LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 46 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
11.2 Flash memory
[1] Erase and programming times are valid over the lifetime of the device (minimum 20000 cycles).
[2] Number of program/erase cycles.
11.3 External clock
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
Table 12. Dynamic characteristic: flash memory
T
amb
=
40
C to +85
C; V
DD(3V3)
over specified ranges.
Symbol Parameter Conditions Min Max Unit
t
er
erase time for one page (512 byte)
[1]
-20ms
for one sector (4 kB)
[1]
162 ms
for all sectors; mass
erase
[1]
-20ms
t
prog
programming
time
one word (4 bytes)
[1]
-49s
four sequential words
[1]
-194s
128 bytes (one row of 32
words)
[1]
-765s
N
endu
endurance
[2]
20000 - cycles
t
ret
retention time 10 - years
Table 13. Dynamic characteristic: external clock
T
amb
=
40
C to +85
C; V
DD(3V3)
over specified ranges.
[1]
Symbol Parameter Conditions Min Typ
[2]
Max Unit
f
osc
oscillator frequency 1 - 25 MHz
T
cy(clk)
clock cycle time 40 - 1000 ns
t
CHCX
clock HIGH time T
cy(clk)
0.4--ns
t
CLCX
clock LOW time T
cy(clk)
0.4--ns
t
CLCH
clock rise time - - 5 ns
t
CHCL
clock fall time - - 5 ns
Fig 21. External clock timing (with an amplitude of at least V
i(RMS)
= 200 mV)
t
CHCL
t
CLCX
t
CHCX
T
cy(clk)
t
CLCH
002aaa907
LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 47 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
11.4 Internal oscillators
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at nominal supply voltages.
[1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
[2] The typical frequency spread over processing and temperature (T
amb
= 40 C to +85 C) is 40 %.
[3] See the LPC122x user manual.
Table 14. Dynamic characteristic: internal oscillators
T
amb
=
40
C to +85
C; V
DD(3V3)
over specified ranges.
[1]
Symbol Parameter Conditions Min Typ
[2]
Max Unit
f
osc(RC)
internal RC oscillator frequency - 11.88 12 12.12 MHz
Fig 22. Internal RC oscillator frequency versus temperature
Table 15. Dynamic characteristics: Watchdog oscillator
Symbol Parameter Conditions Min Typ
[1]
Max Unit
f
osc(int)
internal oscillator
frequency
DIVSEL = 0x1F, FREQSEL = 0x1
in the WDTOSCCTRL register;
[2][3]
-7.8 - kHz
DIVSEL = 0x00, FREQSEL = 0xF
in the WDTOSCCTRL register
[2][3]
- 1700 - kHz
002aag020
11.95
12.05
12.15
f
osc(RC)
(MHz)
11.85
temperature (°C)
40 853510 6015
VDD = 3.6 V
3.3 V
3.0 V
12 MHz + 1%
12 MHz 1%
LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 48 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
11.5 I
2
C-bus
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge.
[3] A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the V
IH
(min) of the SCL signal) to
bridge the undefined region of the falling edge of SCL.
[4] C
b
= total capacitance of one bus line in pF. If mixed with Hs-mode devices, faster fall times are allowed.
[5] The maximum t
f
for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage t
f
is specified at
250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines
without exceeding the maximum specified t
f
.
[6] In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should
allow for this when considering bus timing.
[7] The maximum t
HD;DAT
could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of t
VD;DAT
or
t
VD;ACK
by a transition time. This maximum must only be met if the device does not stretch the LOW period (t
LOW
) of the SCL signal. If
the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.
[8] tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the
acknowledge.
[9] A Fast-mode I
2
C-bus device can be used in a Standard-mode I
2
C-bus system but the requirement t
SU;DAT
= 250 ns must then be met.
This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the
LOW period of the SCL signal, it must output the next data bit to the SDA line t
r(max)
+ t
SU;DAT
= 1000 + 250 = 1250 ns (according to the
Standard-mode I
2
C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
Table 16. Dynamic characteristic: I
2
C-bus pins
T
amb
=
40
C to +85
C.
[1]
Symbol Parameter Conditions Min Max Unit
f
SCL
SCL clock frequency Standard-mode 0 100 kHz
Fast-mode 0 400 kHz
Fast-mode Plus 0 1 MHz
t
f
fall time
[3][4][5][6]
of both SDA and
SCL signals
Standard-mode
-300ns
Fast-mode 20 + 0.1 C
b
300 ns
Fast-mode Plus - 120 ns
t
LOW
LOW period of the SCL clock Standard-mode 4.7 - s
Fast-mode 1.3 - s
Fast-mode Plus 0.5 - s
t
HIGH
HIGH period of the SCL clock Standard-mode 4.0 - s
Fast-mode 0.6 - s
Fast-mode Plus 0.26 - s
t
HD;DAT
data hold time
[2][3][7]
Standard-mode 0 - s
Fast-mode 0 - s
Fast-mode Plus 0 - s
t
SU;DAT
data set-up time
[8][9]
Standard-mode 250 - ns
Fast-mode 100 - ns
Fast-mode Plus 50 - ns

LPC1225FBD48/321,1

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU CORTEX M0 80K FL 8K DMA CRC ADC COMPARTR
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