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LPC1225FBD48/321,1

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P61
LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 52 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
13. Package outline
Fig 25. Package outline SOT314-2 (LQFP64)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
0.5
12.15
11.85
1.45
1.05
7
0
o
o
0.12 0.11 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT314-2 MS-026136E10
00-01-19
03-02-25
D
(1) (1)(1)
10.1
9.9
H
D
12.15
11.85
E
Z
1.45
1.05
D
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
16
c
D
H
b
p
E
H
A
2
v M
B
D
Z
D
A
Z
E
e
v M
A
X
1
64
49
48 33
32
17
y
pin 1 index
w M
w M
0 2.5 5 mm
scale
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 53 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
Fig 26. Package outline SOT313-2 (LQFP48)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.95
0.55
7
0
o
o
0.12 0.10.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 MS-026136E05
00-01-19
03-02-25
D
(1) (1)(1)
7.1
6.9
H
D
9.15
8.85
E
Z
0.95
0.55
D
b
p
e
E
B
12
D
H
b
p
E
H
v M
B
D
Z
D
A
Z
E
e
v M
A
1
48
37
36
25
24
13
θ
A
1
A
L
p
detail X
L
(A )
3
A
2
X
y
c
w M
w M
0 2.5 5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
LPC122X All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 26 August 2011 54 of 61
NXP Semiconductors
LPC122x
32-bit ARM Cortex-M0 microcontroller
14. Soldering
Fig 27. Reflow soldering of the LQFP48 package
SOT313-2
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP48 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1
D2 (8×)
D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx Hy
10.350
P2
0.560 10.350 7.350 7.350
P1
0.500 0.280
C
1.500 0.500 7.500 7.500 10.650 10.650
sot313-2_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
P2
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P61

LPC1225FBD48/321,1

Mfr. #:
Buy LPC1225FBD48/321,1
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU CORTEX M0 80K FL 8K DMA CRC ADC COMPARTR
Lifecycle:
New from this manufacturer.
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