REV. B
–34–
AD7853/AD7853L
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead Plastic DIP
(N-24)
PIN 1 0.260 ± 0.001
(6.61 ± 0.03)
24
1
13
12
0.32 (8.128)
0.30 (7.62)
0.011 (0.28)
0.009 (0.23)
15
°
0
0.02 (0.5)
0.016 (0.41)
0.130 (3.30)
0.128 (3.25)
0.07 (1.78)
0.05 (1.27)
SEATING
PLANE
1.228 (31.19)
1.226 (31.14)
0.11 (2.79)
0.09 (2.28)
NOTES
1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead Small Outline Package
(R-24)
0.013 (0.32)
0.009 (0.23)
0.042 (1.067)
0.018 (0.447)
6
°
0
°
0.03 (0.76)
0.02 (0.51)
PIN 1
0.299 (7.6)
0.291 (7.39)
0.414 (10.52)
0.398 (10.10)
13
12
1
24
0.019 (0.49)
0.014 (0.35)
0.05 (1.27)
BSC
0.096 (2.44)
0.089 (2.26)
0.608 (15.45)
0.596 (15.13)
0.01 (0.254)
0.006 (0.15)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
24-Lead Shrink Small Outline Package
(RS-24)
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
0.009 (0.229)
0.005 (0.127)
0.037 (0.94)
0.022 (0.559)
8°
0°
0.0256 (0.65)
BSC
0.07 (1.78)
0.066 (1.67)
0.328 (8.33)
0.318 (8.08)
0.008 (0.203)
0.002 (0.050)
PIN 1
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.207)
1
24
13
12
PRINTED IN U.S.A.
C2024b–2.5–11/98
