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LPC1225FBD48/321,1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
P52-P54
P55-P57
P58-P60
P61-P61
LPC122X
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
. 201
1. All rights reserved.
Product data sheet
Rev
. 2 — 26 August 2011
43 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcon
troller
(1)
Example of an actual transfer cur
ve.
(2)
The ide
al transfer curve.
(3)
Differential linearity error (E
D
).
(4)
Integral non-lin
earity (E
L(adj)
).
(5)
Center of a step of
the actual transfer curve.
Fig 19.
ADC char
acteristics
002aae787
1023
1022
1021
1020
1019
(2)
(1)
1024
1018
1019
1020
1021
1022
1023
7
123456
7
6
5
4
3
2
1
0
1018
(5)
(4)
(3)
1 LSB
(ideal)
code
out
V
DD(3V3)
−
V
SS
1024
offset
error
E
O
gain
error
E
G
offset error
E
O
V
IA
(LSB
ideal
)
1 LSB =
LPC122X
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
. 201
1. All rights reserved.
Product data sheet
Rev
. 2 — 26 August 2011
44 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcon
troller
10.5
BOD st
atic characteristics
[1]
Inter
rupt levels are selected by writing the level value to the BOD control register BODCTRL, see
LPC122x
user manual
.
T
able 10.
BOD st
atic characteristics
[1]
T
amb
=2
5
C.
Symbol
Parameter
Conditi
ons
Min
Ty
p
Max
Unit
V
th
threshold voltage
interrupt level 1
assertion
-
2.25
-
V
de-assertion
-
2.39
-
V
interrupt le
vel 2
assertion
-
2.54
-
V
de-assertion
-
2.67
-
V
interrupt le
vel 3
assertion
-
2.83
-
V
de-assertion
-
2.93
-
V
reset level 1
assertion
-
2.04
-
V
de-assertion
-
2.18
-
V
reset level 2
assertion
-
2.34
-
V
de-assertion
-
2.47
-
V
reset level 3
assertion
-
2.62
-
V
de-assertion
-
2.76
-
V
LPC122X
All information pr
ovided in this d
ocument is su
bject to legal
disclaimers.
© NXP B.V
. 201
1. All rights reserved.
Product data sheet
Rev
. 2 — 26 August 2011
45 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcon
troller
1
1. Dynamic
characteristics
1
1.1
Power-up ramp conditions
[1]
S
ee
Figure 20
.
[2]
The
wait time specifies the time the power supply must be at levels below 400 mV before r
amping up.
T
able 1
1.
Power-u
p characteristics
T
amb
=
40
C to +85
C.
Symbol
Parameter
Conditions
Min
Ty
p
Max
Unit
t
r
rise time
at t = t
1
: 0 < V
I
400 mV
[1]
0-
5
0
0
m
s
t
wait
wait time
[1][2]
12
-
-
s
V
I
input voltage
at t = t
1
on pin V
DD
0
-
400 mV
Condition: 0 < V
I
400 mV at start of power-up (t = t
1
)
Fig 20.
Power-up
ramp
V
DD
0
400 mV
t
r
t
wait
t = t
1
002aag001
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P30
P31-P33
P34-P36
P37-P39
P40-P42
P43-P45
P46-P48
P49-P51
P52-P54
P55-P57
P58-P60
P61-P61
LPC1225FBD48/321,1
Mfr. #:
Buy LPC1225FBD48/321,1
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU CORTEX M0 80K FL 8K DMA CRC ADC COMPARTR
Lifecycle:
New from this manufacturer.
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