P82B96_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 10 November 2009 4 of 32
NXP Semiconductors
P82B96
Dual bidirectional bus buffer
7. Functional description
Refer to Figure 1 “Block diagram of P82B96”.
The P82B96 has two identical buffers allowing buffering of both of the I
2
C-bus (SDA and
SCL) signals. Each buffer is made up of two logic signal paths, a forward path from the
I
2
C-bus interface pin which drives the buffered bus, and a reverse signal path from the
buffered bus input to drive the I
2
C-bus interface. Thus these paths are:
sense the voltage state of the I
2
C-bus pin Sx (or Sy) and transmit this state to the pin
Tx (Ty respectively), and
sense the state of the pin Rx (Ry) and pull the I
2
C-bus pin LOW whenever Rx (Ry) is
LOW.
The rest of this discussion will address only the ‘x’ side of the buffer; the ‘y’ side is
identical.
The I
2
C-bus pin (Sx) is designed to interface with a normal I
2
C-bus.
The logic threshold voltage levels on the I
2
C-bus are independent of the IC supply V
CC
.
The maximum I
2
C-bus supply voltage is 15 V and the guaranteed static sink current is
3 mA.
The logic level of Rx is determined from the power supply voltage V
CC
of the chip. Logic
LOW is below 42 % of V
CC
, and logic HIGH is above 58 % of V
CC
(with a typical switching
threshold of half V
CC
).
Tx is an open-collector output without ESD protection diodes to V
CC
. It may be connected
via a pull-up resistor to a supply voltage in excess of V
CC
, as long as the 15 V rating is not
exceeded. It has a larger current sinking capability than a normal I
2
C-bus device, being
able to sink a static current of greater than 30 mA, and typical 100 mA dynamic pull-down
capability as well.
A logic LOW is only transmitted to Tx when the voltage at the I
2
C-bus pin (Sx) is below
0.6 V. A logic LOW at Rx will cause the I
2
C-bus (Sx) to be pulled to a logic LOW level in
accordance with I
2
C-bus requirements (maximum 1.5 V in 5 V applications) but not low
enough to be looped back to the Tx output and cause the buffer to latch LOW.
The minimum LOW level this chip can achieve on the I
2
C-bus by a LOW at Rx is typically
0.8 V.
If the supply voltage V
CC
fails, then neither the I
2
C-bus nor the Tx output will be held LOW.
Their open-collector configuration allows them to be pulled up to the rated maximum of
15 V even without V
CC
present. The input configuration on Sx and Rx also present no
loading of external signals even when V
CC
is not present.
The effective input capacitance of any signal pin, measured by its effect on bus rise times,
is less than 7 pF for all bus voltages and supply voltages including V
CC
=0V.
Remark: Two or more Sx or Sy I/Os must not be interconnected. The P82B96 design
does not support this configuration. Bidirectional I
2
C-bus signals do not allow any
direction control pin so, instead, slightly different logic low voltage levels are used at Sx/Sy
to avoid latching of this buffer. A ‘regular I
2
C-bus LOW’ applied at the Rx/Ry of a P82B96
will be propagated to Sx/Sy as a ‘buffered LOW’ with a slightly higher voltage level. If this
P82B96_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 10 November 2009 5 of 32
NXP Semiconductors
P82B96
Dual bidirectional bus buffer
special ‘buffered LOW’ is applied to the Sx/Sy of another P82B96 that second P82B96 will
not recognize it as a ‘regular I
2
C-bus LOW’ and will not propagate it to its Tx/Ty output.
The Sx/Sy side of P82B96 may not be connected to similar buffers that rely on special
logic thresholds for their operation, for example PCA9511, PCA9515, or PCA9518. The
Sx/Sy side is only intended for, and compatible with, the normal I
2
C-bus logic voltage
levels of I
2
C-bus master and slave chips, or even Tx/Rx signals of a second P82B96 if
required. The Tx/Rx and Ty/Ry I/O pins use the standard I
2
C-bus logic voltage levels of all
I
2
C-bus parts. There are no restrictions on the interconnection of the Tx/Rx and Ty/Ry I/O
pins to other P82B96s, for example in a star or multipoint configuration with the Tx/Rx and
Ty/Ry I/O pins on the common bus and the Sx/Sy side connected to the line card slave
devices. For more details see
Application Note AN255
.
8. Limiting values
[1] See also Section 10.2 “Negative undershoot below absolute minimum value”.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages with respect to pin GND.
Symbol Parameter Conditions Min Max Unit
V
CC
supply voltage V
CC
to GND 0.3 +18 V
V
Sx
voltage on pin Sx I
2
C-bus SDA or SCL 0.3 +18 V
V
Tx
voltage on pin Tx buffered output
[1]
0.3 +18 V
V
Rx
voltage on pin Rx receive input
[1]
0.3 +18 V
I
n
current on any pin - 250 mA
P
tot
total power dissipation - 300 mW
T
j
junction temperature operating range
P82B96TD/S900
40 +125 °C
T
stg
storage temperature 55 +125 °C
T
amb
ambient temperature operating 40 +85 °C
P82B96_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 10 November 2009 6 of 32
NXP Semiconductors
P82B96
Dual bidirectional bus buffer
9. Characteristics
Table 5. Characteristics
T
amb
= +25
°
C; voltages are specified with respect to GND with V
CC
= 5 V, unless otherwise specified.
Symbol Parameter Conditions T
amb
= +25 °C T
amb
= 40 °C to
+125 °C
[1]
Unit
Min Typ Max Min Max
Power supply
V
CC
supply voltage operating 2.0 - 15 2.0 15 V
I
CC
supply current buses HIGH - 0.9 1.8 - 3 mA
V
CC
=15V;
buses HIGH
- 1.1 2.5 - 4 mA
I
CC
additional quiescent
supply current
per Tx or Ty LOW - 1.7 3.5 - 3.5 mA
Bus pull-up (load) voltages and currents
V
Sx
, V
Sy
maximum input/output
voltage
open-collector;
I
2
C-bus and V
Rx
,V
Ry
=
HIGH
--15-15V
I
Sx
, I
Sy
static output loading on
I
2
C-bus
V
Sx
, V
Sy
= 1.0 V;
V
Rx
,V
Ry
=LOW
[2]
0.2 - 3 0.2 3 mA
I
Sx
, I
Sy
dynamic output sink
capability on I
2
C-bus
V
Sx
, V
Sy
=2V;
V
Rx
,V
Ry
=LOW
718- 7 -mA
I
Sx
, I
Sy
leakage current on
I
2
C-bus
V
Sx
, V
Sy
=5V;
V
Rx
,V
Ry
= HIGH
--1 -10µA
V
Sx
, V
Sy
=15V;
V
Rx
,V
Ry
= HIGH
-1- - 10µA
V
Tx
, V
Ty
maximumoutputvoltage
level
open-collector - - 15 - 15 V
I
Tx
, I
Ty
static output loading on
buffered bus
V
Tx
, V
Ty
= 0.4 V;
V
Sx
,V
Sy
= LOW on
I
2
C-bus = 0.4 V
- - 30 - 30 mA
I
Tx
, I
Ty
dynamic output sink
capability, buffered bus
V
Tx
, V
Ty
>1V;
V
Sx
,V
Sy
= LOW on
I
2
C-bus = 0.4 V
60 100 - 60 - mA
I
Tx
, I
Ty
leakage current on
buffered bus
V
Tx
, V
Ty
=V
CC
=15V;
V
Sx
, V
Sy
= HIGH
-1- - 10µA
Input currents
I
Sx
, I
Sy
input current from
I
2
C-bus
bus LOW;
V
Rx
,V
Ry
= HIGH
- 1- - 10 µA
I
Rx
, I
Ry
input current from
buffered bus
bus LOW;
V
Rx
,V
Ry
= 0.4 V
- 1- - 10 µA
I
Rx
, I
Ry
leakage current on
buffered bus input
V
Rx
, V
Ry
=V
CC
-1- - 10µA
Output logic LOW level
V
Sx
, V
Sy
output logic level LOW
on normal I
2
C-bus
I
Sx
, I
Sy
=3mA
[3]
0.8 0.88 1.0 (see Figure 6)V
I
Sx
, I
Sy
= 0.2 mA
[3]
670 730 790 (see Figure 5)mV
dV
Sx
/dT,
dV
Sy
/dT
temperature coefficient
of output LOW levels
I
Sx
, I
Sy
= 0.2 mA
[3]
- 1.8 - - - mV/K

P82B96TD/S900,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Interface - Signal Buffers, Repeaters Dual bidirectional Bus buffer
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