LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 55 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
Fig 28. Reflow soldering of the LQFP64 package
SOT314-2
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP64 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx Hy
13.300 13.300 10.300 10.300
P1
0.500
P2
0.560 0.280
C
1.500 0.400 10.500 10.500 13.550 13.550
sot314-2_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 56 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
15. Abbreviations
Table 18. Abbreviations
Acronym Description
ADC Analog-to-Digital-Converter
AHB Advanced High-performance Bus
APB Advanced Peripheral Bus
BOD BrownOut Detection
CCITT Comité Consultatif International Téléphonique et Télégraphique
CRC Cyclic Redundancy Check
DMA Direct Memory Access
FIFO First-In-First-Out
GPIO General Purpose Input/Output
I/O Input/Output
IrDA Infrared Data Association
IRC Internal Resistor-Capacitor
JEDEC Joint Electron Devices Engineering Council
PLL Phase-Locked Loop
SPI Serial Peripheral Interface
SSI Serial Synchronous Interface
SSP Synchronous Serial Port
UART Universal Asynchronous Receiver/Transmitter
LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 57 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
16. Revision history
Table 19. Revision history
Document ID Release date Data sheet status Change notice Supersedes
LPC122X v.2 20110826 Product data sheet - LPC122X v.1.2
Modifications:
Power consumption data updated in Table 7.
Power consumption graphs added in Section 10.2.
Electrical pin characteristics updated for all pins in Table 7 and Section 10.3.
Parameter R
i
added to Table 9.
EMC data added (Section 12.3).
Parameter V
I
updated for I
2
C-bus pins in Table 5.
Section 11.1 “Power-up ramp conditions added.
Data sheet status updated to Product Data Sheet.
SSP dynamic characteristics removed.
LPC122X v.1.2 20110329 Objective data sheet - LPC122X v.1.1
Modifications:
Figure 2 “Pin configuration LQFP64 package”: Pin RTCXIN changed to 58 and pin
RTCXOUT changed to 57.
Table 3 “LPC122x pin description”: In column Pin LQFP64, pin RTCXIN changed to 58
and pin RTCXOUT changed to 57.
LPC122X v.1.1 20110221 Objective data sheet - LPC122X v.1
Modifications:
Section 1 “General description”: Updated text.
Section 2 “Features and benefits”: Updated text.
LPC122X v.1 20110214 Objective data sheet - -

LPC1225FBD48/321,1

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU CORTEX M0 80K FL 8K DMA CRC ADC COMPARTR
Lifecycle:
New from this manufacturer.
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