AD1940/AD1941
Rev. B | Page 6 of 36
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter Min Max Unit
VDD to DGND –0.3 +3.0 V
PLL_ VDD to PGND –0.3 +3.0 V
OD VDD to DGND –0.3 +6.0 V
INVDD to DGND ODVDD +6.0 V
Digital Inputs DGND – 0.3 INVDD + 0.3 V
Maximum Junction
Temperature
135 °C
Storage Temperature
Range
–65 +150 °C
Soldering (10 sec) 300 °C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 9. Package Characteristics
Parameter Min Typ Max Unit
θ
JA
Thermal Resistance (Junction-
to-Ambient)
72 °C/W
θ
JC
Thermal Resistance (Junction-
to-Case)
19.5 °C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.