NXP Semiconductors
PTN3700
1.8 V simple mobile interface link bridge IC
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 12 October 2011
Document identifier: PTN3700
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
20. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
7 Functional description . . . . . . . . . . . . . . . . . . . 9
7.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2 Link programmability . . . . . . . . . . . . . . . . . . . 10
7.3 Versatile signal mirroring programmability . . . 10
7.4 High-speed data channel protocol options . . . 12
7.4.1 Serial protocol bit mapping - pseudo source
synchronous mode (FSS = LOW). . . . . . . . . . 13
7.4.2 Serial protocol bit mapping - fully source
synchronous mode (FSS = HIGH) . . . . . . . . . 14
7.4.3 PLL, PCLK, CLK and pixel synchronization . . 15
7.4.3.1 Pixel synchronization . . . . . . . . . . . . . . . . . . . 15
7.4.3.2 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.4.4 HS
, VS and DE signal usage in various
PTN3700 modes. . . . . . . . . . . . . . . . . . . . . . . 15
7.4.4.1 PSS mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.4.4.2 FSS mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.5 Power modes . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.6 Link error detection and correction. . . . . . . . . 18
7.7 Frame Mixing and Advanced Frame Mixing . . 19
7.8 Auxiliary signals . . . . . . . . . . . . . . . . . . . . . . . 20
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 20
9 Recommended operating conditions. . . . . . . 20
10 Static characteristics. . . . . . . . . . . . . . . . . . . . 21
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 23
11.1 Transmitter mode . . . . . . . . . . . . . . . . . . . . . . 23
11.2 Receiver mode . . . . . . . . . . . . . . . . . . . . . . . . 24
11.3 Power-on/power-off sequence . . . . . . . . . . . . 26
11.3.1 Power-on sequence . . . . . . . . . . . . . . . . . . . . 26
11.3.2 Power-off sequence . . . . . . . . . . . . . . . . . . . . 27
11.4 High-speed signaling channel . . . . . . . . . . . . 28
12 Application information. . . . . . . . . . . . . . . . . . 30
12.1 Typical lane and PCLK configurations . . . . . . 30
12.2 Pin configurations for various topologies
of PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
12.3 Power decoupling configuration . . . . . . . . . . . 32
12.4 PCB/Flex layout guideline . . . . . . . . . . . . . . . 32
12.5 Power-on/power-off requirement . . . . . . . . . . 32
13 Test information . . . . . . . . . . . . . . . . . . . . . . . 33
13.1 High-speed signaling channel
measurements . . . . . . . . . . . . . . . . . . . . . . . . 33
14 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 36
15 Soldering of SMD packages. . . . . . . . . . . . . . 37
15.1 Introduction to soldering. . . . . . . . . . . . . . . . . 37
15.2 Wave and reflow soldering. . . . . . . . . . . . . . . 37
15.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 37
15.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 38
16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 39
17 Revision history . . . . . . . . . . . . . . . . . . . . . . . 40
18 Legal information . . . . . . . . . . . . . . . . . . . . . . 41
18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 41
18.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 41
18.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42
19 Contact information . . . . . . . . . . . . . . . . . . . . 42
20 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
