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LPC2458FET180,551
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
P52-P54
P55-P57
P58-P60
P61-P63
P64-P66
P67-P69
P70-P72
P73-P75
P76-P78
P79-P81
LPC2458
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 4.1 — 15 October 2013
73 of 81
NXP Semiconductors
LPC2458
Single-chip 1
6-bit/32-bit micro
14.6
Reset pin configuration
Fig 30.
Reset pin
configuration
V
SS
reset
002aaf274
V
DD
V
DD
V
DD
R
pu
ESD
ESD
20 ns RC
GLITCH FIL
TER
PIN
LPC2458
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 4.1 — 15 October 2013
74 of 81
NXP Semiconductors
LPC2458
Single-chip 1
6-bit/32-bit micro
15. Package
outline
Fig 31.
Package
outline SOT570-3 (TF
BGA180)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT570-3
SOT570-3
08-07-09
10-04-15
UNIT
mm
max
nom
min
1.20
1.06
0.95
0.40
0.35
0.30
0.50
0.45
0.40
12.1
12.0
11.9
12.1
12.0
11.9
0.8
10.4
0.15
0.12
A
DIMENSIONS (mm are the original dimensions)
TFBGA180: thin fine-pitch ball grid array package; 180 balls
0
5
10 mm
scale
A
1
A
2
0.80
0.71
0.65
b
D
E
e
e
1
10.4
e
2
v
w
0.05
y
y
1
0.1
ball A1
index area
B
A
D
E
C
y
C
y
1
X
A
B
C
D
E
F
H
K
G
L
J
M
N
P
2468
1
0
1
2
1
4
13579
1
1
1
3
b
e
2
e
1
e
e
1/2 e
1/2 e
A
C
B
∅
v
M
C
∅
w
M
ball A1
index area
detail X
A
A
2
A
1
LPC2458
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
.
2013. All rights rese
rved.
Product data sheet
Rev
. 4.1 — 15 October 2013
75 of 81
NXP Semiconductors
LPC2458
Single-chip 1
6-bit/32-bit micro
16. Soldering
Fig 32.
Reflow soldering of the T
FBGA180 package
DIMENSIONS in mm
PS
L
S
P
S
R
H
x
H
y
Hx
Hy
SOT570-3
solder land plus solder paste
occupied area
Footprint information for reflow soldering of TFBGA180 package
solder land
solder paste deposit
solder resist
P
P
SL
SP
SR
Generic footprint pattern
Refer to the package outline drawing for actual layout
detail X
see detail X
sot570-3_fr
0.80
0.400
0.400
0.550
12.575
12.575
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
P52-P54
P55-P57
P58-P60
P61-P63
P64-P66
P67-P69
P70-P72
P73-P75
P76-P78
P79-P81
LPC2458FET180,551
Mfr. #:
Buy LPC2458FET180,551
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 512KF/USBH/ENET
Lifecycle:
New from this manufacturer.
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LPC2458FET180,551