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PACKAGE DIMENSIONS
E
E
Package Center=Die Center(0,0)
Top View (Image side)
Bottom View (BGA side)
Unit:um
Package Size:6278.15*6648.15
Ball diameter:250
Ball pitch:650
A
B
C
D
E
F
G
H
8
7
65
4
3
21
C4
C
C3
C2
C1
Crosssection View (EE)
Notch
A
B
Optical center(290,230)
A
B
C
D
E
F
G
H
8
7
65
4
3
21
Package Center=Die Center(0,0)
Optical center(290,230)
First clear pixel(1987.5,2776.5)
Last clear pixel(1407.5,2316.5)
S2J2
J1S1
ODCSP64
CASE 570BH
ISSUE O
Table 43. CSP (MIPI/HISPI) PACKAGE DIMENSIONS
Parameter
Symbol
Nom Min Max Nom Min Max
Millimeters Inches
Package Body Dimension X A 6.278 6.253 6.303 0.247 0.246 0.248
Package Body Dimension Y B 6.648 6.623 6.673 0.262 0.261 0.263
Package Height C 0.700 0.645 0.745 0.028 0.025 0.029
Cavity Height (Glass to Pixel Distance) C4 0.041 0.037 0.045 0.002 0.001 0.002
Glass Thickness C3 0.400 0.390 0.410 0.016 0.015 0.016
Package Body Thickness C2 0.570 0.535 0.605 0.022 0.021 0.024
Ball Height C1 0.130 0.100 0.160 0.005 0.004 0.006
Ball Diameter D 0.250 0.220 0.280 0.010 0.009 0.011
Total Ball Count N 64
Ball Count X Axis N1 8
Ball Count Y Axis N2 8
UBM U 0.280 0.270 0.290 0.011 0.011 0.011
Pins Pitch X Axis J1 0.650 0.026
Pins Pitch Y Axis J2 0.650 0.026
BGA Ball Center to Package Center Offset in X-direction X 0.000 0.025 0.025 0.000 0.001 0.001
BGA Ball Center to Package Center Offset in Y-direction Y 0.000 0.025 0.025 0.000 0.001 0.001
BGA Ball Center to Chip Center Offset in X-direction X1 0.000 0.014 0.014 0.000 0.001 0.001
BGA Ball Center to Chip Center Offset in Y-direction Y1 0.000 0.014 0.014 0.000 0.001 0.001
Edge to Ball Center Distance along X S1 0.864 0.834 0.894 0.034 0.033 0.035
Edge to Ball Center Distance along Y S2 1.049 1.019 1.079 0.041 0.040 0.042
AR0330CM
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53
PACKAGE ORIENTATION IN CAMERA DESIGN
In a camera design, the package should be placed in a PCB
so that the first clear pixel is located at the bottom left of the
package (look at the package). This orientation will ensure
that the image captured using a lens will be oriented
correctly.
Figure 52. Image Orientation with Relation to Camera Lens
Lens
The package is oriented so
that the first clear pixel is
located in bottom left.
The package pin locations after the sensor has been
oriented correctly can be shown below.
Figure 53. First Clear Pixel and Pin Location
(Looking Down on Cover Glass)
1−−−−−−−−−−−−8
(2304,1536)
First Clear
(0,0)
A −−−−−−−−−−−−−−−H
Pixel Array
(0,0)
(2304,1536)
CSP Package CLCC Package
1
48
Pin Orientation
Pixel
First Clear
Pixel
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