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P82B96TD/S900,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32
P82B96_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 10 November 2009 22 of 32
NXP Semiconductors
P82B96
Dual bidirectional bus buffer
Question: If we add 100 Ω to 200 Ω at signal line, the overshoot becomes slightly
smaller. Is this a good idea?
Answer: No, it is not necessary to add any resistance. When the logic signal generated
by Tx or Ty of P82B96 drives long traces or wiring with ICs other than P82B96 being
driven, then adding a Schottky diode (BAT54A) as shown in Figure 24 will clamp the
wiring undershoot to a value that will not cause conduction of the IC’s internal diodes.
Fig 24. Wiring transients limited by a Schottky diode
002aaf066
time (ns)
2
0
4
6
voltage
(V)
−2
horizontal scale = 62.5 ns/div
receive
5 V
Rx
Tx
Sx
P82B96
send
300 Ω
5 V
2 meter
cable
5 V
300 Ω
GND
receive
Sx
Rx
Tx
5 V
send
1
/
2
BAT54A
P82B96_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 10 November 2009 23 of 32
NXP Semiconductors
P82B96
Dual bidirectional bus buffer
11. Package outline
Fig 25. Package outline SOT97-1 (DIP8)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT97-1
99-12-27
03-02-13
UNIT
A
max.
12
b
1
(1) (1)
(1)
b
2
cD E e M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
0.2542.54 7.62
8.25
7.80
10.0
8.3
1.154.2 0.51 3.2
inches
0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12
0.010.1 0.3
0.32
0.31
0.39
0.33
0.0450.17 0.02 0.13
b
2
050G01 MO-001 SC-504-8
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
P82B96_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 10 November 2009 24 of 32
NXP Semiconductors
P82B96
Dual bidirectional bus buffer
Fig 26. Package outline SOT96-1 (SO8)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
1.0
0.4
SOT96-1
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03 MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.05
0.244
0.228
0.028
0.024
0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
99-12-27
03-02-18
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P82B96TD/S900,118

Mfr. #:
Buy P82B96TD/S900,118
Manufacturer:
NXP Semiconductors
Description:
Interface - Signal Buffers, Repeaters Dual bidirectional Bus buffer
Lifecycle:
New from this manufacturer.
Delivery:
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