DD
= 3 V. Except for MCLK OUT
12
Floating State Leakage Current ±10 µA max
Floating State Output Capacitance
13
9 pF typ
D
ata Output Coding Binary Unipolar Mode
Offset Binary Bipolar Mode
TRANSDUCER BURNOUT
14
Current 1 µA nom
Initial Tolerance ±10 % typ
Drift 0.1 %/°C typ
SYSTEM CALIBRATION
Positive Full-Scale Calibration Limit
15
(1.05 × V
REF
)/GAIN V max GAIN Is the Selected PGA Gain (Between 1 and 128)
Negative Full-Scale Calibration Limit
15
–(1.05 × V
REF
)/GAIN V max GAIN Is the Selected PGA Gain (Between 1 and 128)
Offset Calibration Limit
16
–(1.05 × V
REF
)/GAIN V max GAIN Is the Selected PGA Gain (Between 1 and 128)
Input Span
16
0.8 × V
REF
/GAIN V min GAIN Is the Selected PGA Gain (Between 1 and 128)
(2.1 × V
REF
)/GAIN V max GAIN Is the Selected PGA Gain (Between 1 and 128)
POWER REQUIREMENTS
Power Supply Voltages
AV
DD
Voltage +2.7 to +3.3 or V
+4.75 to +5.25 V For Specified Performance
DV
DD
Voltage +2.7 to +5.25 V For Specified Performance
Power Supply Currents
AV
DD
Current AV
DD
= 3 V or 5␣ V. BST Bit of Filter High Register = 0
17
, CLKDIS = 1
0.28 mA max Typically 0.22 mA. BUFFER = 0 V. f
CLK IN
= 1␣ MHz or 2.4576␣ MHz
0.6 mA max Typically 0.45 mA. BUFFER = DV
DD
. f
CLK IN
= 1␣ MHz or 2.4576␣ MHz
AV
DD
= 3 V or 5␣ V. BST Bit of Filter High Register = 1
17
0.5 mA max Typically 0.38␣ mA. BUFFER = 0␣ V. f
CLK IN
= 2.4576␣ MHz
1.1 mA max Typically 0.8␣ mA. BUFFER = DV
DD
. f
CLK IN
= 2.4576␣ MHz
DV
DD
Current
18
Digital I/Ps = 0␣ V or DV
DD.
External MCLK IN, CLKDIS = 1
0.080 mA max Typically 0.06␣ mA. DV
DD
= 3 V. f
CLK IN
= 1␣ MHz
0.16 mA max Typically 0.13␣ mA. DV
DD
= 5␣ V. f
CLK IN
= 1␣ MHz
0.18 mA max Typically 0.15␣ mA. DV
DD
= 3 V. f
CLK IN
= 2.4576␣ MHz
0.35 mA max Typically 0.3 mA. DV
DD
= 5␣ V. f
CLK IN
= 2.4576␣ MHz
Power Supply Rejection
19
See Note 20 dB typ
Normal-Mode Power Dissipation
18
AV
DD
= DV
DD
= +3 V. Digital I/Ps = 0␣ V or DV
DD
. External MCLK IN
BST Bit of Filter High Register = 0
17
1.05 mW max Typically 0.84␣ mW. BUFFER = 0␣ V. f
CLK IN
= 1␣ MHz. BST Bit = 0
2.04 mW max Typically 1.53␣ mW. BUFFER = +3 V. f
CLK IN
= 1␣ MHz. BST Bit = 0
1.35 mW max Typically 1.11␣ mW. BUFFER = 0␣ V. f
CLK IN
= 2.4576␣ MHz. BST Bit = 0
2.34 mW max Typically 1.9␣ mW. BUFFER = +3 V. f
CLK IN
= 2.4576␣ MHz. BST Bit = 0
Normal-Mode Power Dissipation AV
DD
= DV
DD
= +5␣ V. Digital I/Ps = 0␣ V or DV
DD
. External MCLK IN
2.1 mW max Typically 1.75 mW. BUFFER = 0␣ V. f
CLK IN
= 1␣ MHz. BST Bit = 0
3.75 mW max Typically 2.9 mW. BUFFER = +5␣ V. f
CLK IN
= 1␣ MHz. BST Bit = 0
3.1 mW max Typically 2.6␣ mW. BUFFER = 0␣ V. f
CLK IN
= 2.4576␣ MHz. BST Bit = 0
4.75 mW max Typically 3.75␣ mW. BUFFER = +5␣ V. f
CLK IN
= 2.4576␣ MHz. BST Bit = 0
Standby (Power-Down) Current
21
18 µA max External MCLK IN = 0 V or DV
DD
. Typically 9␣ µA. V
DD
= +5 V
Standby (Power-Down) Current
21
10 µA max External MCLK IN = 0 V or DV
DD
. Typically 4␣ µA. V
DD
= +3 V
NOTES
1
Temperature range is as follows: Y Version: –40°C to +105°C.
2
A calibration is effectively a conversion so these errors will be of the order of the conversion noise shown in Tables I to IV. This applies after calibration at the temperature of interest.
3
Recalibration at any temperature will remove these drift errors.
4
Positive Full-Scale Error includes Zero-Scale Errors (Unipolar Offset Error or Bipolar Zero Error) and applies to both unipolar and bipolar input ranges.
5
Full-Scale Drift includes Zero-Scale Drift (Unipolar Offset Drift or Bipolar Zero Drift) and applies to both unipolar and bipolar input ranges.
6
Gain Error does not include Zero-Scale Errors. It is calculated as Full-Scale Error—Unipolar Offset Error for unipolar ranges and Full-Scale Error—Bipolar Zero Error for
bipolar ranges.
7
Gain Error Drift does not include Unipolar Offset Drift/Bipolar Zero Drift. It is effectively the drift of the part if zero-scale calibrations only were performed as is the case with background calibration.
8
These numbers are guaranteed by design and/or characterization.
9
The common-mode voltage range on the input pairs applies provided the absolute input voltage specification is obeyed.
10
The input voltage range on the analog inputs is given here with respect to the voltage on the respective negative input of its differential or pseudo-differential pair. See Table VII for which
inputs form differential pairs.
11
V
REF
= REF IN(+) – REF IN(–).
12
These logic output levels apply to the MCLK OUT output only when it is loaded with a single CMOS load.
13
Sample tested at +25°C to ensure compliance.
14
See Burnout Current section.
15
After calibration, if the input voltage exceeds positive full scale, the converter will output all 1s. If the input is less than negative full scale, then the device outputs all 0s.
16
These calibration and span limits apply provided the absolute voltage on the analog inputs does not exceed AV
DD
+ 30␣ mV or go more negative than AGND␣ –␣ 30␣ mV. The offset calibration
limit applies to both the unipolar zero point and the bipolar zero point.
17
For higher gains (8) at f
CLK␣ IN
= 2.4576␣ MHz, the BST bit of the Filter High Register must be set to 1. For other conditions, it can be set to 0.
18
When using a crystal or ceramic resonator across the MCLK pins as the clock source for the device, the DV
DD
current and power dissipation will vary depending on the crystal or resonator
type (see Clocking and Oscillator Circuit section).
19
Measured at dc and applies in the selected passband. PSRR at 50 Hz will exceed 120 dB with filter notches of 5 Hz, 10 Hz, 25 Hz or 50 Hz. PSRR at 60 Hz will exceed 120 dB with filter
notches of 6 Hz, 10 Hz, 30 Hz or 60 Hz.
20
PSRR depends on gain.
Gain 1 2 4 8–128
AV
DD
= 3 V 86 dB 78 dB 85 dB 93 dB
AV
DD
= 5 V 90 dB 78 dB 84 dB 91 dB
21
If the external master clock continues to run in standby mode, the standby current increases to 150 µA typical with 5 V supplies and 75 µA typical with 3.3 V supplies. When using a crystal
or ceramic resonator across the MCLK pins as the clock source for the device, the internal oscillator continues to run in standby mode and the power dissipation depends on the crystal or
resonator type (see Standby Mode section).
Specifications subject to change without notice.
AD7714Y
REV. C
–6–
2
AD7714
REV. C
–7–
ORDERING GUIDE
AV
DD
Temperature Package
Model Supply Range Option*
AD7714AN-5 5 V –40°C to +85°C N-24
AD7714AR-5 5 V –40°C to +85°C R-24
AD7714ARS-5 5 V –40°C to +85°C RS-28
AD7714AN-3 3 V –40°C to +85°C N-24
AD7714AR-3 3 V –40°C to +85°C R-24
AD7714ARS-3 3 V –40°C to +85°C RS-28
AD7714YN 3 V/5 V –40°C to +105°C N-24
AD7714YR 3 V/5 V –40°C to +105°C R-24
AD7714YRU 3 V/5 V –40°C to +105°C RU-24
AD7714AChips-5 5 V –40°C to +85°CDie
AD7714AChips-3 3 V –40°C to +85°CDie
EVAL-AD7714-5EB 5 V Evaluation Board
EVAL-AD7714-3EB 3 V Evaluation Board
*N = Plastic DIP; R = SOIC; RS = SSOP; RU = Thin Shrink Small Outline.
TIMING CHARACTERISTICS
1, 2
(AV
DD
= DV
DD
= +2.7 V to +5.25 V; AGND = DGND = 0 V; f
CLKIN
= 2.5␣ MHz; Input Logic 0 = 0 V,
Logic 1 = DV
DD
unless otherwise noted.)
Limit at T
MIN
, T
MAX
Parameter (A, Y Versions) Units Conditions/Comments
f
CLKIN
3, 4
400 kHz min Master Clock Frequency: Crystal/Resonator or Externally
Supplied
2.5 MHz max For Specified Performance
t
CLK IN LO
0.4 × t
CLK IN
ns min Master Clock Input Low Time. t
CLK IN
= 1/f
CLK IN
t
CLK IN HI
0.4 × t
CLK IN
ns min Master Clock Input High Time
t
DRDY
500 × t
CLK IN
ns nom DRDY High Time
t
1
100 ns min SYNC Pulsewidth
t
2
100 ns min RESET Pulsewidth
Read Operation
t
3
0 ns min DRDY to CS Setup Time
t
4
0 ns min CS Falling Edge to SCLK Active Edge Setup Time
5
t
5
6
0 ns min SCLK Active Edge to Data Valid Delay
5
80 ns max DV
DD
= +5␣ V
100 ns max DV
DD
= +3␣ V
t
6
100 ns min SCLK High Pulsewidth
t
7
100 ns min SCLK Low Pulsewidth
t
8
0 ns min CS Rising Edge to SCLK Active Edge Hold Time
5
t
9
7
10 ns min Bus Relinquish Time after SCLK Active Edge
5
60 ns max DV
DD
= +5␣ V
100 ns max DV
DD
= +3␣ V
t
10
100 ns max SCLK Active Edge to DRDY High
5, 8
Write Operation
t
11
0 ns min CS Falling Edge to SCLK Active Edge Setup Time
5
t
12
30 ns min Data Valid to SCLK Edge Setup Time
t
13
20 ns min Data Valid to SCLK Edge Hold Time
t
14
100 ns min SCLK High Pulsewidth
t
15
100 ns min SCLK Low Pulsewidth
t
16
0 ns min CS Rising Edge to SCLK Edge Hold Time
NOTES
1
Sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of DV
DD
) and timed from a voltage level of 1.6 V.
2
See Figures 6 and 7. Timing applies for all grades.
3
CLKIN Duty Cycle range is 45% to 55%. CLKIN must be supplied whenever the AD7714 is not in standby mode. If no clock is present in this case, the device can
draw higher current than specified and possibly become uncalibrated.
4
The AD7714 is production tested with f
CLKIN
at 2.4576␣ MHz (1␣ MHz for some I
DD
tests). It is guaranteed by characterization to operate at 400␣ kHz.
5
SCLK active edge is falling edge of SCLK with POL = 1; SCLK active edge is rising edge of SCLK with POL = 0.
6
These numbers are measured with the load circuit of Figure 1 and defined as the time required for the output to cross the V
OL
or V
OH
limits.
7
These numbers are derived from the measured time taken by the data output to change 0.5␣ V when loaded with the circuit of Figure 1. The measured number is then
extrapolated back to remove effects of charging or discharging the 100 pF capacitor. This means that the times quoted in the timing characteristics are the true bus
relinquish times of the part and as such are independent of external bus loading capacitances.
8
DRDY returns high after the first read from the device after an output update. The same data can be read again, if required, while DRDY is high although care
should be taken that subsequent reads do not occur close to the next output update.
Specifications subject to change without notice.
Figure 1. Load Circuit for Access Time and Bus
Relinquish Time
TO OUTPUT
PIN
50pF
I
SINK
(800mA AT DV
DD
= +5V
100mA AT DV
DD
= +3.3V)
+1.6V
I
SOURCE
(200mA AT DV
DD
= +5V
100mA AT DV
DD
= +3.3V)
AD7714
REV. C–8–
DIP and SOIC/TSSOP
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
AV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3␣ V to +7␣ V
DV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3␣ V to +7␣ V
DV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3␣ V to +7␣ V
Analog Input Voltage to AGND . . . . . –0.3 V to AV
DD
+ 0.3␣ V
Reference Input Voltage to AGND . . . –0.3 V to AV
DD
+ 0.3␣ V
Digital Input Voltage to DGND . . . . . –0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to DV
DD
+ 0.3 V
Operating Temperature Range
Commercial (A Version) . . . . . . . . . . . . . . . 40°C to +85°C
Extended (Y Version) . . . . . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . .+260°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 109°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 128°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may still
occur on these devices if they are subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS
SSOP
SCLK
MCLK IN
DGND
DV
DD
SYNC
AIN1
DRDY
CS
AGND
MCLK OUT
POL
DIN
DOUT
AIN2
AIN6
AIN3 AIN5
AIN4
STANDBY
AV
DD
TOP VIEW
(Not to Scale)
AD7714
RESET
REF IN(+)
REF IN(–)
BUFFER
NC = NO CONNECT
SCLK
MCLK IN
DGND
DV
DD
SYNC
RESET
NC
DRDY
CS
NC
MCLK OUT
POL
DIN
DOUT
NC
NC
AIN1
AGND
AIN2
AIN6
AIN3
AIN5
AIN4
REF IN(+)
STANDBY
REF IN(–)
AV
DD
BUFFER
TOP VIEW
(Not to Scale)
AD7714
WARNING!
ESD SENSITIVE DEVICE

AD7714ARSZ-5REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC CMOS 3V/5V 500uA 24B Signal Condition
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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