NXP Semiconductors
NHS3100
Temperature logger
NHS3100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.03 — 15 June 2018
28 / 45
8.15 Real-Time Clock (RTC) timer
8.15.1 Features
The Real-Time Clock (RTC) block contains two counters:
A countdown timer generating a wake-up signal when it expires
A continuous counter that counts seconds since power-up or the last system reset
The countdown timer runs on a low speed clock and runs in an always-on power domain.
The delay, as well as a clock tuning prescaler, can be configured via the APB bus. The
RTC countdown timer generates both the deep power-down wake-up signal and the RTC
interrupt signal (wake-up interrupt 12). The deep power-down wake-up signal is always
generated, while the interrupt can be masked according to the settings in the RTCIMSC
register.
8.15.2 General description
The RTC module consists of two parts:
The RTC core module, implementing the RTC timers themselves. This module runs in
the always-on VDD_ALON domain.
The AMBA APB slave interface. This module allows configuration of the RTC core via
an APB bus. This module runs in the switched power domain.
8.16 Temperature sensor
8.16.1 Features
The temperature sensor block measures the chip temperature and outputs a raw value or
a calibrated value in Kelvin.
8.16.2 General description
The temperature is measured using a high-precision, zoom-ADC. The analog part is able
to measure a highly temperature-dependent X = V
be
/ ΔV
be
1
. It determines the value of
X by first applying a coarse search (successive approximation), and then a sigma-delta
in a limited range. The conversion time depends on the resolution mode as shown in
Table 15.
Table 15. Conversion time for different resolution of TSENS
Resolution (bit) Resolution (°C) Conversion time (ms)
7 ±0.8 4
8 ±0.4 7
9 ±0.2 14
10 ±0.1 26
1 V
be
is the base-emitter voltage of a bipolar transistor. Basically, the temperature sensor measures the
voltage drop over a diode formed by the base-emitter junction of a bipolar transistor. It compares the V
be
at different current levels (from which follows the ΔV
be
).
NXP Semiconductors
NHS3100
Temperature logger
NHS3100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.03 — 15 June 2018
29 / 45
Resolution (bit) Resolution (°C) Conversion time (ms)
11 ±0.05 50
12 ±0.025 100
8.17 Serial Wire Debug (SWD)
The debug functions are integrated into the ARM Cortex-M0+. Serial Wire Debug (SWD)
functions are supported. The ARM Cortex-M0+ is configured to support up to four
breakpoints and two watchpoints.
Supports ARM SWD mode
Direct debug access to all memories, registers, and peripherals
No target resources are required for the debugging session
Four breakpoints
Four instruction breakpoints that can also be used to remap instruction addresses for
code patches. Two data comparators that can be used to remap addresses for patches
to literal values.
Two data watchpoints that can also be used as triggers
8.18 On-chip flash memory
The NHS3100 contains a 32 kB flash memory of which 30 kB can be used as program
and data memory.
The flash is organized in 32 sectors of 1 kB. Each sector consists of 16 rows of 16 × 32-
bit words.
8.18.1 Reading from flash
Reading is done via the AHB interface. The memory is mapped on the bus address
space as a contiguous address space. Memory data words are seen on the bus using a
little endian arrangement.
8.18.2 Writing to flash
Writing to flash means copying a word of data over the AHB to the page buffer of the
flash. It does not actually program the data in the memory array. This programming is
done by subsequent erase and program cycles.
NXP Semiconductors
NHS3100
Temperature logger
NHS3100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.03 — 15 June 2018
30 / 45
8.18.3 Erasing/programming flash
Erasing and programming are separate operations. Both are possible only on memory
sectors that are unprotected and unlocked. Protect/lock information is stored inside the
memory itself, so the controller is not aware of protection status. Therefore, if a program/
erase operation is performed on a protected or locked sector, it does not flag an error.
Protection
At exit from reset, all sectors are protected against accidental modification. To allow
modification, a sector must be unprotected. It can then be protected again after that the
modification is performed.
Locking
Each flash sector has a lock bit. Lock bits can be set but cannot be cleared. Locked
sectors cannot be erased and reprogramed.
8.19 On-chip SRAM
The NHS3100 contains a total of 8 kB on-chip SRAM memory configured as
256 × 2 × 4 × 32 bit.
8.20 On-chip EEPROM
The NHS3100 contains a 4 kB EEPROM. This EEPROM is organized in 64 rows of
32 × 16-bit words. Of these rows, the last four contain calibration and test data and are
locked. This data is either used by the boot loader after reset, or made accessible to the
application via firmware Application Programming Interface (API).
8.20.1 Reading from EEPROM
Reading is done via the AHB interface. The memory is mapped on the bus address
space, as a contiguous address space. Memory data words are seen on the bus using a
little endian arrangement.
8.20.2 Writing to EEPROM
Erasing and programming is performed, as a single operation, on one or more words
inside a single page.
Previous write operations have transferred the data to be programmed into the memory
page buffer. The page buffer tracks which words were written to (offset within the page
only). Words not written to, retain their previous content.

NHS3100/A1Z

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Board Mount Temperature Sensors NHS3100 Temperature Logger
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