Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
1
Rev. 00D
06/02/08
IS42S32200E
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
FEATURES
Clock frequency: 200, 166, 143 MHz
Fully synchronous; all signals referenced to a
positive clock edge
Internal bank for hiding row access/precharge
Single 3.3V power supply
LVTTL interface
Programmable burst length:
(1, 2, 4, 8, full page)
Programmable burst sequence:
Sequential/Interleave
Self refresh modes
4096 refresh cycles every 64 ms
Random column address every clock cycle
Programmable CAS latency (2, 3 clocks)
Burst read/write and burst read/single write
operations capability
Burst termination by burst stop and precharge
command
Available in Industrial temperature grade
Available in 400-mil 86-pin TSOP II and 90-ball
BGA
Available in Lead free
Power Down and Deep Power Down Mode
Partial Array Self Refresh
Temperature Compensated Self Refresh
Output Driver Strength Selection
Please contact Production Manager for Mobile
function detail.
OVERVIEW
ISSI's 64Mb Synchronous DRAM IS42S32200E is organized
as 524,288 bits x 32-bit x 4-bank for improved performance.
The synchronous DRAMs achieve high-speed data transfer
using pipeline architecture. All inputs and outputs signals
refer to the rising edge of the clock input.
512K Bits x 32 Bits x 4 Banks (64-MBIT)
SYNCHRONOUS DYNAMIC RAM
ADVANCED INFORMATION
JUNE 2008
KEY TIMING PARAMETERS
Parameter -5 -6 -7 Unit
Clk Cycle Time
CAS Latency = 3 5 6 7 ns
CAS Latency = 2 10 10 10 ns
Clk Frequency
CAS Latency = 3 200 166 143 Mhz
CAS Latency = 2 100 100 100 Mhz
Access Time from Clock
CAS Latency = 3 4.5 5.5 5.5 ns
CAS Latency = 2 7.5 7.5 8 ns
2
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00D
06/02/08
IS42S32200E
GENERAL DESCRIPTION
The 64Mb SDRAM is a high speed CMOS, dynamic
random-access memory designed to operate in 3.3V
memory systems containing 67,108,864 bits. Internally
configured as a quad-bank DRAM with a synchronous
interface. Each 16,777,216-bit bank is organized as 2,048
rows by 256 columns by 32 bits.
The 64Mb SDRAM includes an AUTO REFRESH MODE,
and a power-saving, power-down mode. All signals are
registered on the positive edge of the clock signal, CLK.
All inputs and outputs are LVTTL compatible.
The 64Mb SDRAM has the ability to synchronously burst
data at a high data rate with automatic column-address
generation, the ability to interleave between internal banks
to hide precharge time and the capability to randomly
change column addresses on each clock cycle during
burst access.
A self-timed row precharge initiated at the end of the burst
sequence is available with the AUTO PRECHARGE
function enabled.
Precharge
one bank while accessing one
of the other three banks will hide the
precharge
cycles and
provide seamless, high-speed, random-access operation.
SDRAM
read and write accesses are burst oriented starting
at a selected location and continuing for a programmed
number of locations in a programmed sequence. The
registration of an ACTIVE command begins accesses,
followed by a READ or WRITE command. The ACTIVE
command in conjunction with address bits registered are
used to select the bank and row to be accessed (BA0, BA1
select the bank; A0-A10 select the row). The READ or
WRITE commands in conjunction with address bits reg-
istered are used to select the starting column location for
the burst access.
Programmable READ or WRITE burst lengths consist of
1, 2, 4 and 8 locations or full page, with a burst terminate
option.
FUNCTIONAL BLOCK DIAGRAM
CLK
CKE
CS
RAS
CAS
WE
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
A10
COMMAND
DECODER
&
CLOCK
GENERATOR
MODE
REGISTER
REFRESH
CONTROLLER
REFRESH
COUNTER
SELF
REFRESH
CONTROLLER
ROW
ADDRESS
LATCH
MULTIPLEXER
COLUMN
ADDRESS LATCH
BURST COUNTER
COLUMN
ADDRESS BUFFER
COLUMN DECODER
DATA I N
BUFFER
DATA OUT
BUFFER
DQM0-3
DQ 0-31
V
DD
/V
DDQ
GND/GNDQ
11
11
11
11
32
32 32
32
256
(x 32)
2048
2048
2048
ROW DECODER
2048
MEMORY CELL
ARRAY
BANK 0
SENSE AMP I/O GATE
BANK CONTROL LOGIC
ROW
ADDRESS
BUFFER
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
3
Rev. 00D
06/02/08
IS42S32200E
PIN CONFIGURATIONS
86 pin TSOP - Type II for x32
PIN DESCRIPTIONS
A0-A10 Row Address Input
A0-A7 Column Address Input
BA0, BA1 Bank Select Address
DQ0 to DQ31 Data I/O
CLK System Clock Input
CKE Clock Enable
CS Chip Select
RAS Row Address Strobe Command
CAS Column Address Strobe Command
V
DD
DQ0
V
DD
Q
DQ1
DQ2
V
SS
Q
DQ3
DQ4
V
DD
Q
DQ5
DQ6
V
SS
Q
DQ7
NC
V
DD
DQM0
WE
CAS
RAS
CS
NC
BA0
BA1
A10
A0
A1
A2
DQM2
V
DD
NC
DQ16
V
SS
Q
DQ17
DQ18
V
DD
Q
DQ19
DQ20
V
SS
Q
DQ21
DQ22
V
DD
Q
DQ23
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
V
SS
DQ15
V
SS
Q
DQ14
DQ13
V
DD
Q
DQ12
DQ11
V
SS
Q
DQ10
DQ9
V
DD
Q
DQ8
NC
V
SS
DQM1
NC
NC
CLK
CKE
A9
A8
A7
A6
A5
A4
A3
DQM3
V
SS
NC
DQ31
V
DD
Q
DQ30
DQ29
V
SS
Q
DQ28
DQ27
V
DD
Q
DQ26
DQ25
V
SS
Q
DQ24
V
SS
WE Write Enable
DQM0-DQM3 x32 Input/Output Mask
VDD Power
Vss Ground
VDDQ Power Supply for I/O Pin
VssQ Ground for I/O Pin
NC No Connection

IS42S32200E-6BI-TR

Mfr. #:
Manufacturer:
Description:
DRAM 64M (2Mx32) 166MHz SDRAM, 3.3v
Lifecycle:
New from this manufacturer.
Delivery:
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