LTC4268-1
40
42681fc
The output capacitor should have an RMS current rating
greater than:
I
RMS(SEC)
=I
OUT
DC
MAX
1DC
MAX
Continuing the example:
I
RMS(SEC)
= 5.3A
49.4%
1 49.4%
= 5.24A
This is calculated for each output in a multiple winding
application.
ESR and ESL along with bulk capacitance directly affect the
output voltage ripple. The waveforms for a typical flyback
converter are illustrated in Figure 19.
The maximum acceptable ripple voltage (expressed as a
percentage of the output voltage) is used to establish a
starting point for the capacitor values. For the purpose
of simplicity we will choose 2% for the maximum output
ripple, divided equally between the ESR step and the
charging/discharging DV. This percentage ripple changes,
depending on the requirements of the application. You
can modify the equations below. For a 1% contribution
applicaTions inForMaTion
to the total ripple voltage, the ESR of the output capacitor
is determined by:
ESR
COUT
1%
V
OUT
1DC
MAX
( )
I
OUT
The other 1% is due to the bulk C component, so use:
C
OUT
I
OUT
1% V
OUT
f
OSC
In many applications the output capacitor is created from
multiple capacitors to achieve desired voltage ripple,
reliability and cost goals. For example, a low ESR ceramic
capacitor can minimize the ESR step, while an electrolytic
capacitor satisfies the required bulk C.
Continuing our example, the output capacitor needs:
ESR
COUT
1%
5V 1 49.4%
( )
5.3A
= 4m
W
C
OUT
5.3A
1% 5 200kHz
= 600µF
These electrical characteristics require paralleling several
low ESR capacitors possibly of mixed type.
OUTPUT VOLTAGE
RIPPLE WAVEFORM
SECONDARY
CURRENT
PRIMARY
CURRENT
I
PRI
∆V
COUT
42681 F19
RINGING
DUE TO ESL
I
PRI
N
∆V
ESR
Figure 19. Typical Flyback Converter Waveforms
42681fc
LTC4268-1
41
Most capacitor ripple current ratings are based on 2000
hour life. This makes it advisable to derate the capacitor
or to choose a capacitor rated at a higher temperature
than required.
One way to reduce cost and improve output ripple is to use
a simple LC filter. Figure 20 shows an example of the filter.
The design of the filter is beyond the scope of this data
sheet. However, as a starting point, use these general
guidelines. Start with a C
OUT
1/4 the size of the nonfilter
solution. Make C1 1/4 of C
OUT
to make the second filter
pole independent of C
OUT
. C1 may be best implemented
with multiple ceramic capacitors. Make L1 smaller than
the output inductance of the transformer. In general, a
0.1µH filter inductor is sufficient. Add a small ceramic
capacitor (C
OUT2
) for high frequency noise on V
OUT
. For
those interested in more details refer toSecond-Stage
LC Filter Design,” Ridley, Switching Power Magazine, July
2000 p8-10.
Circuit simulation is a way to optimize output capacitance
and filters, just make sure to include the component
parasitic. LT C SwitcherCAD
®
is a terrific free circuit
simulation tool that is available at www.linear.com. Final
optimization of output ripple
must be done on a dedicated
PC
board. Parasitic inductance due to poor layout can
significantly impact ripple. Refer to the PC Board Layout
section for more details.
ISOLATION
The 802.3 standard requires Ethernet ports to be electrically
isolated from all other conductors that are user accessible.
This includes the metal chassis, other connectors and
any auxiliary power connection. For PDs, there are two
common methods to meet the isolation requirement. If
there will be any user accessible connection to the PD,
then an isolated DC/DC converter is necessary to meet
the isolation requirements. If user connections can be
avoided, then it is possible to meet the safety requirement
by completely enclosing the PD in an insulated housing.
In all PD applications, there should be no user accessible
electrical connections to the LTC4268-1 or support circuitry
other than the RJ-45 port.
LAYOUT CONSIDERATIONS FOR THE LTC4268-1
The LTC4268-1’s PD front end is relatively immune to
layout problems. Place C14 (Figure 9) as close as physically
possible to the LTC4268-1. Place the series 10Ω resistor
close to C14. Excessive parasitic capacitance on the R
CLASS
pin should be avoided. Include a PCB heat sink to which
the exposed pad on the
bottom of the package can be
soldered.
This heat sink should be electrically connected
to GND. For optimum thermal performance, make the
heat sink as large as possible. Voltages in a PD can be
as large as –57V for PoE applications, so high voltage
layout techniques should be employed. The SHDN pin
should be separated from other high voltage pins, like
V
PORTP
, V
OUT
, to avoid the possibility of leakage shutting
down the LTC4268-1. If not used, tie SHDN to V
PORTN
.
The load capacitor connected between V
PORTP
and V
OUT
of the LTC4268-1 can store significant energy when fully
charged. The design of a PD must ensure that this energy
is not inadvertently dissipated in the LTC4268-1. The
polarity-protection diodes prevent an accidental short
on the cable from causing damage. However if, V
PORTN
is shorted to V
PORTP
inside the PD while capacitor C1
is charged, current will flow through the parasitic body
diode of the internal MOSFET and may cause permanent
damage to the LTC4268-1.
R
LOAD
C
OUT2
F
V
OUT
C
OUT
470µF
C1
47µF
×3
FROM
SECONDARY
WINDING
L1
0.1µH
42681 F20
++
Figure 20. LC Filter
applicaTions inForMaTion
LTC4268-1
42
42681fc
In order to minimize switching noise and improve output
load regulation, connect the GND pin of the LTC4268-1
directly to the ground terminal of the V
CC
decoupling
capacitor, the bottom terminal of the current sense resistor
and the ground terminal of the input capacitor, using a
ground plane with multiple vias. Place the V
CC
capacitor
immediately adjacent to the V
CC
and GND pins on the IC
package. This capacitor carries high di/dt MOSFET gate
drive currents. Use a low ESR ceramic capacitor. Take care
in PCB layout to keep the traces that conduct high switching
currents short, wide and with minimal overall loop area.
These are typically the traces associated with the switches.
This reduces the parasitic inductance and also minimizes
magnetic field radiation. Figure 21 outlines the critical paths.
Keep electric field radiation low by minimizing the length
and area of traces (keep stray capacitances low). The drain
of the primary side MOSFET is the worst offender in this
category. Always use a ground plane under the switcher
circuitry to prevent coupling between PCB planes. Check
that the maximum BV
DSS
ratings of the MOSFETs are not
exceeded due to inductive ringing. This is done by viewing
the MOSFET node voltages with an oscilloscope. If it is
breaking
down either choose a higher voltage device, add
a snubber or specify an avalanche-rated MOSFET.
Place the small-signal components away from high
frequency switching nodes. This allows the use of a pseudo-
Kelvin connection for the signal ground, where high di/
dt gate driver currents flow out of the IC ground pin in
one direction (to the bottom plate of the V
CC
decoupling
capacitor) and small-signal currents flow in the other
direction. Keep the trace from the feedback divider tap
to the FB pin short to preclude inadvertent pickup. For
applications with multiple switching power converters
connected to the same input supply, make sure that the
input filter capacitor for the LTC4268-1 is not shared with
other converters. AC input current from another converter
could cause substantial input voltage ripple and this could
interfere with the LTC4268-1 operation. A few inches of PC
trace or wire (L @100nH) between the C
IN
of the LTC4268-1
and the actual source V
IN
is sufficient to prevent current
sharing problems.
T2
T1
C
R
C
VIN
MS
MP
GATE
TURN-ON
GATE
TURN-ON
R
SENSE
C
VCC
SG
V
CC
PG
V
CC
V
CC
V
CC
V
IN
GATE
TURN-OFF
GATE
TURN-OFF
Q4
Q3
C
OUT
42681 F21
OUT
+
+
+
Figure 21. Layout Critical High Current Paths
applicaTions inForMaTion

LTC4268IDKD-1#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Power Switch ICs - POE / LAN EEE 802.3af High Power PD with Synchronous NoOpto Flyback Controller
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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