NCN49599
www.onsemi.com
35
PACKAGE DIMENSIONS
QFN56 8x8, 0.5P
CASE 485CN
ISSUE O
SEATING
0.15 C
(A3)
A
A1
b
1
56
56X
L
56X
BOTTOM VIEW
TOP VIEW
SIDE VIEW
D
A B
E
0.15
C
PIN ONE
LOCATION
0.10 C
0.08 C
C
e
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25mm FROM THE TERMINAL TIP
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 8.00 BSC
D2 6.50 6.70
E 8.00 BSC
6.70E2 6.50
e 0.50 BSC
L 0.30 0.50
K 0.20 −−−
PLANE
MOUNTING FOOTPRINT*
L1 0.05 0.15
NOTE 4
e/2
E2
D2
NOTE 3
DETAIL B
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
DETAIL A
K
DIMENSIONS: MILLIMETERS
8.30
6.74
6.74
0.50
0.60
0.32
56X
56X
PITCH
8.30
PKG
OUTLINE
1
RECOMMENDED
A
M
0.10 BC
M
0.05 C
A
M
0.10 BC
A
M
0.10 BC
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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