NCP1855
www.onsemi.com
26
PACKAGE DIMENSIONS
25 Pin Flip−Chip, 2.55x2.20
CASE 499BN
ISSUE A
SEATING
PLANE
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
−−−
MILLIMETERS
A1
D 2.55 BSC
E
b 0.24 0.29
e 0.40 BSC
0.60
D
E
A
B
PIN A1
REFERENCE
e
A0.05 BC
0.03
C
0.05 C
25X
b
45
C
B
A
0.10 C
A
A1
A2
C
0.17 0.23
2.20 BSC
0.25
25X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.40
0.10 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
A3 0.04 REF
RECOMMENDED
PACKAGE
OUTLINE
123
PITCH
D
E
PITCH
A1
DETAIL A
A3
DETAIL A
A2
A2 0.36 REF
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