REV. B
–4–
AD7853/AD7853L
TIMING SPECIFICATIONS
1
Limit at T
MIN
, T
MAX
(A, B Versions)
Parameter 5 V 3 V Units Description
f
CLKIN
2
500 500 kHz min Master Clock Frequency
4 4 MHz max
1.8 1.8 MHz max L Version, 0°C to +70°C, B Grade Only
1 1 MHz max L Version, –40°C to +85°C
f
SCLK
3
4 4 MHz max Interface Modes 1, 2, 3 (External Serial Clock)
f
CLKIN
f
CLKIN
MHz max Interface Modes 4, 5 (Internal Serial Clock)
t
1
4
100 100 ns min CONVST Pulsewidth
t
2
50 90 ns max CONVST to BUSY Propagation Delay
t
CONVERT
4.6 4.6 µs max Conversion Time = 18 t
CLKIN
10 (18) 10 (18) µs max L Version 1.8 (1) MHz CLKIN. Conversion Time = 18 t
CLKIN
t
3
–0.4 t
SCLK
–0.4 t
SCLK
ns min SYNC to SCLK Setup Time (Noncontinuous SCLK Input)
⫿0.4 t
SCLK
⫿0.4 t
SCLK
ns min/max SYNC to SCLK Setup Time (Continuous SCLK Input)
t
4
0.6 t
SCLK
0.6 t
SCLK
ns min SYNC to SCLK Setup Time. Interface Mode 4 Only
t
5
5
50 90 ns max Delay from SYNC until DOUT 3-State Disabled
t
5A
5
50 90 ns max Delay from SYNC until DIN 3-State Disabled
t
6
5
75 115 ns max Data Access Time After SCLK
t
7
40 60 ns min Data Setup Time Prior to SCLK
t
8
20 30 ns min Data Valid to SCLK Hold Time
t
9
6
0.4 t
SCLK
0.4 t
SCLK
ns min SCLK High Pulsewidth (Interface Modes 4 and 5)
t
10
6
0.4 t
SCLK
0.4 t
SCLK
ns min SCLK Low Pulsewidth (Interface Modes 4 and 5)
t
11
30 50 ns min SCLK to SYNC Hold Time (Noncontinuous SCLK)
30/0.4 t
SCLK
50/0.4 t
SCLK
ns min/max (Continuous SCLK) Does Not Apply to Interface Mode 3
t
11A
50 50 ns max SCLK to SYNC Hold Time
t
12
7
50 50 ns max Delay from SYNC until DOUT 3-State Enabled
t
13
90 130 ns max Delay from SCLK to DIN Being Configured as Output
t
14
8
50 90 ns max Delay from SCLK to DIN Being Configured as Input
t
15
2.5 t
CLKIN
2.5 t
CLKIN
ns max CAL to BUSY Delay
t
16
2.5 t
CLKIN
2.5 t
CLKIN
ns max CONVST to BUSY Delay in Calibration Sequence
t
CAL
9
31.25 31.25 ms typ Full Self-Calibration Time, Master Clock Dependent
(125013 t
CLKIN
)
t
CAL1
9
27.78 27.78 ms typ Internal DAC Plus System Full-Scale Cal Time, Master Clock
Dependent (111114 t
CLKIN
)
t
CAL2
9
3.47 3.47 ms typ System Offset Calibration Time, Master Clock Dependent
(13899 t
CLKIN
)
NOTES
Descriptions that refer to SCLK (rising) or SCLK (falling) edges here are with the POLARITY pin HIGH. For the POLARITY pin LOW then the opposite edge of
SCLK will apply.
1
Sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD
) and timed from a voltage level of 1.6 V. See
Table X and timing diagrams for different interface modes and calibration.
2
Mark/Space ratio for the master clock input is 40/60 to 60/40.
3
For Interface Modes 1, 2, 3 the SCLK max frequency will be 4 MHz. For Interface Modes 4 and 5 the SCLK will be an output and the frequency will be f
CLKIN
.
4
The CONVST pulsewidth will apply here only for normal operation. When the part is in power-down mode, a different CONVST pulsewidth will apply (see Power-
Down section).
5
Measured with the load circuit of Figure 1 and defined as the time required for the output to cross 0.8 V or 2.4 V.
6
For self-clocking mode (Interface Modes 4, 5) the nominal SCLK high and low times will be 0.5 t
SCLK
= 0.5 t
CLKIN
.
7
t
12
is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated
back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time, t
12
, quoted in the timing characteristics is the true bus relin-
quish time of the part and is independent of the bus loading.
8
t
14
is derived form the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 1. The measured number is then extrapolated
back to remove the effects of charging or discharging the 100 pF capacitor. This means that the time quoted in the timing characteristics is the true delay of the part
in turning off the output drivers and configuring the DIN line as an input. Once this time has elapsed the user can drive the DIN line knowing that a bus conflict will
not occur.
9
The typical time specified for the calibration times is for a master clock of 4 MHz. For the L version the calibration times will be longer than those quoted here due to
the 1.8/1 MHz master clock.
Specifications subject to change without notice.
(AV
DD
= DV
DD
= +3.0 V to +5.5 V; f
CLKIN
= 4 MHz for AD7853 and 1.8/1 MHz for AD7853L; T
A
= T
MIN
to
T
MAX
, unless otherwise noted)
REV. B
–5–
AD7853/AD7853L
TYPICAL TIMING DIAGRAMS
Figures 2 and 3 show typical read and write timing diagrams.
Figure 2 shows the reading and writing after conversion in In-
terface Modes 2 and 3. To attain the maximum sample rate of
100 kHz (AD7853L) or 200 kHz (AD7853) in Interface Modes
2 and 3, reading and writing must be performed during conver-
sion. Figure 3 shows the timing diagram for Interface Modes 4
and 5 with sample rate of 100 kHz (AD7853L) or 200 kHz
(AD7853). At least 400 ns acquisition time must be allowed
(the time from the falling edge of BUSY to the next rising edge
of CONVST) before the next conversion begins to ensure that
the part is settled to the 12-bit level. If the user does not want to
provide the CONVST signal, the conversion can be initiated in
software by writing to the control register.
TO OUTPUT
PIN
+2.1V
I
OH
1.6mA
200mA
I
OL
C
L
100pF
Figure 1. Load Circuit for Digital Output Timing
Specifications
POLARITY PIN LOGIC HIGH
SYNC (I/P)
SCLK (I/P)
t
3
BUSY (O/P)
CONVST (I/P)
t
2
t
1
t
5
t
11
t
6
t
9
t
10
15616
t
12
t
6
DOUT (O/P)
DB0DB11
t
8
DB15 DB0
THREE-
STATE
DB11
THREE-
STATE
DB15
t
CONVERT
t
7
t
CONVERT
= 4.6ms MAX, 10ms FOR L VERSION
t
1
= 100 ns MIN,
t
5
= 50/90 ns MAX 5V/3V,
t
7
= 40/60 ns MIN 5V/3V
Figure 2. AD7853/AD7853L Timing Diagram (Typical Read and Write Operation for Interface Modes 2, 3)
POLARITY PIN LOGIC HIGH
SYNC (O/P)
DOUT (O/P)
SCLK (O/P)
DB0DB11
t
4
t
8
DIN (I/P)
DB15 DB0
THREE-
STATE
BUSY (O/P)
CONVST (I/P)
DB11
t
2
t
1
t
7
t
11
t
6
t
9
t
10
THREE-
STATE
15616
t
12
t
5
DB15
t
CONVERT
t
CONVERT
= 4.6ms MAX, 10ms FOR L VERSION
t
1
= 100 ns MIN, t
5
= 50/90 ns MAX 5V/3V, t
7
= 40/60 ns MIN 5V/3V
Figure 3. AD7853/AD7853L Timing Diagram (Typical Read and Write Operation for Interface Modes 4, 5)
REV. B
–6–
AD7853/AD7853L
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
AV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . –0.3 V to AV
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . –0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DV
DD
+ 0.3 V
REF
IN
/REF
OUT
to AGND . . . . . . . . . –0.3 V to AV
DD
+ 0.3 V
Input Current to Any Pin Except Supplies
2
. . . . . . . . ±10 mA
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
θ
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W
Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260°C
SOIC, SSOP Package, Power Dissipation . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . 75°C/W (SOIC) 115°C/W (SSOP)
θ
JC
Thermal Impedance . . . . 25°C/W (SOIC) 35°C/W (SSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >3 kV
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
ORDERING GUIDE
Linearity Power
Error Dissipation Package
Model (LSB)
1
(mW) Options
2
AD7853AN ±1 20 N-24
AD7853BN ±1/2 20 N-24
AD7853LAN
3
±1 6.85 N-24
AD7853LBN
3
±1 6.85 N-24
AD7853AR ±1 20 R-24
AD7853BR ±1/2 20 R-24
AD7853LAR
3
±1 6.85 R-24
AD7853LBR
3
±1 6.85 R-24
AD7853ARS ±1 6.85 RS-24
AD7853LARS
3
±1 6.85 RS-24
EVAL-AD7853CB
4
EVAL-CONTROL BOARD
5
NOTES
1
Linearity error refers to the integral linearity error.
2
N = Plastic DIP; R = SOIC; RS = SSOP.
3
L signifies the low power version.
4
This can be used as a stand-alone evaluation board or in conjunction with the
EVAL-CONTROL BOARD for evaluation/demonstration purposes.
5
This board is a complete unit allowing a PC to control and communicate with
all Analog Devices, Inc. evaluation boards ending in the CB designators.
PIN CONFIGURATIONS
DIP, SOIC AND SSOP
CAL
SCLK
SM2
SLEEP
REF
IN
/REF
OUT
BUSY
AIN(+)
AV
DD
AGND
CREF1
CREF2
AIN(–)
CONVST
DV
DD
SYNC
1
2
3
7
24
23
22
21
20
19
18
17
16
15
14
13
8
9
10
11
12
4
5
6
CLKIN
DIN
DOUT
DGND
AMODE
POLARITY
SM1
NC
AGND
NC = NO CONNECT
TOP VIEW
(Not to Scale)
AD7853/53L

AD7853ARZ-REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 3-5V SGL Supply 200kSPS 12B
Lifecycle:
New from this manufacturer.
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