M24C64-FMB6TG Datasheet M24C64-FMB6TG | P37-P39

M24C64-DF, M24C64-W, M24C64-R, M24C64-F Package mechanical data

Doc ID 16891 Rev 26 37/44

Figure 19. WLCSP-R 5-bump wafer-length chip-scale package outline

1. Drawing is not to scale.

2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).

Table 23. WLCSP-R 5-bump wafer-length chip-scale package mechanical data

Symbol

millimeters inches

(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ Min Max Typ Min Max

A 0.545 0.490 0.600 0.0215 0.0193 0.0236

A1 0.190 0.0075

A2 0.355 0.0140

(2)

2. Dimension measured at the maximum bump diameter parallel to primary datum Z.

0.270 0.0106

D 0.959 1.074 0.0378 0.0423

E 1.073 1.168 0.0422 0.0460

e 0.693 0.0273

e1 0.400 0.0157

e2 0.3465 0.0136

F 0.280 0.0110

G 0.190 0.0075

N (number of terminals) 5 5

aaa 0.110 0.0043

eee 0.060 0.0024

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Part numbering M24C64-DF, M24C64-W, M24C64-R, M24C64-F

38/44 Doc ID 16891 Rev 26

9 Part numbering

For a list of available options (speed, package, etc.) or for further information on any aspect

of this device, please contact your nearest ST sales office.

Table 24. Ordering information scheme

Example: M24C64-D W MN 6 T P /P

Device type

M24 = I

C serial access EEPROM

Device function

C64 = 64 Kbit (8192 x 8)

Device family

Blank: Without Identification page

-D: With additional Identification page

Operating voltage

W = V

= 2.5 V to 5.5 V

R = V

= 1.8 V to 5.5 V

F = V

= 1.7 V to 5.5 V

Package

BN = PDIP8

(1)

1. ECOPACK1

(RoHS-compliant).

MN = SO8 (150 mil width)

(2)

2. ECOPACK2

(RoHS-compliant and halogen-free).

DW = TSSOP8 (169 mil width)

(2)

MB or MC = UFDFPN8 (MLP8)

CS = WLCSP-R

Device grade

6 = Industrial: device tested with standard test flow over –40 to 85 °C

5 = Consumer: device tested with standard test flow over –20 to 85°C

3 = Device tested with high reliability certified flow

(3)

automotive

temperature range (-40 to 125 °C)

3. ST strongly recommends the use of Automotive Grade devices for use in an automotive environment. The

high reliability certified flow (HRCF) is described in the quality note QNEE9801. Please ask your nearest

ST sales office for a copy.

Option

blank = standard packing

T = Tape and reel packing

Plating technology

P or G = ECOPACK

(RoHS compliant)

Process

(4)

4. Process letter is used only for device grade 3 and WLCSP packages.

P = F6DP26% Chartered

K = F8H process

M24C64-DF, M24C64-W, M24C64-R, M24C64-F Revision history

Doc ID 16891 Rev 26 39/44

10 Revision history

Table 25. Document revision history

Date Revision Changes

22-Dec-1999 2.3

TSSOP8 package in place of TSSOP14 (pp 1, 2, OrderingInfo,

PackageMechData).

28-Jun-2000 2.4 TSSOP8 package data corrected

31-Oct-2000 2.5

References to Temperature Range 3 removed from Ordering Information

Voltage range -S added, and range -R removed from text and tables

throughout.

20-Apr-2001 2.6

Lead Soldering Temperature in the Absolute Maximum Ratings table

amended

Write Cycle Polling Flow Chart using ACK illustration updated

References to PSDIP changed to PDIP and Package Mechanical data

updated

16-Jan-2002 2.7

Test condition for I

made more precise, and value of I

for E2-E0 and

WC added

-R voltage range added

02-Aug-2002 2.8

Document reformatted using new template.

TSSOP8 (3x3mm² body size) package (MSOP8) added.

5ms write time offered for 5V and 2.5V devices

04-Feb-2003 2.9 SO8W package removed. -S voltage range removed

27-May-2003 2.10 TSSOP8 (3x3mm² body size) package (MSOP8) removed

22-Oct-2003 3.0

Table of contents, and Pb-free options added. Minor wording changes in

Summary Description, Power-On Reset, Memory Addressing, Write

Operations, Read Operations. V

(min) improved to -0.45V.

01-Jun-2004 4.0

Absolute Maximum Ratings for V

(min) and V

(min) improved.

Soldering temperature information clarified for RoHS compliant devices.

Device Grade clarified

04-Nov-2004 5.0

Product List summary table added. Device Grade 3 added. 4.5-5.5V

range is Not for New Design. Some minor wording changes. AEC-Q100-

002 compliance. t

(max) changed. V

(min) is the same on all input

pins of the device. Z

WCL

changed.

05-Jan-2005 6.0 UFDFPN8 package added. Small text changes.

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P21 P22-P24 P25-P27 P28-P30 P31-P33 P34-P36 P37-P39 P40-P42 P43-P44

M24C64-FMB6TG

Mfr. #:

Buy M24C64-FMB6TG

Manufacturer:

STMicroelectronics

Description:

EEPROM 128 Kbit 64 Kbit 1.7 V to 5.5 V

Lifecycle:

New from this manufacturer.

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M24C64-FMB6TG