GS1531 Data Sheet
30573 - 7 February 2008 16 of 50
2.4 Solder Reflow Profiles
The GS1531 is available in a Pb or Pb-free package. It is recommended that the
Pb package be soldered with Pb paste using the Standard Eutectic profile shown
in Figure 2-1, and the Pb-free package be soldered with Pb-free paste using the
reflow profile shown in Figure 2-2.
NOTE: It is possible to solder a Pb-free package with Pb paste using a Standard
Eutectic profile with a reflow temperature maintained at 245
o
C – 250
o
C.
Figure 2-1: Standard Eutectic Solder Reflow Profile (Pb package, Pb paste)
Figure 2-2: Maximum Pb-free Solder Reflow Profile (Pb-free package, Pb-free
paste)
25˚C
100˚C
150˚C
183˚C
230˚C
220˚C
Time
Temperature
6 min. max
120 sec. max
60-150 sec.
10-20 sec.
3˚C/sec max
6˚C/sec max
25˚C
150˚C
200˚C
217˚C
260˚C
250˚C
Time
Temperature
8 min. max
60-180 sec. max
60-150 sec.
20-40 sec.
3˚C/sec max
6˚C/sec max
