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NHS3100/A1Z

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45
NXP Semiconductors
NHS3100
Temperature logger
NHS3100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.03 — 15 June 2018
37 / 45
SCK (CPOL = 0)
MOSI
MISO
t
cy(clk)
t
SU;DAT
t
HD;DAT
t
v(Q)
DATA VALID DATA VALID
t
h(Q)
SCK (CPOL = 1)
DATA VALID DATA VALID
MOSI
MISO
t
SU;DAT
t
HD;DAT
DATA VALID DATA VALID
t
h(Q)
DATA VALID
DATA VALID
t
v(Q)
CPHA = 1
CPHA = 0
aaa-024226
Figure 14. SPI master timing in SPI mode
SCK (CPOL = 0)
MOSI
MISO
t
cy(clk)
t
v(Q)
DATA VALID DATA VALID
t
h(Q)
SCK (CPOL = 1)
DATA VALID DATA VALID
MOSI
MISO
t
v(Q)
DATA VALID DATA VALID
t
h(Q)
DATA VALID DATA VALID
CPHA = 1
CPHA = 0
t
SU;DAT
t
HD;DAT
t
SU;DAT
t
HD;DAT
aaa-024227
Figure 15. SPI slave timing in SPI mode
NXP Semiconductors
NHS3100
Temperature logger
NHS3100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.03 — 15 June 2018
38 / 45
12 Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT616-3
MO-220
sot616-3_po
16-02-17
16-07-14
Unit
(1)
mm
max
nom
min
1 0.05 4.1 2.75 4.1
0.5 2.5
A
(1)
Dimensions (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm SOT616-3
A
1
b
0.30
c D
(1)
D
h
E
(1)
E
h
e e
1
e
2
2.5
L v
0.1
w y
0.2 0.10.05 0.05
y
1
0.32.450.00 3.9 2.45 3.90.18
0.52.75
e
0 2.5 5 mm
scale
A
A
1
c
detail X
yy
1 C
L
E
h
D
h
b
7 12
24 19
18
13
6
1
X
D
E
C
B A
terminal 1
index area
terminal 1
index area
AC
C
B
v
w
1/2 e
1/2 e
e
1
e
e
2
Figure 16. HVQFN24 package outline
NXP Semiconductors
NHS3100
Temperature logger
NHS3100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 6.03 — 15 June 2018
39 / 45
References
Outline
version
European
projection
Issue date
IEC JEDEC
- - -
JEITA
sot1401-1
sot1401-1_po
15-10-05
16-07-26
Unit
mm
max
nom
min
0.29 2.54 2.54
0.15 0.03
A
Dimensions (mm are the original dimensions)
WLCSP25: wafer level chip-scale package, 25 balls; 2.51 x 2.51 x 0.5 mm SOT1401-1
A
1
A
2
0.325
0.275
0.26 2.51 2.51 0.4
b D E e
1.6
e
1
1.6
e
2
v w
0.05
y
0.23 2.48 2.48
0.300
0.23
0.17
0.20
0.54
0.46
0.50
X
detail X
C
y
B
D
A
E
54321
A
A
A
2
A
1
e
e
2
e
b
AC
B
Ø v
CØ w
e
1
3 mm0
scale
B
C
D
E
ball A1
index area
ball A1
index area
Figure 17. WLCSP25 package outline
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45

NHS3100/A1Z

Mfr. #:
Buy NHS3100/A1Z
Manufacturer:
NXP Semiconductors
Description:
Board Mount Temperature Sensors NHS3100 Temperature Logger
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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